公开(公告)号：US20170229296A1

公开(公告)日：2017-08-10

申请号：US15329129

申请日：2015-06-18

Applicant: ULVAC, INC.

Inventor： Shinya Nakamura ,  Yoshihiro Ikeda ,  Yoshinori Fujii ,  Yuusuke Miyaguchi

IPC: H01J37/34 ,  C23C14/08 ,  C23C14/34

CPC classification number: H01J37/3435 ,  C23C14/081 ,  C23C14/3407 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3497

Abstract: A target assembly is provided which is capable of preventing abnormal discharging from being generated between a projected portion of a backing plate and a side surface of a target, and which is also capable of surely preventing a bonding material that bonds the target and the backing plate together from seeping to the outside. The backing plate has a projected portion which is projected outward beyond an outer peripheral end of the target, and an annular shield plate is disposed to lie opposite to the projected portion so as to enclose the target in a state in which the target assembly is assembled onto a sputtering apparatus (SM). That portion of the backing plate to which the target gets bonded is defined as a bonding portion, and this bonding portion is protruded relative to the projected portion.

公开(公告)号：US20170213706A1

公开(公告)日：2017-07-27

申请号：US15329097

申请日：2016-03-15

Applicant: ULVAC, INC.

Inventor： Yoshinori Fujii ,  Shinya Nakamura

IPC: H01J37/32 ,  C23C14/08 ,  C23C14/35 ,  C23C14/52 ,  C23C14/54 ,  H01J37/34 ,  C23C14/50

CPC classification number: H01J37/32697 ,  C23C14/081 ,  C23C14/345 ,  C23C14/35 ,  C23C14/50 ,  C23C14/52 ,  C23C14/542 ,  H01J37/32715 ,  H01J37/3405 ,  H01J37/3426 ,  H01J37/347 ,  H01J37/3476

Abstract: Provided is a RF sputtering apparatus in which film forming can efficiently be made by suppressing an amount of reverse sputtering at a substrate. The RF sputtering apparatus SM, according to this invention, in which RF power is applied in vacuum to a target to thereby perform film forming processing on one surface (Wa) of the substrate (W) is provided with a stage for holding the substrate in a state in which one surface thereof is left open in an electrically insulated state. The stage has a dented portion on such a holding surface as is adapted to hold thereon the substrate. A movable body, which is movable toward, and away from, the substrate, and is connected to grounding is disposed in a space defined by such an opposite surface of the substrate as is opposite to said one surface and an outline of the dented portion.