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公开(公告)号：USD732070S1
公开(公告)日：2015-06-16
申请号：US29459718
申请日：2013-07-02
Applicant: Samsung Electronics Co., Ltd.
Designer： Jang-Won Seo , Yong-Hwan Kwon , Ji-Eun Kim , Ji-Hong Kim , Hye-Ryung Kim , Se-Ran Jeon , Woo-Seok Hwang
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22.发明授权Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure 有权具有凹面侧面的凹凸结构，具有凸块结构的半导体封装以及形成凸块结构的方法公开(公告)号：US08922008B2
公开(公告)日：2014-12-30
申请号：US13834475
申请日：2013-03-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong-Yun Myung , Yong-Hwan Kwon , Jong-Bo Shim , Moon-Gi Cho
IPC: H01L23/498 , H01L23/00 , H01L23/31 , H01L25/065 , H01L23/48
CPC classification number: H01L23/49811 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L2224/0345 , H01L2224/03912 , H01L2224/0401 , H01L2224/05009 , H01L2224/05022 , H01L2224/05166 , H01L2224/05171 , H01L2224/05568 , H01L2224/0557 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1146 , H01L2224/11472 , H01L2224/13025 , H01L2224/13084 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16146 , H01L2224/16235 , H01L2224/16237 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/15311 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2924/00012 , H01L2224/05552
Abstract: A bump structure includes a first bump and a second bump. The first bump is disposed on a connection pad of a substrate. The first bump includes a lower portion having a first width, a middle portion having a second width smaller than the first width, and an upper portion having a third width greater than the second width. The second bump is disposed on the upper portion of the first bump.
Abstract translation: 凸块结构包括第一凸块和第二凸块。 第一凸块设置在基板的连接焊盘上。 第一凸起包括具有第一宽度的下部，具有小于第一宽度的第二宽度的中间部分，以及具有大于第二宽度的第三宽度的上部。 第二凸块设置在第一凸块的上部。
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公开(公告)号：USD766977S1
公开(公告)日：2016-09-20
申请号：US29459715
申请日：2013-07-02
Applicant: Samsung Electronics Co., Ltd.
Designer： Jang-Won Seo , Yong-Hwan Kwon , Ji-Eun Kim , Ji-Hong Kim , Hye-Ryung Kim , Se-Ran Jeon , Woo-Seok Hwang
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公开(公告)号：USD763273S1
公开(公告)日：2016-08-09
申请号：US29517135
申请日：2015-02-10
Applicant: Samsung Electronics Co., Ltd.
Designer： Woo-Seok Hwang , Jangwon Seo , Yong-Hwan Kwon
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公开(公告)号：USD760733S1
公开(公告)日：2016-07-05
申请号：US29489314
申请日：2014-04-29
Applicant: Samsung Electronics Co., Ltd.
Designer： Woo-Seok Hwang , Yong-Hwan Kwon
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Patent Agency Ranking
公开(公告)号：USD759708S1
公开(公告)日：2016-06-21
申请号：US29524764
申请日：2015-04-23
Applicant: Samsung Electronics Co., Ltd.
Designer： Jang-Won Seo , Yong-Hwan Kwon , Ji-Eun Kim , Ji-Hong Kim , Hye-Ryung Kim , Se-Ran Jeon , Woo-Seok Hwang
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公开(公告)号：USD754148S1
公开(公告)日：2016-04-19
申请号：US29494117
申请日：2014-06-17
Applicant: Samsung Electronics Co., Ltd.
Designer： Min-Kyoung Yoon , Yong-Hwan Kwon , Woo-Seok Hwang
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公开(公告)号：USD753668S1
公开(公告)日：2016-04-12
申请号：US29459705
申请日：2013-07-02
Applicant: Samsung Electronics Co., Ltd.
Designer： Jang-Won Seo , Yong-Hwan Kwon , Ji-Eun Kim , Ji-Hong Kim , Hye-Ryung Kim , Se-Ran Jeon , Woo-Seok Hwang
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公开(公告)号：USD753142S1
公开(公告)日：2016-04-05
申请号：US29489303
申请日：2014-04-29
Applicant: Samsung Electronics Co., Ltd.
Designer： Woo-Seok Hwang , Yong-Hwan Kwon
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公开(公告)号：USD752636S1
公开(公告)日：2016-03-29
申请号：US29494108
申请日：2014-06-17
Applicant: Samsung Electronics Co., Ltd.
Designer： Min-Kyoung Yoon , Yong-Hwan Kwon , Woo-Seok Hwang
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