摘要:
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
摘要:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
摘要:
A dual power module architecture employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.
摘要:
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.
摘要:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
摘要:
An electrical connector for use in a power module includes a first end portion for forming an electrical connection with a substrate, a second end portion, and a compliant portion situated between the first end portion and the second end portion. The compliant portion includes a compressed position and a decompressed position. The first end portion is configured for forming an electrical connection with a substrate if the compliant portion is in the compressed position.
摘要:
A system and method for controlling power converters are disclosed. Briefly described, one embodiment is a method comprising communicating at least one first control signal to an alternating current/direct current (AC/DC) power converter from a multi-converter system controller, the AC/DC power converter and the multi-converter system controller residing in a power system electronics housing, and communicating at least one second control signal to a direct current/direct current (DC/DC) power converter from the multi-converter system controller, the DC/DC power converter residing in a power system electronics housing.
摘要:
An assembly for cooling an electric motor, the assembly comprising a housing, a stator, a rotor, a winding, an end-winding integrally formed with the winding, and a jet impingement device operable for exposing the end-winding to a temperature controlled stream of fluid. A method for transferring heat between a stream of impinging fluid and the surface of an electric motor end-winding. An electric motor comprising a jet impingement cooling assembly.
摘要:
A system and method for controlling power converters are disclosed. Briefly described, one embodiment is a method comprising communicating at least one first control signal to an alternating current/direct current (AC/DC) power converter from a multi-converter system controller, the AC/DC power converter and the multi-converter system controller residing in a power system electronics housing, and communicating at least one second control signal to a direct current/direct current (DC/DC) power converter from the multi-converter system controller, the DC/DC power converter residing in a power system electronics housing.
摘要:
A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.