Semiconductor having tin oxide layer and substrate
    22.
    发明授权
    Semiconductor having tin oxide layer and substrate 失效
    具有氧化钛层和衬底的半导体

    公开(公告)号:US3679949A

    公开(公告)日:1972-07-25

    申请号:US3679949D

    申请日:1970-09-23

    CPC classification number: H01L21/28537 H01L21/28581 H01L27/1446

    Abstract: A semiconductor composite having a rectifying characteristic is provided by depositing a tin oxide film on a semiconductor substrate. In view of the fact that the tin oxide film has high transparency and conductivity the composite can be used as an excellent photoelectric device. Preferably the tin oxide film is deposited on the substrate by reacting a halogenated organic tin compound with oxygen at an elevated temperature. Conductivity of the tin oxide film can be enhanced by incorporation of a small amount of antimony trichloride into the dimethyl tin dichloride. It was found that there are preferred reaction temperatures, time periods, and amount of mixed antimony trichloride for providing a composite having the desired characteristics. By depositing a plurality of separate tin oxide films on a single substrate by a photo-etching process of tin oxide film an integrated photoelectric apparatus is provided.

    Abstract translation: 通过在半导体衬底上沉积氧化锡膜来提供具有整流特性的半导体复合体。 考虑到氧化锡膜具有高的透明度和导电性,复合材料可以用作优异的光电器件。

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