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公开(公告)号:US08557084B2
公开(公告)日:2013-10-15
申请号:US12766645
申请日:2010-04-23
CPC分类号: H01L51/5246 , C09J153/025 , H01L2251/5338
摘要: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
摘要翻译: 本发明涉及作为密封电子装置相对于渗透剂的方法,其中提供了基于酸改性或酸酐改性的乙烯基芳族嵌段共聚物的压敏粘合剂,并且其中施加了压敏粘合剂 到和/或周围要被封装的电子装置的区域。
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公开(公告)号:US20110121356A1
公开(公告)日:2011-05-26
申请号:US12996716
申请日:2009-11-18
CPC分类号: H01L51/5246 , C03C27/10 , C08L2666/02 , C09J153/00 , C09J153/005 , C09J153/02 , C09J153/025 , Y10T428/28 , Y10T428/2852
摘要: Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
摘要翻译: 用于将电子装置封装在渗透物中的方法,其中将基于丁烯嵌段共聚物的压敏粘合剂物质施加到待包封的电子装置的区域周围。
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公开(公告)号:US20110036496A1
公开(公告)日:2011-02-17
申请号:US12766645
申请日:2010-04-23
CPC分类号: H01L51/5246 , C09J153/025 , H01L2251/5338
摘要: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
摘要翻译: 本发明涉及作为密封电子装置相对于渗透剂的方法,其中提供了基于酸改性或酸酐改性的乙烯基芳族嵌段共聚物的压敏粘合剂,并且其中施加了压敏粘合剂 到和/或周围要被封装的电子装置的区域。
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4.
公开(公告)号:US09230829B2
公开(公告)日:2016-01-05
申请号:US13992269
申请日:2011-11-03
CPC分类号: H01L21/56 , H01L21/561 , H01L23/3121 , H01L51/5253 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.
摘要翻译: 本发明涉及一种用于将电子装置封装在穿透物上的方法,其中电子装置可在衬底上获得,其中在真空中,包围要被封装的电子装置的该区域的衬底区域, 优选地,所述区域和待封装的电子装置的区域与包含至少一种粘合剂化合物和复合材料的片材接触。 本发明还涉及一种用于实现该方法的装置以及由此产生的封装的电子装置。
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公开(公告)号:US09206279B2
公开(公告)日:2015-12-08
申请号:US13563021
申请日:2012-07-31
IPC分类号: C08F290/06 , B41M5/24 , C08F290/14 , C09D151/08
CPC分类号: C08F290/061 , B41M5/24 , C08F290/067 , C08F290/141 , C08F290/147 , C09D151/08 , Y10T428/24802 , Y10T428/24917 , Y10T428/2848 , Y10T428/31699 , Y10T428/31855 , Y10T428/31909 , C08F222/1006
摘要: Laser-inscribable film, comprising a contrast layer based on a cured acrylate coating composition and, arranged above the contrast layer, an engraving layer, where the cured acrylate coating composition is based on a composition comprising from 30 to 80% by weight of a trifunctional oligomer A, from 0 to 20% by weight of a trifunctional monomer B, from 1 to 30% by weight of a difunctional monomer C, and from 2 to 40% by weight of a colorant pigment.
摘要翻译: 激光可刻印膜,包括基于固化的丙烯酸酯涂料组合物的对比层,并且在对比层上方设置有雕刻层,其中固化的丙烯酸酯涂料组合物基于包含30至80重量%的三官能 低聚物A,0至20重量%的三官能单体B,1至30重量%的双官能单体C和2至40重量%的着色剂颜料。
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6.
公开(公告)号:US20130264724A1
公开(公告)日:2013-10-10
申请号:US13992269
申请日:2011-11-03
IPC分类号: H01L21/56
CPC分类号: H01L21/56 , H01L21/561 , H01L23/3121 , H01L51/5253 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.
摘要翻译: 本发明涉及一种用于将电子装置封装在穿透物上的方法,其中电子装置可在衬底上获得,其中在真空中,包围要被封装的电子装置的该区域的衬底区域, 优选地,所述区域和待封装的电子装置的区域与包含至少一种粘合剂化合物和复合材料的片材接触。 本发明还涉及一种用于实现该方法的装置以及由此产生的封装的电子装置。
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公开(公告)号:US20130040136A1
公开(公告)日:2013-02-14
申请号:US13563021
申请日:2012-07-31
IPC分类号: B32B27/08 , B32B37/24 , B29C39/00 , B32B33/00 , C09D175/14
CPC分类号: C08F290/061 , B41M5/24 , C08F290/067 , C08F290/141 , C08F290/147 , C09D151/08 , Y10T428/24802 , Y10T428/24917 , Y10T428/2848 , Y10T428/31699 , Y10T428/31855 , Y10T428/31909 , C08F222/1006
摘要: Laser-inscribable film, comprising a contrast layer based on a cured acrylate coating composition and, arranged above the contrast layer, an engraving layer, where the cured acrylate coating composition is based on a composition comprising from 30 to 80% by weight of a trifunctional oligomer A, from 0 to 20% by weight of a trifunctional monomer B, from 1 to 30% by weight of a difunctional monomer C, and from 2 to 40% by weight of a colorant pigment.
摘要翻译: 激光可刻印膜,包括基于固化的丙烯酸酯涂料组合物的对比层,并且在对比层上方设置有雕刻层,其中固化的丙烯酸酯涂料组合物基于包含30至80重量%的三官能 低聚物A,0至20重量%的三官能单体B,1至30重量%的双官能单体C和2至40重量%的着色剂颜料。
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公开(公告)号:US08771459B2
公开(公告)日:2014-07-08
申请号:US12774788
申请日:2010-05-06
CPC分类号: C09J153/025 , H01L51/5246 , H01L2251/5338
摘要: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
摘要翻译: 本发明涉及一种相对于渗透剂封装电子装置的方法,其中提供基于酸改性或酸酐改性的乙烯基芳族嵌段共聚物的至少部分交联的热熔粘合剂,其中压敏粘合剂 被施加到要被封装的电子装置的区域和/或周围。
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公开(公告)号:US08460969B2
公开(公告)日:2013-06-11
申请号:US12996716
申请日:2009-11-18
CPC分类号: H01L51/5246 , C03C27/10 , C08L2666/02 , C09J153/00 , C09J153/005 , C09J153/02 , C09J153/025 , Y10T428/28 , Y10T428/2852
摘要: Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
摘要翻译: 用于将电子装置封装在渗透物中的方法,其中将基于丁烯嵌段共聚物的压敏粘合剂物质施加到待包封的电子装置的区域周围。
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公开(公告)号:US20120064318A1
公开(公告)日:2012-03-15
申请号:US13264355
申请日:2010-04-08
CPC分类号: B32B27/08 , B32B15/08 , H01L51/448 , H01L51/5256 , H01L2251/5338 , H01M14/005 , Y10T428/24975
摘要: A novel, transparent, non-substrate-based permeation barrier film for encapsulating electronic, more particularly optoelectronic, assemblies consists of a first polymer layer (10), a first inorganic barrier layer (20), at least one at least partially organic compensation layer (30), at least one further inorganic barrier layer (21) and also at least one further polymer layer (11), wherein the polymer layers and the inorganic barrier layers, respectively, can be made of the same or different material, wherein the inorganic barrier layers have a thickness of between 2 and 1000 nm, and wherein the polymer layers and the at least partially organic compensation layer have a thickness of less than 5 [mu]m, preferably between 0.5 and 4 [mu]m. The film can have, on one or both sides, an auxiliary carrier attached by means of a re-releasable adhesive. It is also possible for a plurality of films to be laminated to one another by means of a further at least partially organic compensation layer.
摘要翻译: 用于封装电子,更具体地,光电子组件的新颖的,透明的,非基底的渗透阻挡膜由第一聚合物层(10),第一无机阻挡层(20),至少一个至少部分有机补偿层 (30),至少一个另外的无机阻挡层(21)和至少一个另外的聚合物层(11),其中聚合物层和无机阻挡层分别可以由相同或不同的材料制成,其中 无机阻挡层具有2至1000nm的厚度,并且其中聚合物层和至少部分有机补偿层具有小于5μm,优选0.5至4μm的厚度。 该膜可以在一侧或两侧上具有通过可再剥离粘合剂附着的辅助载体。 还可以通过另外的至少部分有机补偿层将多个膜彼此层压。
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