利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

30 条记录 (耗时 0.031 秒)

    Method and apparatus for writing servo tracks of a magnetic disk unit which uses a probe to control the positioning of the head
    23.
    发明授权
    Method and apparatus for writing servo tracks of a magnetic disk unit which uses a probe to control the positioning of the head 失效
    用于写入使用探头来控制头部定位的磁盘单元的伺服磁道的方法和装置

    公开(公告)号：US5610777A

    公开(公告)日：1997-03-11

    申请号：US608206

    申请日：1996-02-28

    申请人： Hien P. Dang ,  Takahiro Nakagawa ,  Yoshiyasu Nakamoto ,  Muthuthamby Sri-Jayantha ,  Hiroyuki Suzuki

    发明人： Hien P. Dang ,  Takahiro Nakagawa ,  Yoshiyasu Nakamoto ,  Muthuthamby Sri-Jayantha ,  Hiroyuki Suzuki

    IPC分类号： G11B21/08 ,  G11B5/596 ,  G11B21/10

    CPC分类号： G11B5/59633

    摘要： The present invention relates to a method and apparatus for writing servo tracks of a magnetic disk unit, and has an object of providing a servo track writing method and apparatus which can reduce a mechanical vibration of a head in the steady state and can shorten a settling time of the system. A detecting face is set in the vicinity of a head arm end portion 22 of a magnetic disk unit 2, and a capacitance probe 28 is provided as a gap detecting means for detecting a gap in a head moving direction between the detecting face and the head arm end portion 22. Further provided are a rotary positioner 26 as a positioning means for moving the capacitance probe 28 in the head moving direction to position it at a target position, and a head drive system control means for moving a head 14 of the magnetic disk unit 2 so that the gap is kept constant, to position the head 14 at a predetermined servo track writing position.

    摘要翻译： 本发明涉及一种用于写入磁盘单元的伺服磁道的方法和装置，其目的在于提供一种伺服磁道写入方法和装置，其能够降低磁头在稳定状态下的机械振动并且可以缩短沉降 系统的时间。 将检测面设置在磁盘单元2的头臂端部22附近，并且设置电容探针28作为间隙检测装置，用于检测检测面和头部之间的头移动方向上的间隙 还设置有作为定位装置的旋转定位器26，该定位装置用于使磁头移动方向移动电容探针28以将其定位在目标位置;以及磁头驱动系统控制装置，用于移动磁头14的磁头14 磁盘单元2使得间隙保持恒定，以将磁头14定位在预定的伺服磁道写入位置。

    Structures to enhance cooling of computer memory modules
    25.
    发明申请
    Structures to enhance cooling of computer memory modules 失效
    用于增强计算机内存模块冷却的结构

    公开(公告)号：US20080116571A1

    公开(公告)日：2008-05-22

    申请号：US11604152

    申请日：2006-11-22

    申请人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

    发明人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

    IPC分类号： H01L23/467

    CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.

    摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。

    Remote monitoring and servicing of computer data centers
    26.
    发明授权
    Remote monitoring and servicing of computer data centers 失效
    远程监控和维修计算机数据中心

    公开(公告)号：US07315768B2

    公开(公告)日：2008-01-01

    申请号：US11354678

    申请日：2006-02-15

    申请人： Hien P. Dang ,  Sri M. Sri-Jayantha

    发明人： Hien P. Dang ,  Sri M. Sri-Jayantha

    IPC分类号： G01K7/00

    CPC分类号： G05B15/02

    摘要： A method of controlling an environmental condition within a building space having a plurality of devices sensitive to an environmental condition. The method includes the steps of: (a) sensing an environmental condition with plurality of monitors, each monitor having (i) a sensor to detect the environmental condition and generate a characteristic sensing signal and (ii) a transmitter to transmit a data signal in response to the sensing signal; (b) transmitting the data signal from the plurality of sensors in response to the sensing signal; and (c) receiving and processing the data signal at a controller which controls a spatially fixed environmental modulator which, in response to the data signal, controls the environmental condition within the building space. A system for controlling an environmental condition within a building space having a plurality of devices sensitive to an environmental condition is also provided.

    摘要翻译： 一种在具有对环境条件敏感的多个装置的建筑空间内控制环境状况的方法。 该方法包括以下步骤：（a）利用多个监视器感测环境条件，每个监视器具有（i）用于检测环境条件并产生特性感测信号的传感器，以及（ii）发送器，用于将数据信号发送到 响应感测信号; （b）响应于所述感测信号从所述多个传感器发送所述数据信号; 以及（c）在控制空间固定环境调制器的控制器处接收和处理数据信号，所述环境调制器响应于数据信号控制建筑空间内的环境状况。 还提供一种用于控制具有对环境条件敏感的多个装置的建筑空间内的环境状况的系统。

    Structures to enhance cooling of computer memory modules
    28.
    发明授权
    Structures to enhance cooling of computer memory modules 失效
    用于增强计算机内存模块冷却的结构

    公开(公告)号：US07612446B2

    公开(公告)日：2009-11-03

    申请号：US11604152

    申请日：2006-11-22

    申请人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

    发明人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

    IPC分类号： H01L23/34 ,  H05K7/20 ,  H01L21/00 ,  F28F7/00

    CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.

    摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。