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    Semiconductor devices
    22.
    发明授权
    Semiconductor devices 有权

    公开(公告)号：US11217695B2

    公开(公告)日：2022-01-04

    申请号：US16815744

    申请日：2020-03-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanghoon Lee ,  Krishna Bhuwalka ,  Myunggil Kang ,  Kyoungmin Choi

    IPC: H01L29/786 ,  H01L29/423 ,  H01L27/088 ,  H01L29/78 ,  H01L29/06 ,  H01L29/10 ,  H01L21/8234

    Abstract: Semiconductor devices are provided. A semiconductor device includes a fin structure having a plurality of first semiconductor patterns and a plurality of second semiconductor patterns alternately stacked on a substrate, and extending in a first direction. The semiconductor device includes a semiconductor cap layer on an upper surface of the fin structure, and extending along opposite side surfaces of the fin structure in a second direction crossing the first direction. The semiconductor device includes a gate electrode on the semiconductor cap layer, and extending in the second direction. The semiconductor device includes a gate insulating film between the semiconductor cap layer and the gate electrode. Moreover, the semiconductor device includes a source/drain region connected to the fin structure. The plurality of first semiconductor patterns include silicon germanium (SiGe) having a germanium (Ge) content in a range of 25% to 35%, and the plurality of second semiconductor patterns include silicon (Si).

    ELECTRONIC DEVICE AND METHOD FOR SPOKEN INTERACTION THEREOF
    26.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR SPOKEN INTERACTION THEREOF 审中-公开
    电子装置及其与其相互作用的方法

    公开(公告)号：US20160104484A1

    公开(公告)日：2016-04-14

    申请号：US14883489

    申请日：2015-10-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Subhojit Chakladar ,  Sanghoon Lee

    IPC: G10L15/26 ,  G06F17/27

    CPC classification number: G10L15/26 ,  G06F17/2775 ,  G06F17/2785 ,  G10L15/22

    Abstract: A method of operating an electronic device is provided, the method including: receiving, by the electronic device that includes a display and a voice receiving device, a sequence of speech elements through the voice receiving device; displaying, on the display by the electronic device, first information that is based on at least a part of a first speech element out of the speech elements; and displaying, on the display by the electronic device, second information, which is different than the first information and is based on at least a part of a second speech element that is received later than the first speech element among the speech elements.

    Abstract translation: 提供了一种操作电子设备的方法，所述方法包括：通过包括显示器和语音接收设备的电子设备通过语音接收设备接收语音元素序列; 在所述电子设备的显示器上显示基于所述语音元素中的第一语音元素的至少一部分的第一信息; 并且在所述电子设备的显示器上显示与所述第一信息不同的第二信息，并且基于在所述语音元素中比所述第一语音元素晚的接收的第二语音元素的至少一部分。

    Semiconductor package
    27.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US12218102B2

    公开(公告)日：2025-02-04

    申请号：US17728727

    申请日：2022-04-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngkun Jee ,  Unbyoung Kang ,  Sanghoon Lee ,  Chungsun Lee

    IPC: H01L25/065 ,  H01L23/00 ,  H01L23/48

    Abstract: A semiconductor package includes a first semiconductor chip including a first semiconductor substrate, and a plurality of first through electrodes penetrating at least a portion of the first semiconductor substrate. A plurality of second semiconductors include a second semiconductor substrate, the plurality of second semiconductor chips being stacked on the first semiconductor chip. A plurality of bonding pads are arranged between the first semiconductor chip and the plurality of second semiconductor chips. A chip bonding insulating layer is arranged between the first semiconductor chip and the plurality of second semiconductor chips. At least one supporting dummy substrate is stacked on the plurality of second semiconductor chips and having a support bonding insulating layer arranged on a lower surface thereof.

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