公开(公告)号：US07094677B2

公开(公告)日：2006-08-22

申请号：US10736581

申请日：2003-12-17

申请人： Satoshi Yamamoto ,  Takashi Takizawa

发明人： Satoshi Yamamoto ,  Takashi Takizawa

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/128 ,  H01L2924/00

摘要： A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of forming a penetration electrode, an electroconductive substance is inserted into the micropore that penetrates a substrate and that has one aperture blocked off by an electroconductive thin film. After a protective member that holds the electroconductive thin film is provided on a surface on the electroconductive thin film side of the substrate, an electroconductive substance is inserted from the other aperture of the micropore.

公开(公告)号：US07080560B2

公开(公告)日：2006-07-25

申请号：US10714639

申请日：2003-11-18

申请人： Takashi Takizawa ,  Tatsuo Suemasu ,  Satoshi Yamamoto

发明人： Takashi Takizawa ,  Tatsuo Suemasu ,  Satoshi Yamamoto

IPC分类号： G01L9/00

CPC分类号： G01L9/0054 ,  G01L9/06 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The semiconductor pressure sensor includes a substrate (20). The sensor includes a diaphragm (26) implemented in the substrate (26) and being displaceable by a pressure medium acting on a side of the substrate (26). The sensor includes sensor circuitry (22, 23) implemented on the opposite side of the substrate in coincidence with the diaphragm (26) for detecting displacement of the diaphragm (26) for pressure.

摘要翻译： 半导体压力传感器包括基板（20）。 传感器包括在基板（26）中实现的隔膜（26），并可通过作用在基板（26）一侧上的压力介质移位。 所述传感器包括在与所述隔膜（26）重合的位于所述基板相对侧上的传感器电路（22,23），用于检测所述隔膜（26）的压力位移。

公开(公告)号：US07022609B2

公开(公告)日：2006-04-04

申请号：US10646757

申请日：2003-08-25

申请人： Satoshi Yamamoto ,  Takashi Takizawa ,  Tatsuo Suemasu ,  Masahiro Katashiro ,  Hiroshi Miyajima ,  Kazuya Matsumoto ,  Toshihiko Isokawa

发明人： Satoshi Yamamoto ,  Takashi Takizawa ,  Tatsuo Suemasu ,  Masahiro Katashiro ,  Hiroshi Miyajima ,  Kazuya Matsumoto ,  Toshihiko Isokawa

IPC分类号： H01L21/302

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05025 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2924/0002 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/014 ,  H01L2224/05552

摘要： A manufacturing method of a semiconductor substrate provided with a through hole electrode is proposed. In accordance with the methods, it is possible to effectively form a through hole electrode in a semiconductor substrate in which a device and a wiring pattern have been already fabricated. This manufacturing method includes the steps of forming a first silicon oxide film 12 on a principal surface of the semiconductor substrate 11, forming a small hole 13 through the semiconductor substrate 11 from the opposite the step to reach to the first silicon oxide film 12, covering the inside of the small hole 13 with the second silicon oxide film 14, forming a first thin metal film 15 and a second thin metal film 16 on the first silicon oxide film 12, partially removing the first silicon oxide film 12 corresponding to the end of the small hole 13, and filling the small hole 13 with the conductive material to form a through hole electrode 17.

摘要翻译： 提出了具有通孔电极的半导体衬底的制造方法。 根据该方法，可以在其中已经制造了器件和布线图案的半导体衬底中有效地形成通孔电极。 该制造方法包括以下步骤：在半导体衬底11的主表面上形成第一氧化硅膜12，与步骤相反的步骤，通过半导体衬底11形成小孔13，以到达第一氧化硅膜12，覆盖 小孔13的内部与第二氧化硅膜14形成，在第一氧化硅膜12上形成第一薄金属膜15和第二薄金属膜16，部分地除去第一氧化硅膜12的末端的第一氧化硅膜12 小孔13，并用导电材料填充小孔13，以形成通孔电极17。

公开(公告)号：US20060068996A1

公开(公告)日：2006-03-30

申请号：US11237961

申请日：2005-09-29

申请人： Hirofumi Kuwabara ,  Isashi Kashiwagi ,  Kenji Oe ,  Tomonori Owaki ,  Seiji Hojo ,  Hisayuki Osawa ,  Takashi Takizawa ,  Takashi Okaniwa

发明人： Hirofumi Kuwabara ,  Isashi Kashiwagi ,  Kenji Oe ,  Tomonori Owaki ,  Seiji Hojo ,  Hisayuki Osawa ,  Takashi Takizawa ,  Takashi Okaniwa

IPC分类号： C10M169/00

CPC分类号： C10M169/06 ,  C10M169/00 ,  C10M2201/066 ,  C10M2203/1006 ,  C10M2207/0406 ,  C10M2207/2805 ,  C10M2207/40 ,  C10M2207/402 ,  C10M2215/1026 ,  C10M2219/022 ,  C10M2219/044 ,  C10M2219/046 ,  C10M2219/068 ,  C10M2223/047 ,  C10N2210/06 ,  C10N2240/046 ,  C10N2250/10

摘要： A grease composition for use in ball type constant velocity joints, which comprises the following components a base oil; a diurea thickener of the formula: R1—NH—CO—NH—C6H4-p-CH2—C6H4-p-NH—CO—NHR2 wherein R1 and R2 are alkyl groups having 8 carbon atoms, molybdenum disulfide; molybdenum dithiocarbamate of the formula: (R3R4N—CS—S)2—Mo2OmSn wherein R3 and R4 independently represent an alkyl group having 1 to 24 carbon atoms, m is 0 to 3, n is 4 to 1 and m+n=4, calcium salts or overbasic calcium salts of petroleum sulfonates, sulfur-phosphorus extreme pressure agent, and castor oil. The grease composition exhibits excellent wear-resistance and pitting-inhibitory effect.

摘要翻译： 一种用于球型恒速接头的润滑脂组合物，其包含以下组分：基础油; 一种二脲增稠剂

公开(公告)号：US06955626B2

公开(公告)日：2005-10-18

申请号：US10602950

申请日：2003-06-24

申请人： Tomoki Yoshihama ,  Takashi Takizawa

发明人： Tomoki Yoshihama ,  Takashi Takizawa

IPC分类号： B60K17/16 ,  B60K17/346 ,  B60K17/35 ,  F16H48/06 ,  F16H48/10 ,  F16H48/22 ,  F16H48/28 ,  F16H48/285 ,  F16H48/38 ,  F16H48/40 ,  F16H55/06 ,  F16H57/08

CPC分类号： F16H1/28 ,  F16H48/10 ,  F16H48/22 ,  F16H55/06 ,  F16H2048/04

摘要： A sun gear 6 is concentrically, rotatably disposed inside an internal gear 4. Plural planet gears 8, carried by a planetary carrier 10, are disposed between and in meshing engagement with the internal gear 4 and the sun gear 6. The planetary carrier 10 is connected to a shaft extending from an engine while the internal gear 4 and the sun gear 6 are connected to output shafts. The internal gear 4 is molded by a plastic working, followed by a thermal treatment including soft-nitriding, a nitriding and a carburizing hardening step. The inner surface of the internal gear 4 is formed with internal gear teeth 4b, except for an axial portion 4d, while a spline groove 4a is formed on the outer surface of the internal gear 4 at a location corresponding to the portion 4d where no internal teeth 4b are formed for engagement with a spline 2a on a housing 2. The internal gear 4 is reduced in size while improving the mechanical strength thereof.

摘要翻译： 太阳齿轮6同心地可旋转地设置在内齿轮4的内部。由行星架10承载的多个行星齿轮8设置在内齿轮4和太阳齿轮6之间并与内齿轮4和太阳轮6啮合。行星架10 连接到从发动机延伸的轴，而内齿轮4和太阳齿轮6连接到输出轴。 内齿轮4通过塑性加工成型，然后进行包括软氮化，氮化和渗碳硬化步骤的热处理。 内齿轮4的内表面形成有内齿轮齿4b，除了轴向部分4d之外，而在内齿轮4的外表面上形成花键槽4a的位置对应于部分4 d，其中没有内齿形成用于与壳体2上的花键2a接合。内齿轮4的尺寸减小，同时提高其机械强度。