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    Barrier film for electronic devices and substrates
    3.
    发明授权
    Barrier film for electronic devices and substrates 有权

    公开(公告)号：US10862073B2

    公开(公告)日：2020-12-08

    申请号：US14018449

    申请日：2013-09-05

    申请人： Universal Display Corporation ,  The Trustees of Princeton University

    发明人： Prashant Mandlik ,  Ruiqing Ma ,  Sigurd Wagner ,  Bhadrinarayana Lalgudi Visweswaran

    IPC分类号： H01L51/56 ,  H01L51/52 ,  H01L51/00

    摘要： Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.

    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES
    5.
    发明申请
    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES 审中-公开
    用于电子设备和基板的遮蔽膜

    公开(公告)号：US20140087497A1

    公开(公告)日：2014-03-27

    申请号：US14018449

    申请日：2013-09-05

    申请人： The Trustees of Princeton University ,  Universal Display Corporation

    发明人： Prashant Mandlik ,  Ruiqing Ma ,  Sigurd Wagner ,  Bhadrinarayana Lalgudi Visweswaran

    IPC分类号： H01L51/56

    CPC分类号： H01L51/56 ,  H01L51/0097 ,  H01L51/5253

    摘要： Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.

    摘要翻译： 公开了在表面上形成涂层的方法。 一种方法包括以第一方向以角度将第一阻挡膜材料源朝向衬底引导; 相对于基底，其中＆amp; 大于约0°且小于约85°。 另外，在衬底上沉积阻挡膜的方法包括将多个N源的阻挡膜材料引导向衬底，每个源相对于衬底以一定角度N指向;其中对于每个衬底，N， ; 大于约0°且小于约180°。 对于至少第一个“N”和“N”，N大于约0°且小于约85°，并且对于至少一秒的“N”和“N”，N大于约95°或更小 比约180°。

    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES
    7.
    发明申请
    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES 有权

    公开(公告)号：US20210066675A1

    公开(公告)日：2021-03-04

    申请号：US17090930

    申请日：2020-11-06

    申请人： Universal Display Corporation ,  The Trustees of Princeton University

    发明人： Prashant Mandlik ,  Ruiqing Ma ,  Sigurd Wagner ,  Bhadrinarayana Lalgudi Visweswaran

    IPC分类号： H01L51/56 ,  H01L51/52

    摘要： Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.