Abstract:
Deviation ring for paste, comprising an annular rebound wall for a self-distributing centrifuge, positioned opposite the discharge slot of the centrifuge, the tangent of which is at an angle α of 3 to 60°, as seen over the entire opening width of the discharge slot.
Abstract:
Process for temporary fixing of a polymeric layer material on rough surfaces, wherein the polymer layer material encompasses at least one viscoelastic layer, wherein the process involves laying the layer material on the rough surface, introducing energy in order to lower the viscosity of the at least one viscoelastic layer, in such a way that flow onto the rough surface takes place, and the layer is crosslinked in such a way as to produce a layer which has at least some elastomeric character and which at least to some extent wets the rough surface.
Abstract:
A pack for adhesive sheets which a) are detachable without residue or destruction by extensive stretching in the direction of their bond plane and b) have on one or both sides a pressure-sensitive adhesive composition based on an elastomer resin mixture, wherein c) the pack is UV-impermeable and d) comprises sheetlike liner materials for the regions of the pressure-sensitive adhesive composition that are to be bonded, and/or an outer packaging for the adhesive sheet, and/or an individual pack with transparent packaging elements.
Abstract:
A pressure sensitive adhesive for single-sided or double-sided adhesive sheet strips which can be redetached without residue or destruction by extensive stretching in the plane of the bond, composed of a mixture comprising a block copolymer and a tackifier, characterized in that at least one compound which is swellable in H2O is incorporated into the mixture.
Abstract translation:一种用于单面或双面粘合片条的压敏粘合剂,其可以通过在包含嵌段共聚物和增粘剂的混合物组成的粘结平面中的广泛拉伸而被残留或破坏而重新附着,其特征在于至少 将一种在H 2 O 2中溶胀的化合物加入到混合物中。
Abstract:
The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.
Abstract:
Disclosed is a pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips that are redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling. The pressure-sensitive adhesive is composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), wherein the fraction of liquid resin accounts for at least 40% by weight, based on the total amount of resin. Also disclosed are strips formed from the adhesive and the use of the strips to form redetachable bonds.
Abstract:
The invention relates to a peelable adhesive strip which is coated with a pressure-sensitive adhesive at least one side. Said adhesive strip is constituted of the following layers: a core layer having an elongation at tear of at least 300%, an external carrier layer having an elongation at tear of not more than 120% and at least some sections of which are connected to the core layer in such a manner that it becomes detached from the core layer when the same is stretched, a first adhesive layer at least some sections of which are applied to the side of the external carrier layer and which is opposite the side connected to the core layer.
Abstract:
Adhesive tape intended more particularly for wrapping cables, comprising a textile backing and, coated on at least one side thereof, an adhesive comprising at least one vinylaromatic block copolymer and an at least partly hydrogenated tackifier resin.
Abstract:
Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.