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1.发明授权Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit 有权用于实时估计和预测微处理器单元的热状态的方法和系统公开(公告)号：US08235593B2
公开(公告)日：2012-08-07
申请号：US12756781
申请日：2010-04-08
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
CPC分类号： G06F1/206
摘要： A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip.
摘要翻译： 一种判断芯片的温度的方法，包括使用有限的一组温度传感器并使用功耗知识，估计芯片表面的温度并预测芯片的未来温度，知道要处理的指令流特性 由芯片。
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2.发明授权Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit 有权用于实时估计和预测微处理器单元的热状态的方法和系统公开(公告)号：US08096705B2
公开(公告)日：2012-01-17
申请号：US12756733
申请日：2010-04-08
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
CPC分类号： G06F1/206
摘要： A method of estimating temperature of a transient nature of a thermal system, including, without a temperature measurement being made available, determining a drive current and thermal parameters of the thermal system.
摘要翻译： 一种估计热系统的瞬态特性的温度的方法，包括在没有提供温度测量的情况下确定热系统的驱动电流和热参数。
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公开(公告)号：US07759787B2
公开(公告)日：2010-07-20
申请号：US11935834
申请日：2007-11-06
IPC分类号： H01L23/053 , H01L23/12
CPC分类号： H05K1/0271 , H01L23/49833 , H01L23/49838 , H01L2924/0002 , H05K3/0005 , H05K3/4644 , H05K2201/09136 , H05K2201/09227 , H05K2203/1572 , Y10T29/49004 , Y10T29/49155 , H01L2924/00
摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。
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公开(公告)号：US20090114429A1
公开(公告)日：2009-05-07
申请号：US11935834
申请日：2007-11-06
CPC分类号： H05K1/0271 , H01L23/49833 , H01L23/49838 , H01L2924/0002 , H05K3/0005 , H05K3/4644 , H05K2201/09136 , H05K2201/09227 , H05K2203/1572 , Y10T29/49004 , Y10T29/49155 , H01L2924/00
摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。
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5.发明申请METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT 失效用于实时估算和预测微处理器单元热状态的方法和系统公开(公告)号：US20080215283A1
公开(公告)日：2008-09-04
申请号：US12021242
申请日：2008-01-28
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
IPC分类号： G01K13/00
CPC分类号： G06F1/206
摘要： An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache.
摘要翻译： 一种用于预测包括半导体芯片的系统的热状态的装置包括形成在半导体芯片上的用于测量半导体芯片的第一位置处的温度的多个传感器，用于开发用于估计第二位置处的温度的模型的模型显影器 所述半导体芯片不同于所述第一位置，映射单元，用于将与所述芯片相关联的指令高速缓存到热分组的XY分布量子序列中;以及预测单元，用于基于所述芯片的未来温度预测 执行指令缓存中的指令流。
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6.发明授权Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit 失效用于实时估计和预测微处理器单元的热状态的方法和系统公开(公告)号：US07748895B2
公开(公告)日：2010-07-06
申请号：US11930633
申请日：2007-10-31
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
CPC分类号： G06F1/206
摘要： A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.
摘要翻译： 预测瞬态热系统的热状态的方法（和系统）包括组合传感器输出和热参数以构成瞬态热系统内部温度的一致性估计集合。
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7.发明授权Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit 失效用于实时估计和预测微处理器单元的热状态的方法和系统公开(公告)号：US07695188B2
公开(公告)日：2010-04-13
申请号：US12021242
申请日：2008-01-28
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
CPC分类号： G06F1/206
摘要： An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache.
摘要翻译： 一种用于预测包括半导体芯片的系统的热状态的装置包括形成在半导体芯片上的用于测量半导体芯片的第一位置处的温度的多个传感器，用于开发用于估计第二位置处的温度的模型的模型显影器 所述半导体芯片不同于所述第一位置，映射单元，用于将与所述芯片相关联的指令高速缓存到热分组的XY分布量子序列中;以及预测单元，用于基于所述芯片的未来温度预测 执行指令缓存中的指令流。
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公开(公告)号：US07673158B2
公开(公告)日：2010-03-02
申请号：US11933910
申请日：2007-11-01
申请人： Hien P. Dang , Arun Sharma , Sri M. Sri-Jayantha
发明人： Hien P. Dang , Arun Sharma , Sri M. Sri-Jayantha
IPC分类号： G06F1/00
CPC分类号： G06F9/30181 , G06F1/206 , G06F9/30083 , G06F9/30145 , G06F9/30167 , G06F9/383 , G06F9/3885 , Y02D10/16
摘要： A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.
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9.发明申请METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT 有权用于实时估算和预测微处理器单元热状态的方法和系统公开(公告)号：US20100262399A1
公开(公告)日：2010-10-14
申请号：US12756733
申请日：2010-04-08
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
IPC分类号： G06F15/00
CPC分类号： G06F1/206
摘要： A method of estimating temperature of a transient nature of a thermal system, including, without a temperature measurement being made available, determining a drive current and thermal parameters of the thermal system.
摘要翻译： 一种估计热系统的瞬态特性的温度的方法，包括在没有提供温度测量的情况下确定热系统的驱动电流和热参数。
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公开(公告)号：US20100218364A1
公开(公告)日：2010-09-02
申请号：US12775970
申请日：2010-05-07
IPC分类号： H05K3/22
CPC分类号： H05K1/0271 , H01L23/49833 , H01L23/49838 , H01L2924/0002 , H05K3/0005 , H05K3/4644 , H05K2201/09136 , H05K2201/09227 , H05K2203/1572 , Y10T29/49004 , Y10T29/49155 , H01L2924/00
摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。
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