公开(公告)号：US20170268097A1

公开(公告)日：2017-09-21

申请号：US15527754

申请日：2015-06-16

Applicant: ULVAC, INC.

Inventor： Shinya Nakamura ,  Yoshihiro Ikeda ,  Yuusuke Miyaguchi ,  Kazuyoshi Hashimoto ,  Kengo Tsutsumi ,  Yoshinori Fujii

IPC: C23C14/34 ,  H01J37/34

CPC classification number: C23C14/3407 ,  C23C14/081 ,  H01J37/3491

Abstract: A target assembly is provided in which an abnormal discharging between a projected portion of a backing plate and a side surface of the target is prevented and also in which a bonding material to bond the target and the backing plate can be surely prevented from seeping to the outside and also which is easy in reusing the backing plate. The target assembly according to this invention having: a target made of an insulating material; and a backing plate bonded to one surface of the target via a bonding material, the backing plate having a projected portion which is projected outward beyond an outer peripheral edge of the target, further has an annular insulating plate. The annular insulating plate: encloses a circumference of the target while maintaining a predetermined clearance to a side surface of the target; and covers that surface of the projected portion.

公开(公告)号：US10435783B2

公开(公告)日：2019-10-08

申请号：US15527754

申请日：2015-06-16

Applicant: ULVAC, INC.

Inventor： Shinya Nakamura ,  Yoshihiro Ikeda ,  Yuusuke Miyaguchi ,  Kazuyoshi Hashimoto ,  Kengo Tsutsumi ,  Yoshinori Fujii

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/08

Abstract: A target assembly is provided in which an abnormal discharging between a projected portion of a backing plate and a side surface of the target is prevented and also in which a bonding material to bond the target and the backing plate can be surely prevented from seeping to the outside and also which is easy in reusing the backing plate. The target assembly according to this invention having: a target made of an insulating material; and a backing plate bonded to one surface of the target via a bonding material, the backing plate having a projected portion which is projected outward beyond an outer peripheral edge of the target, further has an annular insulating plate. The annular insulating plate: encloses a circumference of the target while maintaining a predetermined clearance to a side surface of the target; and covers that surface of the projected portion.

公开(公告)号：US20180057929A1

公开(公告)日：2018-03-01

申请号：US15555316

申请日：2016-02-16

Applicant: ULVAC, INC.

Inventor： Yuusuke Miyaguchi ,  Shinya Nakamura ,  Yoshihiro Ikeda ,  Koukou Suu

IPC: C23C14/58 ,  C23C14/08 ,  C23C14/35 ,  H01J37/34 ,  H01L21/02

CPC classification number: C23C14/5806 ,  C23C14/08 ,  C23C14/081 ,  C23C14/34 ,  C23C14/35 ,  H01J37/3405 ,  H01L21/02178 ,  H01L21/02266 ,  H01L21/02356 ,  H01L21/32 ,  H01L27/115

Abstract: There are provided a method of depositing an aluminum oxide film, a method of forming the same, and a sputtering apparatus, which are capable of depositing an aluminum oxide film that can be crystallized at a low-temperature annealing process. In the method of depositing an aluminum oxide film according to this invention, a target made of aluminum oxide and a substrate W to be processed are disposed inside a vacuum chamber, a rare gas is introduced into the vacuum chamber, and HF power is applied to the target to thereby deposit by sputtering the aluminum oxide film on the surface of the substrate, the pressure in the vacuum chamber during film deposition is set to a range of 1.6 through 2.1 Pa.

公开(公告)号：US20170229296A1

公开(公告)日：2017-08-10

申请号：US15329129

申请日：2015-06-18

Applicant: ULVAC, INC.

Inventor： Shinya Nakamura ,  Yoshihiro Ikeda ,  Yoshinori Fujii ,  Yuusuke Miyaguchi

IPC: H01J37/34 ,  C23C14/08 ,  C23C14/34

CPC classification number: H01J37/3435 ,  C23C14/081 ,  C23C14/3407 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3497

Abstract: A target assembly is provided which is capable of preventing abnormal discharging from being generated between a projected portion of a backing plate and a side surface of a target, and which is also capable of surely preventing a bonding material that bonds the target and the backing plate together from seeping to the outside. The backing plate has a projected portion which is projected outward beyond an outer peripheral end of the target, and an annular shield plate is disposed to lie opposite to the projected portion so as to enclose the target in a state in which the target assembly is assembled onto a sputtering apparatus (SM). That portion of the backing plate to which the target gets bonded is defined as a bonding portion, and this bonding portion is protruded relative to the projected portion.

公开(公告)号：US09972479B2

公开(公告)日：2018-05-15

申请号：US15329129

申请日：2015-06-18

Applicant: ULVAC, INC.

Inventor： Shinya Nakamura ,  Yoshihiro Ikeda ,  Yoshinori Fujii ,  Yuusuke Miyaguchi

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/08

CPC classification number: H01J37/3435 ,  C23C14/081 ,  C23C14/3407 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3497

Abstract: A target assembly is provided which is capable of preventing abnormal discharging from being generated between a projected portion of a backing plate and a side surface of a target, and which is also capable of surely preventing a bonding material that bonds the target and the backing plate together from seeping to the outside. The backing plate has a projected portion which is projected outward beyond an outer peripheral end of the target, and an annular shield plate is disposed to lie opposite to the projected portion so as to enclose the target in a state in which the target assembly is assembled onto a sputtering apparatus (SM). That portion of the backing plate to which the target gets bonded is defined as a bonding portion, and this bonding portion is protruded relative to the projected portion.

公开(公告)号：US08883632B2

公开(公告)日：2014-11-11

申请号：US13737875

申请日：2013-01-09

Applicant: ULVAC, Inc.

Inventor： Youhei Endo ,  Shuji Kodaira ,  Yuta Sakamoto ,  Junichi Hamaguchi ,  Yohei Uchida ,  Yasushi Higuchi ,  Shinya Nakamura ,  Kazuyoshi Hashimoto ,  Yoshihiro Ikeda ,  Hiroaki Iwasawa

IPC: H01L21/768

CPC classification number: H01L21/76882 ,  H01L21/76883

Abstract: A manufacturing method of a device including: a first process in which a barrier film is formed on a substrate with a concave portion provided on one surface thereof so as to cover an inner wall surface of the concave portion; a second process in which a conductive film is formed so as to cover the barrier film; and a third process in which the conductive film is melted by a reflow method, wherein the method includes a process α between the second process and the third process, in which the substrate with the barrier film and the conductive film laminated thereon in this order is exposed to an atmosphere under a pressure A for a time period B, and wherein in the process α, control is carried out such that a product of the pressure A and the time period B is not greater than 6×10−4 [Pa·s].

Abstract translation: 一种器件的制造方法，包括：第一工序，其中在基板上形成阻挡膜，所述基板的一个表面上设有凹部以覆盖所述凹部的内壁面; 形成导电膜以覆盖阻挡膜的第二工序; 以及其中导电膜通过回流方法熔化的第三工艺，其中该方法包括第二工艺和第三工艺之间的工艺α，其中具有阻挡膜的衬底和其上的导电膜依次层压在其上 在压力A下暴露于气氛一段时间B，并且其中在过程α中，进行控制，使得压力A和时间段B的乘积不大于6×10-4 [Pa· s]。