摘要:
A latch type level shift circuit includes an internal power supply potential generating circuit for generating first and second internal power supply potentials; a latch circuit having first and second nodes and driven by the first and second internal power supply potentials; a level shifter having first and second output terminals and driven by the first internal power supply potential and a fixed potential; a first MOS transistor having a gate applied with the fixed potential; and a second MOS transistor having a gate applied with the fixed potential. The first MOS transistor is connected between the first node and the first output terminal, and the second MOS transistor is connected between the second node and the second output terminal. The internal power supply potential generating circuit may be used to change the values of the first and second internal power supply potentials by setting the first internal power supply potential to the fixed potential and by setting the second internal power supply potential to a negative potential at the time of an erase operation.
摘要:
A pattern constituted of a main bit line and four sub-bit lines is repeated around a column sub-selector of the flash EEPROM employing a double bit architecture having four block selection transistors per pitch of the pattern. In the flash EEPROM having a memory cell array and a column selector divided into a plurality of cell blocks 11i and a plurality of column sub selectors 12i, respectively, the column sub-selector including repeated patterns each having four sub bit lines (SBLs) and a single main bit line (MBL) arranged in a column direction. In a pitch of the repeating pattern, active regions for four block selection transistors (BSTs) are arranged. Gate wiring layers of each of the block selection transistors are arranged above the active region in a row direction and four block decode lines (BDLi) are arranged above the active region in the row direction.
摘要:
A semiconductor circuit comprises an I-type of NMOS transistors N15 and N16 connected between a power supply voltage VDD and a ground electrode. The gate electrode of the NMOS transistor N15 is set to a reference voltage VREF that is lower than the power supply voltage VDD. The drain voltage VD of the NMOS transistor N16 is almost equal to the reference voltage VREF, and the NMOS transistor N16 acts in a linear region. Accordingly, the NMOS transistor N16 acts in the same manner as the resistor element and has no influence on change of the concentration of the diffusion resistor or the power supply voltage VDD.
摘要:
A nonvolatile semiconductor memory device includes a multi-layer insulating film having at least charge storage layers and formed on bottom surfaces and both side surfaces of a plurality of trench portions respectively formed in portions between the plurality of active areas formed in a first direction, a plurality of gate electrodes filled in internal portions of the plurality of trench portions with the multi-layer insulating film, a plurality of first metal interconnections formed in a second direction and each functioning as a bit line or source line, and a plurality of first conductivity-type diffusion layer regions arranged in a staggered form in corresponding portions of the plurality of active areas which intersect with the plurality of first metal interconnections. The device further includes a plurality of connection contacts form to respectively connect the plurality of first conductivity-type diffusion layer regions to the plurality of first metal interconnections.
摘要:
The local row decoder includes a first MOS transistor of a first conductivity type having one end connected to the local word line, the other end supplied with a first voltage, and a gate connected to the global word line, and a second MOS transistor of a second conductivity type having one end connected to the local word line, the other end supplied with a second voltage, and a gate connected to the global word line. The global row decoder is capable of independently selecting either a first global word line or a second global word line. The first global word line is connected to the first MOS transistor and the second MOS transistor both connected to any one of the local word lines. The second global word line is connected to the first MOS transistor and the second MOS transistor both connected to another adjacent local word line.
摘要:
A semiconductor memory device includes a memory cell array, word lines, and a row decoder. The memory cell array includes memory cells arranged in a matrix. The memory cell includes a first MOS transistor having a charge accumulation layer and a control gate and a second MOS transistor. The word line connects the control gates of the first MOS transistors. The row decoder includes a first address decode circuit, a second address decode circuit, and a transfer gate. The first address decode circuit decodes m bits in a n-bit row address signal (m and n are a natural number satisfying the expression m
摘要:
A non-volatile semiconductor memory device comprises a redundant memory cell to store address data of a defect cell in a memory cell array. A first decoder circuit is given a first drive voltage to provide a control signal to the redundant memory cell. A dummy memory cell has a threshold voltage corresponding to the redundant memory cell. A second decoder circuit is given a second drive voltage corresponding to the first drive voltage to provide a control signal to the dummy memory cell. A comparator circuit compares data to be read out of the dummy memory cell with data actually read out of the dummy memory cell.
摘要:
A semiconductor memory device includes memory cells, a memory cell array, a first voltage generating circuit, a reference voltage generating circuit, and a first voltage control circuit. Each of the memory cells includes a first MOS transistor comprising a floating gate and a control gate formed on the floating gate. The memory cell array includes the memory cells arranged in a matrix. The first voltage generating circuit generates a first positive voltage. The reference voltage generating circuit generates a first reference voltage. The first voltage control circuit sets the first positive voltage at a voltage value based on the first reference voltage and outputs a resulting second positive voltage. An output impedance of the first voltage control circuit varies depending on the number of bits into which data is simultaneously written. The second positive voltage is used to write and erase data into and from the memory cells.
摘要:
A semiconductor memory device comprises a first to a fourth semiconductor layer of a first conductivity type which are formed in a fifth semiconductor layer of a second conductivity type in such a manner that they are isolated from one another, memory cells each of which includes a first MOS transistor formed on the first semiconductor layer, a second and a third MOS transistor which are formed on the second and third semiconductor layers, respectively, a first metal wiring layer which connects the gate of the first MOS transistor to the source or drain of at least one of the second and third MOS transistors, and a first contact plug which connects the fourth semiconductor layer to the first metal wiring layer. The first wiring layer is in the lowest layer of the metal wiring lines connected to the gate of the first MOS transistor.
摘要:
A semiconductor memory device comprises a memory cell array, word lines, select gate lines, and switch elements. The memory cell array includes a plurality of memory cells arranged in a matrix. Each of the memory cells includes a first MOS transistor having a charge accumulation layer and a control gate and a second MOS transistor which has a drain connected to a source of the first MOS transistor. Each of the word lines connects commonly the control gates of the first MOS transistors in a same row. Each of the select gate lines connects commonly the gates of the second MOS transistors in a same row. The switch elements, in an erase operation, electrically connect the select gate lines to a semiconductor substrate in which the memory cell array is formed.