公开(公告)号：US11081431B2

公开(公告)日：2021-08-03

申请号：US16612890

申请日：2018-04-26

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Jun Ikeda

IPC: H01L23/495 ,  H01L23/32 ,  H01L23/367 ,  H01R4/34

Abstract: A circuit device includes a first conductive plate and a second conductive plate each having a belt-shaped portion arranged side-by-side with each other, a third conductive plate having a belt-shaped portion is arranged side-by-side with and spaced apart from the other side portion of the first conductive plate, a first circuit component having a first terminal connected to the first conductive plate and a second terminal connected to the second conductive plate, a second circuit component having a first terminal connected to the first conductive plate and a second terminal connected to the third conductive plate, a first external connection portion provided at the belt-shaped portion of the first conductive plate, and a second external connection portion provided at the belt-shaped portion of the second conductive plate or a third external connection portion provided at the belt-shaped portion of the third conductive plate.

公开(公告)号：US20210202424A1

公开(公告)日：2021-07-01

申请号：US17203847

申请日：2021-03-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke SAKAI

IPC: H01L23/00 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L21/768

Abstract: A connection electrode includes a first metal film, a second metal film, a mixed layer, and an extraction electrode. The second metal film is located on the first metal film, and the extraction electrode is located on the second metal film. The mixed layer includes a mix of metal particles of the first and second metal films. As viewed in a first direction in which the first metal film and the second metal film are on top of each other, at least a portion of the mixed layer is in a first region that overlaps a bonding plane between the extraction electrode and the second metal film.

公开(公告)号：US20210143075A1

公开(公告)日：2021-05-13

申请号：US17091371

申请日：2020-11-06

Applicant: Octavo Systems LLC

Inventor： Michael Kenneth CONTI ,  Christopher Lloyd REINERT ,  Masood MURTUZA

IPC: H01L23/32 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.

公开(公告)号：US11004758B2

公开(公告)日：2021-05-11

申请号：US16442907

申请日：2019-06-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shu-Rong Chun ,  Kuo Lung Pan ,  Tin-Hao Kuo ,  Hao-Yi Tsai ,  Pei-Hsuan Lee ,  Chien Ling Hwang ,  Yu-Chia Lai ,  Po-Yuan Teng ,  Chen-Hua Yu

IPC: H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/32 ,  H01L23/00 ,  H01L25/065

Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.

公开(公告)号：US20210028090A1

公开(公告)日：2021-01-28

申请号：US17070374

申请日：2020-10-14

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Satoru KURAMOCHI

IPC: H01L23/48 ,  H01L23/32 ,  B23K26/382 ,  H01L23/498 ,  C03C23/00 ,  C03C17/36 ,  C03C17/40 ,  H01L21/768 ,  H01L23/532

Abstract: A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.

公开(公告)号：US20200381346A1

公开(公告)日：2020-12-03

申请号：US16995014

申请日：2020-08-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Fa Chen ,  Chen-Hua Yu

IPC: H01L23/498 ,  G01R1/04 ,  H01L21/48 ,  H01L21/683 ,  H01L23/32 ,  H01L23/00 ,  H01L25/065 ,  H05K1/14 ,  H05K3/46 ,  H05K7/10

Abstract: A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

公开(公告)号：US10770490B2

公开(公告)日：2020-09-08

申请号：US16438116

申请日：2019-06-11

Applicant: SONY CORPORATION

Inventor： Yukihiro Ando

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/522 ,  H04N5/369 ,  H01L23/32 ,  H01L23/492 ,  H01L21/3205 ,  H01L21/768

Abstract: The present disclosure relates to a semiconductor device and an electronic apparatus which is capable of reducing variations and deterioration of transistor characteristics. A first connection pad connected with a first wiring and a first floating metal greater than the first connection pad are formed at a bonding surface of a first substrate, whereas a second connection pad connected with a second wiring and a second floating metal greater than the second connection pad are formed at a bonding surface of a second substrate. The first floating metal and the second floating metal formed at the first substrate and the second substrate are bonded to each other. The present disclosure is applicable to a CMOS solid-state imaging device used for an imaging apparatus such as a camera, for example.

公开(公告)号：US10729010B2

公开(公告)日：2020-07-28

申请号：US15941427

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Daniel Willis ,  Dan H. Gerbus

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/46 ,  H01L23/32 ,  H01L23/367

Abstract: The present subject matter may include an electronic device. The electronic device may include a motherboard socket body. The motherboard socket body may be adapted to couple with a processor. The motherboard socket body may define an aperture in the motherboard socket body. The electronic device may include a socket insulator. The socket insulator may be coupled with the aperture in the motherboard socket body. The socket insulator may include an insulator body that may be sized and shaped to close the aperture in the motherboard socket body. The socket insulator may be configured to isolate electrical communication in portions of the motherboard socket body.

公开(公告)号：US20200235516A1

公开(公告)日：2020-07-23

申请号：US16744179

申请日：2020-01-16

Applicant: FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD. ,  FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： WEI-JIAN ZHONG ,  FU-JIN PENG ,  QI-JIN YI

IPC: H01R13/504 ,  H01L23/32 ,  H01R13/193 ,  H01R13/639

Abstract: An electrical connector includes an insulative base and an insulative cover moveable relative to the base along the front-to-back direction. A lever includes an actuating bar sandwiched between the base and the cover and is rotated to move the cover relative to the base. A metallic reinforcement piece is embedded within the base adjacent to the actuating bar. The metallic reinforcement piece includes a main part in compliance with a receiving groove of the base receiving the actuating bar therein, and a pair of wings at two opposite transverse side edge of the receiving groove.

公开(公告)号：US10685944B2

公开(公告)日：2020-06-16

申请号：US15790057

申请日：2017-10-23

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L25/16 ,  G01K7/01 ,  H01L23/46 ,  H01L23/32 ,  H01L25/00 ,  G01K7/22 ,  H01L23/13 ,  H01L23/00 ,  H01L23/14

Abstract: In accordance with an embodiment, sensor structure has a first, second, and third laminated structures. The second laminated structure is positioned between the first laminated structure and the third laminated structure. The first laminated structure includes a first portion of a first sensing element and the third laminated structure includes a second portion of the first sensing element. The second laminated structure includes spacer elements that can be used to adjust the sensitivity of the sensor structure.