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    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    21.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号：US20100136492A1

    公开(公告)日：2010-06-03

    申请号：US12698870

    申请日：2010-02-02

    申请人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

    发明人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

    IPC分类号： G03F7/20

    CPC分类号： G03F7/70991 ,  G03F7/70341

    摘要： A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of: forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying washing processing to the substrate by said second processing unit after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device and transporting the substrate after the washing processing to said exposure device. The method further includes transporting the substrate from said exposure device and applying development processing by said third processing unit to the substrate transported after the exposure processing by said exposure device.

    摘要翻译： 一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括以下步骤：通过所述第一处理在基板上形成由感光材料制成的感光膜 所述曝光装置进行曝光处理之前的单元。 该方法还包括在由所述第一处理单元形成所述感光膜之后并且在所述曝光装置进行曝光处理之前，通过所述第二处理单元对所述基板进行洗涤处理，并将所述基板在所述清洗处理之后传送到所述曝光装置。 所述方法还包括从所述曝光装置运送所述基板并将所述第三处理单元的显影处理应用于由所述曝光装置进行曝光处理之后运送的所述基板。

    SUBSTRATE PROCESSING APPARATUS
    22.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工设备

    公开(公告)号：US20070190437A1

    公开(公告)日：2007-08-16

    申请号：US11670108

    申请日：2007-02-01

    申请人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Tetsuya Hamada

    发明人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Tetsuya Hamada

    IPC分类号： G03C5/00

    CPC分类号： G03F7/70925 ,  G03F7/168 ,  G03F7/7075 ,  G03F7/70916 ,  G03F7/70991 ,  G11B5/8404 ,  G11B7/261 ,  H01L21/67051 ,  H01L21/67225 ,  Y10S134/902

    摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a blush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.

    摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，抗蚀剂覆盖膜处理块，抗蚀剂覆盖膜去除块，清洁/干燥处理块，以及 一个接口块。 曝光装置被布置成与基板处理装置中的界面块相邻。 曝光装置通过浸渍方法使基板进行曝光处理。 在清洁/干燥处理块中的边缘清洁单元中，腮红与旋转基板的端部抵接，从而清洁曝光处理之前的基板的边缘。 此时，校正基板被清洁的位置。

    Substrate processing method
    25.
    发明授权
    Substrate processing method 有权
    基板加工方法

    公开(公告)号：US08356424B2

    公开(公告)日：2013-01-22

    申请号：US12842485

    申请日：2010-07-23

    申请人： Koji Kaneyama ,  Kazuhito Shigemori ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    发明人： Koji Kaneyama ,  Kazuhito Shigemori ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

    IPC分类号： B05D3/04

    CPC分类号： H01L21/67051 ,  H01L21/67225

    摘要： A substrate processing method comprises the step of subjecting a substrate to drying processing in at least one of a processing section and an interface, wherein the step of subjecting the substrate to the drying processing comprises the steps of: rotating the substrate at a first rotational speed around an axis perpendicular to the substrate, while holding the substrate horizontally, forming a liquid layer on the substrate in a state where the substrate is rotated at the first rotational speed, gradually and continuously increasing the rotational speed of the substrate to a second rotational speed after the formation of the liquid layer, and starting discharging a gas to the liquid layer on the substrate while the substrate is rotated at the second rotational speed.

    摘要翻译： 基板处理方法包括以下步骤：对基板进行处理部和界面中的至少一个的干燥处理，其中对基板进行干燥处理的步骤包括以下步骤：以第一转速旋转基板 围绕垂直于基板的轴线，同时水平地保持基板，在基板以第一转速旋转的状态下在基板上形成液体层，逐渐且连续地将基板的旋转速度提高到第二转速 在形成液体层之后，并且在基板以第二旋转速度旋转的同时开始将气体排放到基板上的液体层。

    METHOD AND SYSTEM FOR REMOVAL OF FILMS FROM PERIPHERAL PORTIONS OF A SUBSTRATE
    26.
    发明申请
    METHOD AND SYSTEM FOR REMOVAL OF FILMS FROM PERIPHERAL PORTIONS OF A SUBSTRATE 审中-公开
    从衬底的外围部分去除膜的方法和系统

    公开(公告)号：US20120037593A1

    公开(公告)日：2012-02-16

    申请号：US13284603

    申请日：2011-10-28

    申请人： Tadashi Miyagi ,  Masashi Kanaoka ,  Tetsuya Hamada ,  Kazuhito Shigemori ,  Shuichi Yasuda

    发明人： Tadashi Miyagi ,  Masashi Kanaoka ,  Tetsuya Hamada ,  Kazuhito Shigemori ,  Shuichi Yasuda

    IPC分类号： C23F1/02

    CPC分类号： H01L21/31058 ,  G03F7/168 ,  H01L21/0276 ,  H01L21/6708 ,  H01L21/67259 ,  H01L21/67706

    摘要： A substrate processing apparatus includes an anti-reflection film processing block, a resist film processing block, and a resist cover film processing block. In the processing blocks, an anti-reflection film, a resist film, and a resist cover film are formed on a substrate, respectively. Additionally, a film formed at a peripheral edge of the substrate is removed. The film formed at the peripheral edge of the substrate is removed by supplying a removal liquid capable of dissolving and removing the film to the peripheral edge of the substrate during rotation. When the peripheral edge of the film is removed, the position of the substrate is corrected such that the center of the substrate coincides with the center of a rotation shaft.

    摘要翻译： 基板处理装置包括防反射膜处理块，抗蚀剂膜处理块和抗蚀剂覆盖膜处理块。 在处理块中，分别在基板上形成抗反射膜，抗蚀剂膜和抗蚀剂覆盖膜。 此外，除去在基板的周缘形成的膜。 通过在旋转期间通过提供能够将膜溶解并除去膜的周边边缘的去除液体来除去形成在基板的周缘的膜。 当去除膜的外围边缘时，校正基板的位置使得基板的中心与旋转轴的中心重合。