公开(公告)号：US08687364B2

公开(公告)日：2014-04-01

申请号：US13283933

申请日：2011-10-28

申请人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

摘要翻译： 提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合 与冷却剂回路流体连通以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

公开(公告)号：US20110080700A1

公开(公告)日：2011-04-07

申请号：US12572301

申请日：2009-10-02

申请人： Patrick M. Bland ,  Vinod Kamath ,  Jimmy G. Foster, SR. ,  Ivan R. Zapata

发明人： Patrick M. Bland ,  Vinod Kamath ,  Jimmy G. Foster, SR. ,  Ivan R. Zapata

IPC分类号： G06F1/20

CPC分类号： G06F1/20

摘要： Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load.

摘要翻译： 提供通过包括存储器模块的上游列和存储器模块的下游列的底盘的气流的方法和装置。 气流被分为从上游塔的上游端延伸到下游塔的下游端的第一和第二分开的气流。 第一气流引导与可操作地安装在上游塔中的单个存储器模块接触，并且避免与下游塔中的任何存储器模块接触。 引导第二气流流以避免与上游塔中的任何存储器模块接触并与可操作地安装在下游塔中的单个存储器模块接触。 即使在这样的存储器模块上的热负载较大，改进的冷却也能够每通道扩展使用单个存储器模块。 结果是总体上节省了电力，因为冷却要求不再要求每个通道安装额外的内存模块，以便共享和分配热负载。

公开(公告)号：US07791882B2

公开(公告)日：2010-09-07

申请号：US12108020

申请日：2008-04-23

申请人： Richard C. Chu ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Roger R. Schmidt

发明人： Richard C. Chu ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Roger R. Schmidt

IPC分类号： H05K7/20 ,  G06F1/20 ,  G05D23/00

CPC分类号： H05K7/20745 ,  H05K7/20836

摘要： Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism.

摘要翻译： 提供了用于以节能，动态的方式冷却电子机架的装置和方法。 该装置包括用于促进电子机架的冷却，外壳，散热单元和控制单元的一个或多个提取机构。 外壳具有外壁，联接到外壁的盖和大小为围绕电子机架和散热机构的中心开口。 液体冷却剂回路联接散热单元与散热机构的流体连通，其从通过其中的液体冷却剂中除去热量。 控制单元联接到除热单元，用于动态地调节散热单元的能量消耗以限制其能量消耗，同时使用通过热提取机构的液体冷却剂向电子机架提供所需的冷却。

公开(公告)号：US07639486B2

公开(公告)日：2009-12-29

申请号：US11955865

申请日：2007-12-13

申请人： David Frederick Champion ,  Karl Klaus Dittus ,  Brian Gormley ,  Vinod Kamath ,  Michael Sven Miller

发明人： David Frederick Champion ,  Karl Klaus Dittus ,  Brian Gormley ,  Vinod Kamath ,  Michael Sven Miller

IPC分类号： H05K7/20

CPC分类号： G06F1/183 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1488 ,  H05K7/20781

摘要： A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module. The at least one other module is interchangeably selected from the group consisting of a second compute module and an expansion module, wherein the one or more components of the expansion module are controlled by the motherboard of the compute module within the same chassis.

摘要翻译： 一种用于接收和支持连接到网络的多个设备的系统。 该系统包括一个机架，其具有前侧，提供对多个机箱托架的访问，用于接收底盘并使底盘的后端与电源盲对接。 机箱包括电源，风扇和前侧，提供对多个模块托架的访问，用于接收模块并对准模块的后端以与电源盲对接。 一个计算模块被接收在一个模块托架中，并且直接盲接在电源上。 该系统还包括至少一个其它模块，其接收在与计算模块相同的底盘内的模块托架中，并与计算模块一起直接与对置的同一电源对接。 所述至少一个其他模块可从由第二计算模块和扩展模块组成的组中可互换地选择，其中所述扩展模块的所述一个或多个组件由所述计算模块的所述主板在同一机架内控制。

公开(公告)号：US07612446B2

公开(公告)日：2009-11-03

申请号：US11604152

申请日：2006-11-22

申请人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

发明人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

IPC分类号： H01L23/34 ,  H05K7/20 ,  H01L21/00 ,  F28F7/00

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.

摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。

公开(公告)号：US07595986B2

公开(公告)日：2009-09-29

申请号：US11936104

申请日：2007-11-07

申请人： Troy W. Glover ,  Michael S. June ,  Vinod Kamath ,  Whitcomb R. Scott, III

发明人： Troy W. Glover ,  Michael S. June ,  Vinod Kamath ,  Whitcomb R. Scott, III

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  G06F1/20

摘要： Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

摘要翻译： 配置用于受控气流的计算机机箱，包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分，从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕，包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件，用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流，包括将组件板插入计算机机箱; 移位分段帘幕的一段，从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。

公开(公告)号：US20050133907A1

公开(公告)日：2005-06-23

申请号：US10744835

申请日：2003-12-23

申请人： Thomas Hildner ,  Vinod Kamath

发明人： Thomas Hildner ,  Vinod Kamath

IPC分类号： H01L23/36 ,  H01L23/427 ,  H01L23/34

CPC分类号： H01L23/4275 ,  H01L23/36 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit assembly includes an integrated circuit overlying a printed circuit board and a thermal solution interface such as a fan sink or a heat pipe overlying the integrated circuit. The lower surface of the thermal solution interface has a plurality of spacer structures to enforce a uniform displacement between the lower surface and an underlying surface contacted by the spacers. A heat transfer material, such as a thermal phase change material or a thermal grease, is positioned between the thermal solution interface and the underlying surface contacted by the spacers. The assembly may include a socket connected to the printed circuit board into which the integrated circuit is inserted. The spacers likely enforce a uniform displacement in the range of approximately 0.001 to 0.005 inches. The spacers may be configured as a set of substantially hemispherical protrusions or a set of substantially parallel elongated ridge protrusions.

摘要翻译： 集成电路组件包括覆盖印刷电路板的集成电路和诸如风扇接收器或覆盖集成电路的热管的热解决方案接口。 热溶液界面的下表面具有多个间隔结构，以在下表面和与间隔物接触的下表面之间施加均匀位移。 传热材料，例如热相变材料或导热油脂，位于热溶液界面和与间隔物接触的下面的表面之间。 组件可以包括连接到印刷电路板的插座，集成电路插入该插座中。 间隔件可能在大约0.001至0.005英寸的范围内强制均匀位移。 间隔件可以被配置为一组基本上半球形的突起或一组基本上平行的细长突起。

公开(公告)号：US06445580B1

公开(公告)日：2002-09-03

申请号：US09591011

申请日：2000-06-09

申请人： Mark E. Cohen ,  Joseph Anthony Ho-lung ,  Vinod Kamath ,  Leo Harold Webster, Jr. ,  Tin-Lup Wong

发明人： Mark E. Cohen ,  Joseph Anthony Ho-lung ,  Vinod Kamath ,  Leo Harold Webster, Jr. ,  Tin-Lup Wong

IPC分类号： G06F120

CPC分类号： H01L23/38 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.

公开(公告)号：US06172871B2

公开(公告)日：2001-01-09

申请号：US09282299

申请日：1999-03-31

申请人： Joseph Anthony Holung ,  Vinod Kamath ,  Mohanlal Savji Mansuria ,  Tin-Lup Wong

发明人： Joseph Anthony Holung ,  Vinod Kamath ,  Mohanlal Savji Mansuria ,  Tin-Lup Wong

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  G06F1/1632

摘要： A portable data processing system and method are disclosed for improving cooling of a microprocessor included within the system. The portable data processing system includes a base housing for housing a CPU and a display housing for housing a display. A heat sink is established within the base housing. The heat sink is formed from a highly conductive composite material. A heat dissipater is established within the display housing. The heat dissipater is comprised of a highly conductive composite material. The heat dissipater and heat sink are capable of receiving a heat pipe. Heat is transferred from the heat sink to the heat dissipator utilizing the heat pipe. In a second embodiment, the portable system is docked with a docking station, and a heat probe is included which is utilized to dissipate additional heat from the microprocessor to a large fan sink included within the docking station.

摘要翻译： 公开了一种用于改善系统内包括的微处理器的冷却的便携式数据处理系统和方法。 便携式数据处理系统包括用于容纳CPU的基座外壳和用于容纳显示器的显示器外壳。 在基座外部建立散热器。 散热器由高导电性复合材料形成。 在显示器外壳内建立散热器。 散热器由高导电性复合材料构成。 散热器和散热器能够接收热管。 利用热管将热量从散热片传送到散热器。 在第二实施例中，便携式系统与对接站对接，并且包括热探针，其用于将附加的热量从微处理器散发到包括在对接站内的大型风扇水槽。

公开(公告)号：US5794687A

公开(公告)日：1998-08-18

申请号：US905688

申请日：1997-08-04

申请人： Leo H. Webster, Jr. ,  Lawrence Shungwei Mok ,  Vinod Kamath ,  Mohanlal S. Mansuria

发明人： Leo H. Webster, Jr. ,  Lawrence Shungwei Mok ,  Vinod Kamath ,  Mohanlal S. Mansuria

IPC分类号： H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An integrated air mover/heatsink for cooling semiconductor chip packages supports disks to rotate within the heat sink parallel to a heat receiving surface so that the heat sink acts as an enclosing housing for the disks. The heat sink preferably defines enclosing aperatures for respective disks which are closely spaced and coextensive heat with transfer surfaces over which air is forced by rotation of the disks. By so arranging the disks and enclosing aperature walls parallel to the heat receiving surface, a forced intimate flow of air over heat sink surfaces is achieved in a low profile configuration. Alternative implementations provide cooling for multiple chips and various arrangements for intake and exhaust of cooling air.

摘要翻译： 用于冷却半导体芯片封装的集成式移动器/散热器支撑盘，以平行于热接收表面在散热器内旋转，使得散热器用作盘的封闭壳体。 散热器优选地限定用于相应盘的封闭温度，其与传送表面紧密隔开并具有共同延伸的热量，空气通过盘旋转而被驱动。 通过如此布置圆盘并且围绕平行于热接收表面的温度壁，在低轮廓构造中实现了在散热器表面上强制的空气流动。 替代实施方案提供用于多个芯片的冷却和用于进入和排出冷却空气的各种布置。