Abstract:
An emission device which operates a cadmium lamp with a light intensity sufficient for used in industrial applications is achieved by an emission device having a cadmium lamp with a fluorescent tube within which a cathode and an anode are space a small distance apart and a buffer gas for easier initiation of luminous operation and metallic cadmium in an amount per unit volume of the fluorescent tube of 1.times.10.sup.-4 g/cm.sup.3 to 3.times.10.sup.-3 g/cm.sup.3 are encapsulated, and a power source device for supplying an electrical input between the cathode and the anode in an electrical input range from 0.5 kW to 5.0 kW with the condition:6.03+2.79 W.ltoreq.r.ltoreq.40being satisfied, where the electrical input of the power source device into the cadmium lamp in steady-state luminous operation is W (kW) and the maximum inside radius of the fluorescent tube is r (mm).
Abstract translation:操作具有足以用于工业应用的光强度的镉灯的发射装置通过具有镉灯的发射装置来实现,所述镉灯具有荧光管,阴极和阳极间隔开小间隔,并且缓冲气体用于 封装了1×10 -4 g / cm 3〜3×10 -3 g / cm 3的荧光灯的单位体积的发光操作的更容易的起始和金属镉,以及用于在阴极和阴极之间提供电输入的电源装置 在0.5kW至5.0kW的电输入范围内的阳极,条件为:6.03 + 2.79W = r = 40满足,其中在稳态发光操作中电源装置进入镉灯的电输入为 W(kW)和荧光管的最大内半径为r(mm)。
Abstract:
An apparatus for detecting a misfire in an internal combustion engine that is capable of preventing erroneous detection in a period in which the discharged voltage on a secondary ignition coil is charged. The apparatus having a capacitor, which is supplied with bias voltage from a primary side of an ignition coil to be electrically charged to apply the charged voltage to the spark plug at the time of discharge of the spark plug to cause an ionic current to flow and a misfire detection circuit for determining whether or not a misfire has taken place in accordance with detection of the ionic current flowing from the capacitor. The apparatus for detecting a misfire in an internal combustion engine includes a discharge-period detecting Zener diode disposed between another end of the primary coil and an inverting input terminal of an operational amplifier, having Zener voltage lower than the Zener voltage of a Zener diode, which sets voltage to be charged into the capacitor, and connected in a direction in which an electric current flowing while exceeding the Zener voltage is caused to flow toward the inverting input terminal of the operational amplifier.
Abstract:
A control circuit for an H-bridge circuit comprises a single capacitor, a charge/discharge circuit for charging/discharging the capacitor in response to a control command signal, a voltage detector circuit for detecting a voltage appearing across the capacitor and a hold circuit for holding the control command signal in response to of a predetermined voltage detected by the voltage detection circuit. Charge and discharge of the capacitor is controlled in dependence on changes in the control command signal to thereby prevent occurrence of a through-current flow in the H-bridge circuit while allowing the bridge circuit to be changed over to the operation state indicated by the control command signal after lapse of charge/discharge period. The control circuit for the H-bridge circuit can be implemented in a miniaturized size with high reliability of operation while decreasing the number of elements attached externally even in the case where the control circuit is implemented in the form of an integrated circuit.
Abstract:
A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.
Abstract:
A light source device that irradiates a discharge vessel with a laser beam to produce radiant light that is reflected by an ellipsoidal reflecting surface efficiently utilizes the light produced by directing the laser beam through an unirradiated region where reflected light from the ellipsoidal reflector is blocked by the discharge vessel, through an opening side of the ellipsoidal reflector to the discharge vessel. The discharge vessel has an emission substance enclosed inside which is excited by the laser beam and produces radiant light, is arranged at a focal point of the ellipsoidal reflector. A planar mirror, with which radiant light reflected by the ellipsoidal reflector is reflected in a different direction has a window in an unirradiated region where reflected light from the ellipsoidal reflector is blocked by the discharge vessel through which the laser beam passes to the discharge vessel.
Abstract:
To provide a flickerless discharge lamp which can remove hydrogen by a simple and safe means even if the lamp is a large discharge lamp with high pressure when lit, the discharge lamp has a pair of electrodes and a hydrogen getter (4) in the interior of an arc tube, the hydrogen getter (4) being formed of a container (41) made of metal which is hydrogen permeable and a hydrogen absorbent body (42) that is composed of a metal which can absorb hydrogen that is enclosed inside of the container (41) and is fixed to an inside wall of the container (41).
Abstract:
A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.
Abstract:
In the semiconductor device including a control input terminal, a GND terminal and an output terminal, and also having an IGBT and a control circuit driving the IGBT, a ground resistance and a temperature compensation resistance are connected in series to each other between the control input terminal and the GND terminal. A polysilicon resistance provided on an insulating film formed in a semiconductor substrate in which the IGBT is provided is employed as the ground resistance. A diffusion resistance obtained by injecting an impurity into said semiconductor substrate and performing a diffusion operation is employed as the temperature compensation resistance.
Abstract:
An object is to reduce the offset voltage between the input and output in a wide range of output current with a simple circuit configuration. Transistors (Q1), (Q2) and (Q3) have a size ratio of m:n:1, transistors (Q6) and (Q7) have a size ratio of 1:p, and transistors (Q4) and (Q5) have a size ratio of {(m+n+1)/p:}). Accordingly a current which is (m+n+1) times the current flowing in the transistor (Q3) is supplied to the emitter electrodes of the transistors (Q1) and (Q2). Since the ratio between the currents flowing in the transistors (Q1) and (Q2) is the same as their size ratio m:n, the emitter-base voltages are equal between the transistors (Q1) and (Q2). As a result, the offset voltage between the voltage signal inputted to the input signal line (IN) and the voltage signal outputted from the output signal line (OUT) can be suppressed in a wide range of output current.
Abstract translation:目的是通过简单的电路配置在宽范围的输出电流范围内减小输入和输出之间的偏移电压。 晶体管(Q1),(Q2)和(Q3)的尺寸比为m:n:1,晶体管(Q6)和(Q7)的尺寸比为1:p,晶体管(Q4)和(Q5) 尺寸比{(m + n + 1)/ p:})。 因此,将在晶体管(Q3)中流动的电流(m + n + 1)的电流提供给晶体管(Q1)和(Q2)的发射极。 由于在晶体管(Q1)和(Q2)中流动的电流之间的比例与它们的尺寸比m:n相同,晶体管(Q1)和(Q2)之间的发射极 - 基极电压相等。 结果,输出到输入信号线(IN)的电压信号与从输出信号线(OUT)输出的电压信号之间的偏移电压可以在宽的输出电流范围内被抑制。
Abstract:
The present invention provides a power semiconductor device comprising a semiconductor substrate; a voltage-controlled transistor comprising a first electrode formed on the lower surface of the semiconductor substrate, a gate formed on the semiconductor substrate with a gate oxide interpolated in between and a second electrode formed on the semiconductor substrate; and a zener diode formed on the upper surface of the semiconductor substrate so as to be connected between the gate and the second electrode; wherein p-type regions and n-type regions alternately formed between the zener diode and the second electrode on the semiconductor substrate, a plurality of pad electrodes on the semiconductor substrate provided with the alternate p-type regions and n-type regions so as to allow one or not less than two diodes are series connected between the zener diode and the second electrode, and the distance between the adjacent pad electrodes is set so that when the diode is subjected to a current not less than a predetermined value, the respective pad electrodes are fused so that short-circuiting occurs between the adjacent pad electrodes.