公开(公告)号：US11935847B2

公开(公告)日：2024-03-19

申请号：US17737472

申请日：2022-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam Kang ,  Changbae Lee ,  Bongju Cho ,  Younggwan Ko ,  Yongkoon Lee ,  Moonil Kim ,  Youngchan Ko

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522

CPC classification number: H01L23/66 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5226 ,  H01L24/05 ,  H01L24/13 ,  H01L2223/6677 ,  H01L2224/0401

Abstract: A semiconductor package includes: a connection structure having a first surface and a second, and including a redistribution layer; a passive component disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a semiconductor chip disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a first encapsulant disposed on the first surface of the connection structure and covering at least a portion of the semiconductor chip; a second encapsulant disposed on the first surface of the connection structure and covering at least a portion of the passive component; an antenna substrate disposed on the first encapsulant and including a wiring layer, at least a portion of the wiring layer including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the first encapsulant, and the antenna substrate.

公开(公告)号：US20230230943A1

公开(公告)日：2023-07-20

申请号：US18125989

申请日：2023-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon Lee ,  Jingu Kim ,  SANGKYU LEE ,  Seokkyu Choi

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01Q9/04 ,  H01Q19/00 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/20 ,  H01L21/6835 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L24/19 ,  H01Q9/0407 ,  H01Q19/005 ,  H01L23/3121 ,  H01L2221/68372 ,  H01L2223/6677 ,  H01L2224/214

Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

公开(公告)号：US11527495B2

公开(公告)日：2022-12-13

申请号：US17154041

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam Kang ,  Sangkyu Lee ,  Yongkoon Lee

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L23/31 ,  H01Q21/06

Abstract: A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

公开(公告)号：US20220102309A1

公开(公告)日：2022-03-31

申请号：US17337250

申请日：2021-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangkyu Lee ,  Jingu Kim ,  Yongkoon Lee

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes a support member, a semiconductor chip arranged in the support member such that a front surface and a backside surface of the semiconductor chip are exposed from a second surface of the support member and a first surface opposite to the second surface respectively, a lower redistribution wiring layer covering the second surface of the support member and including first redistribution wirings electrically connected to chip pads provided at the front surface of the semiconductor chip and vertical connection structures of the support member respectively, and an upper redistribution wiring layer covering the first surface of the support substrate, and including second redistribution wirings electrically connected to the vertical connection structures and a thermal pattern provided on the exposed backside surface of the semiconductor chip.

公开(公告)号：US20220102236A1

公开(公告)日：2022-03-31

申请号：US17235502

申请日：2021-04-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jingu Kim ,  Sangkyu Lee ,  Yongkoon Lee ,  Seokkyu Choi

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10

Abstract: A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.