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公开(公告)号：US09972479B2
公开(公告)日：2018-05-15
申请号：US15329129
申请日：2015-06-18
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Yoshihiro Ikeda , Yoshinori Fujii , Yuusuke Miyaguchi
CPC classification number: H01J37/3435 , C23C14/081 , C23C14/3407 , H01J37/3423 , H01J37/3426 , H01J37/3497
Abstract: A target assembly is provided which is capable of preventing abnormal discharging from being generated between a projected portion of a backing plate and a side surface of a target, and which is also capable of surely preventing a bonding material that bonds the target and the backing plate together from seeping to the outside. The backing plate has a projected portion which is projected outward beyond an outer peripheral end of the target, and an annular shield plate is disposed to lie opposite to the projected portion so as to enclose the target in a state in which the target assembly is assembled onto a sputtering apparatus (SM). That portion of the backing plate to which the target gets bonded is defined as a bonding portion, and this bonding portion is protruded relative to the projected portion.
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公开(公告)号：US20210214841A1
公开(公告)日：2021-07-15
申请号：US15733976
申请日：2019-07-23
Applicant: ULVAC, INC.
Inventor： Yoshinori Fujii , Shinya Nakamura
Abstract: A sputtering apparatus SM has: a vacuum chamber in which a substrate and a target are disposed to lie opposite to each other; a plasma generating means generating a plasma inside the vacuum chamber; and a magnet unit disposed above the target. The magnet unit has a plurality of magnets with different polalities on a substrate side. A leakage magnetic field in which a line passing through a position where a vertical component of the magnetic field becomes zero is closed in an endless manner, is caused to locally act on such a space below the target as is positioned between the center of the target and a periphery thereof. The magnet unit is divided, on an imaginary line extending from the center of the target toward a periphery thereof, into a plurality of segments each having a plurality of magnets.
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公开(公告)号：US10100399B2
公开(公告)日：2018-10-16
申请号：US15507816
申请日：2016-03-15
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Hiroki Yamamoto
Abstract: A cathode assembly is provided in which, while preventing the occurrence of abnormal electric discharging between a projected portion of a backing plate and a side surface of a target, particles can be prevented from being generated. The cathode assembly for a sputtering apparatus of this invention has: a target made of an insulating material; a backing plate bonded to one surface of the target; and, where such a side of the backing plate as is on the side of the target is defined as a lower side, an annular shield plate disposed to lie opposite to the lower side of that projected portion of the backing plate which is projected outward beyond an outer peripheral end of the target. The cathode assembly has a bonding portion arranged to be protruded relative to the projected portion. An inner peripheral edge portion of the shield plate is positioned in a clearance between that extended portion of the target which is extended outward beyond the bonding portion in a state in which the target is kept bonded to the bonding portion, and the projected portion of the backing plate.
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公开(公告)号：US20180155821A1
公开(公告)日：2018-06-07
申请号：US15571574
申请日：2016-05-11
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Yoshinori Fujii
CPC classification number: C23C14/35 , C23C14/081 , C23C14/3407 , H01J37/321 , H01J37/3408 , H01J37/3455 , H01J37/347
Abstract: The magnetron sputtering apparatus SM has: a vacuum chamber; and a cathode unit C detachably mounted on the vacuum chamber. The cathode unit has: a target which is disposed to face an inside of the vacuum chamber; and a magnet unit disposed to that side of the target which is opposite to a sputtering surface, thereby generating a leakage magnetic field on a side of the sputtering surface. The sputtering apparatus SM of this invention, having the above-mentioned arrangement has a drive source for driving the magnet unit to rotate with a target center serving as a center of rotation while the target is sputtered to form a film on a to-be-processed substrate. Auxiliary magnet units which cause a leakage magnetic field to function on the inside of the vacuum chamber are locally disposed on an external wall of the vacuum chamber or of a housing H of the cathode unit.
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公开(公告)号：US20170268097A1
公开(公告)日：2017-09-21
申请号：US15527754
申请日：2015-06-16
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Yoshihiro Ikeda , Yuusuke Miyaguchi , Kazuyoshi Hashimoto , Kengo Tsutsumi , Yoshinori Fujii
CPC classification number: C23C14/3407 , C23C14/081 , H01J37/3491
Abstract: A target assembly is provided in which an abnormal discharging between a projected portion of a backing plate and a side surface of the target is prevented and also in which a bonding material to bond the target and the backing plate can be surely prevented from seeping to the outside and also which is easy in reusing the backing plate. The target assembly according to this invention having: a target made of an insulating material; and a backing plate bonded to one surface of the target via a bonding material, the backing plate having a projected portion which is projected outward beyond an outer peripheral edge of the target, further has an annular insulating plate. The annular insulating plate: encloses a circumference of the target while maintaining a predetermined clearance to a side surface of the target; and covers that surface of the projected portion.
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Patent Agency Ranking
公开(公告)号：US11056323B2
公开(公告)日：2021-07-06
申请号：US16468521
申请日：2018-10-11
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Yukihito Tashiro
Abstract: A sputtering apparatus is provided with: a vacuum chamber having a target manufactured by sintering raw material powder; a magnet unit having a plurality of magnets disposed on the same surface above the target which is mounted on the vacuum chamber in a non-rotatable manner, in order to cause leakage magnetic field penetrating the target to function in uneven distribution on the sputtering surface; a rotary shaft which is disposed on the center line passing through the center of the target and is coupled to the magnet unit; and a drive motor for driving the rotary shaft to rotate, thereby rotating the magnet unit such that a function region of the leakage magnetic field on the sputtering surface revolves about an imaginary circle with the center of the target serving as the center.
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公开(公告)号：US20200080192A1
公开(公告)日：2020-03-12
申请号：US16468521
申请日：2018-10-11
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Yukihito Tashiro
Abstract: A sputtering apparatus is provided with: a vacuum chamber having a target manufactured by sintering raw material powder; a magnet unit having a plurality of magnets disposed on the same surface above the target which is mounted on the vacuum chamber in a non-rotatable manner, in order to cause leakage magnetic field penetrating the target to function in uneven distribution on the sputtering surface; a rotary shaft which is disposed on the center line passing through the center of the target and is coupled to the magnet unit; and a drive motor for driving the rotary shaft to rotate, thereby rotating the magnet unit such that a function region of the leakage magnetic field on the sputtering surface revolves about an imaginary circle with the center of the target serving as the center.
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公开(公告)号：US10233536B2
公开(公告)日：2019-03-19
申请号：US15507920
申请日：2016-06-10
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Yoshinori Fujii
Abstract: A method of discriminating a state of a sputtering apparatus in which, by sputtering a target, a film is formed on a substrate disposed to lie opposite to the target, the discrimination being made, prior to the film formation on the substrate, as to whether an atmosphere in the vacuum chamber is in a state fit for film formation. As the sputtering apparatus, use is made of one provided inside the vacuum chamber with an isolated space which is isolated from the vacuum chamber by an isolating means (6, 71˜73), the isolated space being for the target and the substrate to lie therein opposite to each other, the sputtering apparatus being so arranged that the isolated space is evacuated accompanied by the evacuation in the vacuum chamber. The vacuum chamber is evacuated to a predetermined set pressure and a gas is introduced therein in this state.
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公开(公告)号：US11230760B2
公开(公告)日：2022-01-25
申请号：US15733976
申请日：2019-07-23
Applicant: ULVAC, INC.
Inventor： Yoshinori Fujii , Shinya Nakamura
Abstract: A sputtering apparatus SM has: a vacuum chamber in which a substrate and a target are disposed to lie opposite to each other; a plasma generating means generating a plasma inside the vacuum chamber; and a magnet unit disposed above the target. The magnet unit has a plurality of magnets with different polarities on a substrate side. A leakage magnetic field in which a line passing through a position where a vertical component of the magnetic field becomes zero is closed in an endless manner, is caused to locally act on such a space below the target as is positioned between the center of the target and a periphery thereof. The magnet unit is divided, on an imaginary line extending from the center of the target toward a periphery thereof, into a plurality of segments each having a plurality of magnets.
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公开(公告)号：US20190194798A1
公开(公告)日：2019-06-27
申请号：US16326760
申请日：2018-03-06
Applicant: ULVAC, INC.
Inventor： Shinya Nakamura , Yukihito Tashiro
CPC classification number: C23C14/3407 , C23C14/34 , C23C14/351 , C23C14/505 , C23C14/56
Abstract: There is provided a cathode unit for a sputtering apparatus, having a construction in which a target can be replaced without opening a vacuum chamber to the atmosphere. The cathode unit having targets and being adapted to be mounted on a vacuum chamber has: a supporting frame mounted on an external wall of the vacuum chamber; an annular moveable base supported by the supporting frame in a manner to be movable toward or away from the vacuum chamber; a rotary shaft body rotatably supported by the movable base in a manner to be elongated through an inner space of the movable base in parallel with a sputtering surface of the target; provided an axial direction of the rotary shaft body is defined to be an X-axis direction, and a forward or backward direction orthogonal to the X-axis direction of the movable base is defined to be a Z-axis direction.
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