公开(公告)号：US10545904B1

公开(公告)日：2020-01-28

申请号：US16033873

申请日：2018-07-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Mark Edward Wentroble ,  Suzanne Mary Vining ,  Hassan Omar Ali

IPC: G06F13/40 ,  G06F13/42

Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.

公开(公告)号：US20190334220A1

公开(公告)日：2019-10-31

申请号：US16393809

申请日：2019-04-24

Applicant: Texas Instruments Incorporated

Inventor： Hassan Omar Ali ,  Juan Alejandro Herbsommer ,  Benjamin Cook ,  Swaminathan Sankaran

IPC: H01P3/16 ,  H01Q13/00 ,  H01Q1/22 ,  H01P3/08 ,  H01P5/08 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498

Abstract: A wave communication system includes an integrated circuit and a multilayered substrate. The multilayered substrate is electrically coupled to the integrated circuit. The multilayered substrate includes an antenna structure configured to transmit a circularly polarized wave in response to signals from the integrated circuit.

公开(公告)号：US11933670B2

公开(公告)日：2024-03-19

申请号：US17463013

申请日：2021-08-31

Applicant: Texas Instruments Incorporated

Inventor： Bichoy Bahr ,  Jeronimo Segovia Fernandez ,  Hassan Omar Ali

IPC: G01J1/46 ,  G01J1/04 ,  G02B5/20

CPC classification number: G01J1/46 ,  G01J1/0403 ,  G01J1/0488 ,  G02B5/208

Abstract: An example apparatus includes: a semiconductor substrate; a mechanical resonator supported by the substrate, the mechanical resonator including an array of capacitors; and a plasmonic infrared (IR) absorber including an array of metal structures. The mechanical resonator is between the substrate and the IR absorber.

公开(公告)号：US20240038691A1

公开(公告)日：2024-02-01

申请号：US17877426

申请日：2022-07-29

Applicant: Texas Instruments Incorporated

Inventor： Vijaylaxmi Gumaste Khanolkar ,  Anindya Poddar ,  Hassan Omar Ali ,  Dibyajat Mishra ,  Venkatesh Srinivasan ,  Swaminathan Sankaran

IPC: H01L23/66 ,  H01Q1/22 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01Q1/2283 ,  H01L21/565 ,  H01L21/561 ,  H01L24/96 ,  H01L24/97 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2924/2027 ,  H01L2924/182

Abstract: In a described example, an apparatus includes: a semiconductor device mounted to a device side surface of a package substrate, the package substrate having a board side surface opposite the device side surface; an antenna module mounted to the package substrate and coupled to the semiconductor device; and mold compound covering the semiconductor device and a portion of the package substrate.

公开(公告)号：US20230376441A1

公开(公告)日：2023-11-23

申请号：US18230797

申请日：2023-08-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Mark Edward Wentroble ,  Suzanne Mary Vining ,  Hassan Omar Ali

IPC: G06F13/40 ,  G06F13/42

CPC classification number: G06F13/409 ,  G06F13/4282 ,  G06F2213/0042

Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.

公开(公告)号：US11600581B2

公开(公告)日：2023-03-07

申请号：US17231897

申请日：2021-04-15

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Hassan Omar Ali ,  Baher Haroun ,  Yigi Tang ,  Rajen Manicon Murugan

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/495

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

公开(公告)号：US11522268B2

公开(公告)日：2022-12-06

申请号：US17116668

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hassan Omar Ali ,  Benjamin Stassen Cook

IPC: H03M1/38 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q23/00 ,  H01Q1/38

Abstract: A device comprises an integrated circuit (IC) die, a substrate, a printed circuit board (PCB), an antenna, and a waveguide stub. The IC die is affixed to the substrate, which comprises a signal launch on a surface of the substrate that is configured to emit or receive a signal. The substrate and the antenna are affixed to the PCB, such that the signal launch and a waveguide opening of the antenna are aligned and comprise a signal channel. The waveguide stub is arranged as a boundary around the signal channel. In some implementations, the waveguide stub has a height of λ/4, where λ represents a wavelength of the signal. In some implementations, the antenna includes the waveguide stub; in others, the substrate includes the waveguide stub.

公开(公告)号：US20220336383A1

公开(公告)日：2022-10-20

申请号：US17231897

申请日：2021-04-15

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Hassan Omar Ali ,  Baher Haroun ,  Yigi Tang ,  Rajen Manicon Murugan

IPC: H01L23/66 ,  H01L23/495 ,  H01L21/48

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

公开(公告)号：US11128023B2

公开(公告)日：2021-09-21

申请号：US16716642

申请日：2019-12-17

Applicant: Texas Instruments Incorporated

Inventor： Hassan Omar Ali ,  Juan Alejandro Herbsommer ,  Benjamin Stassen Cook ,  Vikas Gupta ,  Athena Lin ,  Swaminathan Sankaran

IPC: H01P3/16 ,  H01Q1/22 ,  H04B1/40 ,  H01P3/12

Abstract: A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.