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    MICROFLUIDIC APPARATUS, DRIVING METHOD AND FORMATION METHOD THEREOF
    21.
    发明公开
    MICROFLUIDIC APPARATUS, DRIVING METHOD AND FORMATION METHOD THEREOF 审中-公开

    公开(公告)号：US20230249181A1

    公开(公告)日：2023-08-10

    申请号：US17730035

    申请日：2022-04-26

    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.

    Inventor： Kaidi ZHANG ,  Wei LI ,  Baiquan LIN ,  Yunfei BAI ,  Kerui XI ,  Feng QIN

    IPC: B01L3/00

    CPC classification number: B01L3/50273 ,  B01L3/502792 ,  B01L2300/0816

    Abstract: A microfluidic apparatus, a driving method, and a formation method are provided in the present disclosure. The apparatus includes a first substrate and a second substrate. The first substrate and the second substrate are both smooth substrates. An electrode array layer is on a side of the first substrate; and a second electrode layer is on a side of the second substrate. The electrode array layer at least includes a plurality of first electrodes and a plurality of second electrodes. The first substrate includes a first region and a second region; the plurality of first electrodes is in the first region; and the plurality of second electrode is in the second region. A distance between the first substrate and the second substrate in the first region is D1 is greater than a distance between the first substrate and the second substrate in the second region is D2.

    GENE SEQUENCING STRUCTURE, GENE SEQUENCING DEVICE AND GENE SEQUENCING METHOD
    22.
    发明公开
    GENE SEQUENCING STRUCTURE, GENE SEQUENCING DEVICE AND GENE SEQUENCING METHOD 审中-公开

    公开(公告)号：US20230151408A1

    公开(公告)日：2023-05-18

    申请号：US17580176

    申请日：2022-01-20

    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.

    Inventor： Baiquan LIN ,  Kerui XI ,  Kaidi ZHANG ,  Wei LI ,  Yunfei BAI ,  Ping SU ,  Junting OUYANG

    IPC: C12Q1/6825 ,  G01N27/414

    CPC classification number: C12Q1/6825 ,  G01N27/4145

    Abstract: A gene sequencing structure, a gene sequencing device and a gene sequencing method are provided. The gene sequencing structure includes a substrate, a thin-film transistor array layer located on the substrate and including thin-film transistors that include a first electrode, and a second electrode; an ion-sensitive layer located on a side of the semiconductor layer away from the substrate; a micro-hole layer located on a side of the ion-sensitive layer away from the substrate, including a through-hole passing through the micro-hole layer, at least partially overlapping the semiconductor layer, and used for receiving a to-be-tested single-stranded nucleic acid inside; a conductive structure, located on a side of the layer away from the substrate and electrically connected to the first electrode or the second electrode; and a detection chip, located on a side of the conductive structure away from the substrate and electrically connected to the conductive structure.

    PACKAGE STRUCTURE, PACKAGING METHOD, CAMERA MODULE, AND ELECTRONIC EQUIPMENT
    23.
    发明申请
    PACKAGE STRUCTURE, PACKAGING METHOD, CAMERA MODULE, AND ELECTRONIC EQUIPMENT 有权

    公开(公告)号：US20220102406A1

    公开(公告)日：2022-03-31

    申请号：US17546740

    申请日：2021-12-09

    Applicant: Shanghai AVIC OPTO Electronics Co., Ltd. ,  Shanghai Tianma Micro-Electronics Co., Ltd.

    Inventor： Kerui XI ,  Xuhui PENG ,  Feng QIN ,  Tingting CUI ,  Zhenyu JIA

    IPC: H01L27/146 ,  H01L25/16

    Abstract: The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.

    DRIVING CIRCUIT AND DRIVING METHOD THEREOF, AND ELECTROWETTING PANEL AND DRIVING METHOD THEREOF
    24.
    发明申请
    DRIVING CIRCUIT AND DRIVING METHOD THEREOF, AND ELECTROWETTING PANEL AND DRIVING METHOD THEREOF 审中-公开

    公开(公告)号：US20200319449A1

    公开(公告)日：2020-10-08

    申请号：US16458054

    申请日：2019-06-29

    Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.

    Inventor： Baiquan LIN ,  Kerui XI ,  Feng QIN ,  Yian ZHOU ,  Xiangjian KONG ,  Jine LIU

    IPC: G02B26/00 ,  G02B26/10

    Abstract: A driving circuit includes a first signal-input terminal, a second signal-input terminal, a third signal-input terminal, a fourth signal-input terminal, a signal-output terminal, and a voltage-boosting unit including a first module, a second module, a third module, and a first capacitor. The first module transmits the signal at the third signal-input terminal to a first terminal of the first capacitor during a first time period, and blocks signal transmission during a second time period. During the first time period and the second time period, the second module transmits the signal at the third signal-input terminal to the third module to allow the signal at the fourth signal-input terminal to be transmitted to a second terminal of the first capacitor. During a third time period, the second module and the third module both block signal transmission. The first terminal of the first capacitor is connected to the signal-output terminal for output.

    ARRAY SUBSTRATE, ELECTRONIC PAPER DISPLAY PANEL AND DRIVING METHOD THEREOF
    25.
    发明申请
    ARRAY SUBSTRATE, ELECTRONIC PAPER DISPLAY PANEL AND DRIVING METHOD THEREOF 审中-公开

    公开(公告)号：US20180047316A1

    公开(公告)日：2018-02-15

    申请号：US15794689

    申请日：2017-10-26

    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.

    Inventor： Yian ZHOU ,  Kerui XI

    IPC: G09F9/30 ,  G09G3/20 ,  H01L27/146

    Abstract: An array substrate, an electronic paper display panel and a driving method are provided. The array substrate includes at least two display areas provided with a plurality of data signal lines, and a peripheral circuit area provided with a plurality of signal leads, a plurality of switch modules and surrounding the at least two display areas. Each one data signal line is electrically connected to one signal lead through one switch module. Further, the array substrate includes at least two control signal lines provided in the peripheral circuit area. All control terminals of the switch modules corresponding to all the data signal lines in single one display area are electrically connected to the same one control signal line, and the control terminals of the switch modules corresponding to the data signal lines in different display areas are electrically connected to different control signal lines.

    THIN-FILM TRANSISTOR STRUCTURE AND ELECTRONIC DEVICE
    26.
    发明申请
    THIN-FILM TRANSISTOR STRUCTURE AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20250107232A1

    公开(公告)日：2025-03-27

    申请号：US18600804

    申请日：2024-03-11

    Applicant: Shanghai Tianma Micro-electronics Co., Ltd.

    Inventor： Kaidi ZHANG ,  Baiquan LIN ,  Liying WANG ,  Linzhi WANG ,  Haotian LU ,  Kerui XI

    IPC: H01L27/12

    Abstract: A thin-film transistor structure and an electronic device are provided. The thin-film transistor structure includes a first transistor and a second transistor. A potential of the signal input electrode of the first transistor is greater than that of the signal receiving component, and the first transistor is turned on; and a potential of the signal input electrode of the second transistor is less than that of the signal receiving component, and the second transistor is turned on; and an overlapping area of the signal output electrode of the first transistor and the etching barrier layer is greater than that of the signal input electrode of the first transistor and the etching barrier layer; and an overlapping area of the signal input electrode of the second transistor and the etching barrier layer is larger than that of the signal output electrode of the second transistor and the etching barrier layer.

    PREFABRICATED SUBSTRATE, FLEXIBLE SUBSTRATE, FLEXIBLE MODULE, FABRICATION METHOD, AND DISPLAY DEVICE
    27.
    发明公开
    PREFABRICATED SUBSTRATE, FLEXIBLE SUBSTRATE, FLEXIBLE MODULE, FABRICATION METHOD, AND DISPLAY DEVICE 审中-公开

    公开(公告)号：US20230271397A1

    公开(公告)日：2023-08-31

    申请号：US17826823

    申请日：2022-05-27

    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.

    Inventor： Zhen LIU ,  Qingsan ZHU ,  Kerui XI ,  Xiaobing ZHAO ,  Huan LI ,  Fan XU ,  Danping WANG ,  Feng QIN

    IPC: B32B3/08

    CPC classification number: B32B3/08 ,  H01L27/32

    Abstract: A prefabricated substrate, a flexible substrate, a flexible module and a fabrication method, and a display device are provided. The prefabricated substrate includes a first film layer as a rigid film layer, and a second film layer as a flexible film layer. The second film layer at least partially wraps the first film layer. The first film layer includes a first surface and a second surface. The second film layer at least includes a first portion located on a side of the first surface away from the second surface, and a second portion and a third portion located on a side of the second surface away from the first surface. The second portion and the third portion are attached on the second surface through a first adhesive layer and a second adhesive layer, respectively. The second portion and the third portion are spaced apart by a gap.

    MICROFLUIDIC APPARATUS, AND DRIVE CIRCUIT AND DRIVE METHOD THEREOF
    29.
    发明公开
    MICROFLUIDIC APPARATUS, AND DRIVE CIRCUIT AND DRIVE METHOD THEREOF 审中-公开

    公开(公告)号：US20230166258A1

    公开(公告)日：2023-06-01

    申请号：US17670415

    申请日：2022-02-11

    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.

    Inventor： Ping SU ,  Kerui XI ,  Baiquan LIN ,  Huihui JIANG ,  Yi WANG ,  Aowen LI ,  Xiao CHEN

    IPC: B01L3/00

    CPC classification number: B01L3/502792 ,  B01L2300/123 ,  B01L2400/0415

    Abstract: A microfluidic apparatus, and its drive circuit and drive method are provided in the present disclosure. The drive circuit includes at least one switch unit, where the switch unit includes a first signal input terminal, a signal output terminal, first and second control signal terminals, a signal terminal, a first module, a second module, and a third module. The first module is electrically connected to the first signal input terminal, the signal output terminal and the second module; and the second module is electrically connected to the first control signal terminal. The first control signal terminal is configured to control the first module and the second module to be in conduction or disconnection, and the second control signal terminal is configured to control the third module to in conduction or disconnection, thereby controlling the signal output terminal to output a first or second signal.

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