公开(公告)号：US20210091029A1

公开(公告)日：2021-03-25

申请号：US17114112

申请日：2020-12-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Fan Huang ,  Hui-Chi Chen ,  Kuo-Chin Chang ,  Chien-Huang Yeh ,  Hong-Seng Shue ,  Dian-Hau Chen ,  Yen-Ming Chen

IPC: H01L23/00 ,  H01L21/48

Abstract: Semiconductor device packages and method are provided. A semiconductor device package according to the present disclosure includes a substrate including a first region, a passive device disposed over the first region of the substrate, a contact pad disposed over the passive device, a passivation layer disposed over the contact pad, a recess through the passivation layer, and an under-bump metallization (UBM) layer. The recess exposes the contact pad and the UBM layer includes an upper portion disposed over the passivation layer and a lower portion disposed over a sidewall of the recess. A projection of the upper portion of the UBM layer along a direction perpendicular to the substrate falls within an area of the contact pad.

公开(公告)号：US10861810B2

公开(公告)日：2020-12-08

申请号：US16392024

申请日：2019-04-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Fan Huang ,  Hui-Chi Chen ,  Kuo-Chin Chang ,  Chien-Huang Yeh ,  Hong-Seng Shue ,  Dian-Hau Chen ,  Yen-Ming Chen

IPC: H01L23/00 ,  H01L21/48

Abstract: Semiconductor device packages and method are provided. A semiconductor device package according to the present disclosure includes a substrate including a first region, a passive device disposed over the first region of the substrate, a contact pad disposed over the passive device, a passivation layer disposed over the contact pad, a recess through the passivation layer, and an under-bump metallization (UBM) layer. The recess exposes the contact pad and the UBM layer includes an upper portion disposed over the passivation layer and a lower portion disposed over a sidewall of the recess. A projection of the upper portion of the UBM layer along a direction perpendicular to the substrate falls within an area of the contact pad.

公开(公告)号：US09614031B2

公开(公告)日：2017-04-04

申请号：US14806854

申请日：2015-07-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tai-I Yang ,  Shou-Wei Lee ,  Shao-Chi Yu ,  Hong-Seng Shue ,  Kun-Ming Huang ,  Po-Tao Chu

IPC: H01L21/761 ,  H01L21/762 ,  H01L21/308 ,  H01L21/225 ,  H01L29/06 ,  H01L29/66 ,  H01L29/78 ,  H01L21/324 ,  H01L29/10

CPC classification number: H01L29/0634 ,  H01L21/2254 ,  H01L21/2257 ,  H01L21/308 ,  H01L21/324 ,  H01L21/761 ,  H01L21/76224 ,  H01L29/0692 ,  H01L29/1095 ,  H01L29/66712 ,  H01L29/7802 ,  H01L29/7811

Abstract: A high-voltage super junction device is disclosed. The device includes a semiconductor substrate region having a first conductivity type and having neighboring trenches disposed therein. The neighboring trenches each have trench sidewalls and a trench bottom surface. A region having a second conductivity type is disposed in or adjacent to a trench and meets the semiconductor substrate region at a p-n junction. A gate electrode is formed on the semiconductor substrate region and is electrically isolated from the semiconductor substrate region by a gate dielectric. A body region having the second conductivity type is disposed on opposite sides of the gate electrode near a surface of the semiconductor substrate. A source region having the first conductivity type is disposed within in the body region on opposite sides of the gate electrode near the surface of the semiconductor substrate.

公开(公告)号：US08953155B1

公开(公告)日：2015-02-10

申请号：US14037976

申请日：2013-09-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Tai-I Yang ,  Hong-Seng Shue ,  Ming-Tai Chung

IPC: G01N21/00 ,  G01N21/55

CPC classification number: G01N21/956 ,  G01N2021/8848

Abstract: Embodiments of mechanisms of an optical inspection system for inspecting an object are provided. The optical inspection system includes a light source emitting a coherent beam having a first width, and a beam expander increasing the first width to a second width. The optical inspection system also includes an polaroid module adjacent to the beam expander and polarizing the coherent beam. The object generates an inspection beam with an interference pattern by reflecting the polarized coherent beam. The optical inspection system further includes an image module capturing the inspection beam.

Abstract translation: 提供了用于检查物体的光学检查系统的机构的实施例。 光学检查系统包括发射具有第一宽度的相干光束的光源和将第一宽度增加到第二宽度的光束扩展器。 光学检测系统还包括与光束扩展器相邻并偏振相干光束的偏振片模块。 物体通过反射偏振相干光束产生具有干涉图案的检测光束。 光学检查系统还包括捕获检查光束的图像模块。