摘要:
Provided are a thin-film transistor formed by connecting polysilicon layers having different conductivity types with each other which prevents occurrence of inconvenience resulting from diffusion of impurities and a method of fabricating the same. A drain (6), a channel (7) and a source (8) are integrally formed on a surface of a second oxide film (4) by polysilicon. The drain (6) is formed to be connected with a pad layer (3) (second polycrystalline semiconductor layer) through a contact hole (5) which is formed to reach an upper surface of the pad layer (3). The pad layer (3) positioned on a bottom portion of the contact hole (5) (opening) is provided with a boron implantation region BR.
摘要:
There is provided a semiconductor device with a configuration in which a dummy silicide area 11 is provided in the vicinity of a non-silicide area 2 to easily capture residual refractory metals, resulting in an improved yield by preventing the trapping of residual refractory metals into a non-silicide area and thereby reducing a junction leakage within the non-silicide area.
摘要:
Provided are a thin-film transistor formed by connecting polysilicon layers having different conductivity types with each other which prevents occurrence of inconvenience resulting from diffusion of impurities and a method of fabricating the same. A drain (6), a channel (7) and a source (8) are integrally formed on a surface of a second oxide film (4) by polysilicon. The drain (6) is formed to be connected with a pad layer (3) (second polycrystalline semiconductor layer) through a contact hole (5) which is formed to reach an upper surface of the pad layer (3). The pad layer (3) positioned on a bottom portion of the contact hole (5) (opening) is provided with a boron implantation region BR.
摘要:
A semiconductor device includes metal silicide films formed on the surface of a source-drain region and of a gate electrode. On the metal silicide films, impurity regions are formed of a conductivity type opposite to the conductivity type of the source-drain region. This structure enables the contact resistance at the interfaces between contact layers and the metal silicide films even when the semiconductor integrated circuit is scaled down, thereby providing a high-speed semiconductor device and its manufacturing method.
摘要:
An object is to provide a structure of a semiconductor device which allows higher degree of integration both in vertical and horizontal directions, and to provide manufacturing method therefor. The semiconductor device includes source·drain electrodes connected to n− and n+ source·drain regions of an MISFET and has a function as a part of a bit line, and a gate electrode connected to a first interconnection as a word line. Electrodes are insulated from each other by a sidewall insulating film, silicon oxide film or a silicon nitride film provided inbetween. Since the word line and the bit line do not cross in the same plane, the difference in level in the vertical direction can be reduced.
摘要:
Provided are a thin-film transistor formed by connecting polysilicon layers having different conductivity types with each other which prevents occurrence of inconvenience resulting from diffusion of impurities and a method of fabricating the same.A drain (6), a channel (7) and a source (8) are integrally formed on a surface of a second oxide film (4) by polysilicon. The drain (6) is formed to be connected with a pad layer (3) (second polycrystalline semiconductor layer) through a contact hole (5) which is formed to reach an upper surface of the pad layer (3). The pad layer (3) positioned on a bottom portion of the contact hole (5) (opening) is provided with a boron implantation region BR.
摘要:
A semiconductor device and a method of manufacturing the same provide a structure which can be easily integrated to a higher extent without providing an alignment margin taking an alignment accuracy of photolithography into consideration. In the semiconductor device, a gate electrode and a pair of source/drain electrodes are formed inside a transistor opening formed at first and second insulating films forming a flat element isolating film. Thereby, an end of the gate electrode in the width direction is defined in an aligned manner by the transistor opening in the step of forming the gate electrode so that it is not necessary to provide the alignment margin taking the alignment accuracy into consideration. This allows high integration.
摘要:
A vehicle air conditioner provided with an airflow structure for an intake box, wherein, in an HVAC comprising, in an intake box, a control device for controlling the number of rotation, the control device is reliably cooled by airflow regardless of the ratio of mixing between internal air and external air. A vehicle air conditioner of center-concentrated type, wherein a control device (6) for controlling the number of rotation is mounted to a vehicle interior-side wall surface inside an intake box (2) and wherein an air delivery guide (22) is provided in the intake box (2), the air delivery guide (22) delivering to the control device (6) a part of air introduced from a direction crossing the direction of opening of a suction opening (7) of a blower (8).
摘要:
There is provided a semiconductor device with a configuration in which a dummy silicide area 11 is provided in the vicinity of a non-silicide area 2 to easily capture residual refractory metals, resulting in an improved yield by preventing the trapping of residual refractory metals into a non-silicide area and thereby reducing a junction leakage within the non-silicide area.
摘要:
There is provided a semiconductor device with a configuration in which a dummy silicide area 11 is provided in the vicinity of a non-silicide area 2 to easily capture residual refractory metals, resulting in an improved yield by preventing the trapping of residual refractory metals into a non-silicide area and thereby reducing a junction leakage within the non-silicide area.