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公开(公告)号:US09184419B2
公开(公告)日:2015-11-10
申请号:US14202430
申请日:2014-03-10
发明人: Prashant Mandlik , Peter Levermore , Huiqing Pang , Emory Krall , Jason Paynter , Ruiqing Ma
CPC分类号: H01L51/56 , H01L51/0097 , H01L2227/326 , H01L2251/5338 , Y02E10/549 , Y02P70/521
摘要: A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 10−1 Nm and 10−6 Nm, and the ratio of the critical strain energy release rate to the material density factor for the first device may be greater than 0.05 J m/Kg.
摘要翻译: 提供了用于制造第一装置的第一装置和方法。 第一器件可以包括柔性衬底和设置在柔性衬底上的至少一个有机发光器件(OLED)。 第一装置可以具有在10-1Nm至10-6Nm之间的弯曲刚度,并且第一装置的临界应变能释放速率与材料密度因子的比可以大于0.05Jm / Kg。
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公开(公告)号:US20140166990A1
公开(公告)日:2014-06-19
申请号:US13716448
申请日:2012-12-17
发明人: Ruiqing Ma , Jeff Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
CPC分类号: H01L51/56 , H01L51/001 , H01L51/0021 , H01L51/0029 , H01L51/0097 , H01L51/5212 , H01L2251/5338 , H01L2251/568 , Y02E10/549 , Y02P70/521
摘要: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
摘要翻译: 在柔性基板上形成微电子系统的方法包括在柔性基板的一侧上沉积多个层。 多个层中的每一个从多个源中的一个源沉积。 多个源中的每一个的周边的垂直投影不与柔性基板相交。 柔性基板在通过辊到辊进给和取出系统沉积多个层期间运动。
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公开(公告)号:US10483487B2
公开(公告)日:2019-11-19
申请号:US14582578
申请日:2014-12-24
申请人: UNIVERSAL DISPLAY CORPORATION , PRINCETON UNIVERSITY OFFICE OF TECHNOLOGY AND TRADEMARK LICENSING
发明人: Prashant Mandlik , Ruiqing Ma , Jeffrey Silvernail , Julia J. Brown , Lin Han , Sigurd Wagner , Luke Walski
IPC分类号: H01L51/52 , H01L51/56 , H01L25/075 , H01L27/32
摘要: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.
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公开(公告)号:US09735392B2
公开(公告)日:2017-08-15
申请号:US14988948
申请日:2016-01-06
发明人: Ruiqing Ma , Chuanjun Xia , Prashant Mandlik
IPC分类号: H01L51/52 , H01L51/00 , H01L51/56 , H01L31/048 , H01L31/18
CPC分类号: H01L51/5253 , H01L31/048 , H01L31/18 , H01L51/0005 , H01L51/004 , H01L51/0094 , H01L51/56 , H01L2251/568 , H01L2933/0025 , Y02E10/50
摘要: A method of preparing a surface for deposition of a thin film thereon, wherein the surface including a plurality of protrusions extending therefrom and having shadowed regions, includes locally treating at least one of the protrusions.
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公开(公告)号:US20170187006A1
公开(公告)日:2017-06-29
申请号:US15459044
申请日:2017-03-15
发明人: Ruiqing Ma , Jeff Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
CPC分类号: H01L51/56 , H01L51/001 , H01L51/0021 , H01L51/0029 , H01L51/0097 , H01L51/5212 , H01L2251/5338 , H01L2251/568 , Y02E10/549 , Y02P70/521
摘要: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
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公开(公告)号:US09455417B2
公开(公告)日:2016-09-27
申请号:US14534615
申请日:2014-11-06
发明人: Prashant Mandlik , Ruiqing Ma
CPC分类号: H01L51/5234 , H01L51/5253 , H01L51/5259 , H01L51/5275 , H01L51/56
摘要: A device includes a first electrode, an organic layer disposed over the first electrode and a second electrode disposed over the organic layer. The second electrode includes a first conductive layer, a first separation layer disposed over the first conductive layer, and a second conductive layer disposed over the first separation layer, wherein the first separation layer is not a continuous layer and the first and second conductive layers are bridged where the first separation layer is not continuous. The first separation layer has an extinction coefficient that is at least 10% different from the extinction coefficient of the first conductive layer at wavelength 500 nm, or an index of refraction that is at least 10% different from the index of refraction of the first conductive layer at wavelength 500 nm.
摘要翻译: 一种器件包括第一电极,设置在第一电极上的有机层和设置在有机层上的第二电极。 第二电极包括第一导电层,设置在第一导电层上的第一分离层和设置在第一分离层上的第二导电层,其中第一分离层不是连续层,第一和第二导电层是 桥接在第一分离层不连续的地方。 第一分离层具有与波长500nm处的第一导电层的消光系数至少10%不同的消光系数,或者与第一导电材料的折射率不同的折射率至少10% 波长500nm。
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公开(公告)号:US20160226022A1
公开(公告)日:2016-08-04
申请号:US15095524
申请日:2016-04-11
发明人: Prashant Mandlik , Ruiqing Ma , Julia J. Brown
CPC分类号: H01L51/5253 , H01L51/56 , Y10T428/23
摘要: In some embodiments, a first product is provided. The first product may include a substrate, a device having a device footprint disposed over the substrate, and a barrier film disposed over the substrate and substantially along a side of the device footprint. The barrier film may comprise a mixture of a polymeric material and non-polymeric material. The barrier film may have a perpendicular length that is less than or equal to 3.0 mm from the side of the device footprint.
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公开(公告)号:US09252391B2
公开(公告)日:2016-02-02
申请号:US14065877
申请日:2013-10-29
发明人: Prashant Mandlik , Sigurd Wagner , Jeffrey A. Silvernail , Ruiqing Ma , Julia J. Brown , Lin Han
IPC分类号: H01L51/52 , C23C16/02 , C23C16/04 , C23C16/22 , C23C16/30 , C23C16/40 , C23C16/455 , C23C16/505 , C23C16/517 , C23C16/52 , C23C30/00
CPC分类号: H01L51/5253 , C23C16/02 , C23C16/0272 , C23C16/04 , C23C16/22 , C23C16/30 , C23C16/40 , C23C16/45523 , C23C16/505 , C23C16/517 , C23C16/52 , C23C30/00 , H01L51/5203 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2251/566
摘要: A method for protecting an electronic device comprising an organic device body. The method involves the use of a hybrid layer deposited by chemical vapor deposition. The hybrid layer comprises a mixture of a polymeric material and a non-polymeric material, wherein the weight ratio of polymeric to non-polymeric material is in the range of 95:5 to 5:95, and wherein the polymeric material and the non-polymeric material are created from the same source of precursor material. Also disclosed are techniques for impeding the lateral diffusion of environmental contaminants.
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