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公开(公告)号：US20080087455A1
公开(公告)日：2008-04-17
申请号：US11902556
申请日：2007-09-24
申请人： Szu-Han Hu , Voon Ho , Hiroshi Yamazaki , Martin McCaslin
发明人： Szu-Han Hu , Voon Ho , Hiroshi Yamazaki , Martin McCaslin
IPC分类号： H01B7/00
CPC分类号： H05K1/0221 , H05K1/117 , H05K3/4644 , H05K2201/09236 , H05K2201/09481 , H05K2201/09809 , H05K2203/0733
摘要： A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.
摘要翻译： 布线电路板具有多个绝缘层，导电层具有沿纵向方向延伸并被绝缘层覆盖的信号布线，以及信号连接端子，设置在信号布线的纵向端并从绝缘层 以及接地层，其具有覆盖有绝缘层的接地布线，并且形成为围绕与纵向方向垂直的方向的信号布线;以及接地端子，其设置在接地布线的纵向端部并从绝缘体 层。 信号连接端子和接地连接端子形成在多个绝缘层中的相同绝缘层的上表面上。
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公开(公告)号：US20120008227A1
公开(公告)日：2012-01-12
申请号：US13214120
申请日：2011-08-19
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US07569773B2
公开(公告)日：2009-08-04
申请号：US11902556
申请日：2007-09-24
IPC分类号： H01B7/08
CPC分类号： H05K1/0221 , H05K1/117 , H05K3/4644 , H05K2201/09236 , H05K2201/09481 , H05K2201/09809 , H05K2203/0733
摘要： A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.
摘要翻译： 布线电路板具有多个绝缘层，导电层具有沿纵向方向延伸并被绝缘层覆盖的信号布线，以及信号连接端子，设置在信号布线的纵向端并从绝缘层 以及接地层，其具有覆盖有绝缘层的接地布线，并且形成为围绕与纵向方向垂直的方向的信号布线;以及接地端子，其设置在接地布线的纵向端部并从绝缘体 层。 信号连接端子和接地连接端子形成在多个绝缘层中的相同绝缘层的上表面上。
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公开(公告)号：US20080186623A1
公开(公告)日：2008-08-07
申请号：US12024857
申请日：2008-02-01
IPC分类号： G11B33/14
CPC分类号： G11B33/1426 , G11B33/123 , H05K1/0206 , H05K1/056 , H05K1/189 , H05K2201/09509 , H05K2201/09554
摘要： Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.
摘要翻译： 描述了一种用于硬盘驱动器的前置放大器柔性电缆。 柔性电缆包括可操作以提供机械支撑件的加强层，设置在加强层上的绝缘层，并且具有设置在其中的至少一个通孔以露出加强层，以及设置在绝缘层上的至少一个导电层。 所述至少一个导电层形成电路和至少一个散热元件，其延伸穿过所述通孔并与所述加强层建立接触。 在一个实施方式中，除热元件包括具有凹入的中心部分和边缘部分的矩形板。 凹陷的中心部分穿过绝缘层中的至少一个通孔突出以与加强件机械地联接。 在另一实施方式中，除热元件包括第一部分和第二矩形部分。 第一部分穿过绝缘层中的至少一个通孔突出，以与加强件热耦合，并且第二部分设置在绝缘层上方，使得第二部分可以热耦合到前置放大器。
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公开(公告)号：US20080078573A1
公开(公告)日：2008-04-03
申请号：US11902553
申请日：2007-09-24
IPC分类号： H01R12/04
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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公开(公告)号：US06302626B1
公开(公告)日：2001-10-16
申请号：US09488277
申请日：2000-01-20
申请人： Chen-Chung Du , Szu-Han Hu , Te-Hui Yang , Chun-Hsien Liu
发明人： Chen-Chung Du , Szu-Han Hu , Te-Hui Yang , Chun-Hsien Liu
IPC分类号： H02K4100
CPC分类号： H02K41/0358
摘要： A fixed support for voice coil motor comprises a coil, hollow plate, opening, structural reinforcement beam, and a plurality of pins. The pins extruding from the hollow plate allows the coil to wind around them. The opening, which locates on the center of the hollow plate, distributes stress concentration around the center. The structural reinforcement beam, which extrudes from an edge of the hollow plate, improves stiffness of the fixed support, thereby allowing the hollow plate to be made thinner.
摘要翻译： 音圈电机的固定支架包括线圈，中空板，开口，结构加强梁和多个销。 从中空板挤出的销允许线圈缠绕在它们周围。 位于中空板中心的开口分布在中心周围的应力集中。 从中空板的边缘挤出的结构加强梁提高固定支撑件的刚度，从而使中空板制成更薄。
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