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公开(公告)号：US20240356199A1
公开(公告)日：2024-10-24
申请号：US18762578
申请日：2024-07-02
CPC分类号： H01Q1/2283 , H01L21/4846 , H01L23/66 , H01L24/13 , H01L24/24 , H01L24/32 , H01L24/73 , H01Q1/40 , H01L2223/6677 , H01L2224/13024 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267
摘要： A method of manufacturing an electronic device includes: providing a composite structure, wherein the composite structure comprises a core dielectric layer with two conductive layers formed on two opposite surfaces of the core dielectric layer; thinning the two conductive layers to form two thinned conductive layers; forming an antenna pattern using one of the two thinned conductive layers; forming an antenna package to encapsulate the antenna pattern therein; forming a circuit pattern by patterning the other one of the two thinned conductive layers; and forming a chip package to encapsulate the circuit pattern therein, wherein the chip package is electrically coupled to the antenna package.
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公开(公告)号：US11984365B2
公开(公告)日：2024-05-14
申请号：US17249965
申请日：2021-03-19
IPC分类号： H01L21/00 , G01N23/2251 , H01L21/02 , H01L21/66
CPC分类号： H01L22/12 , G01N23/2251 , H01L21/02181 , H01L21/02192
摘要： A high atomic number material is applied to one or more surfaces of a semiconductor structure of a wafer. The one or more surfaces are at a depth different from a depth of a surface of the wafer. An electron beam is scanned over the semiconductor structure to cause a backscattered electron signal to be collected at a collector. A profile scan of the semiconductor structure is generated based on an intensity of the backscattered electron signal, at the collector, resulting from the high atomic number material. The high atomic number material increases the intensity of the backscattered electron signal for the one or more surfaces of the semiconductor structure such that contrast in the profile scan is increased. The increased contrast of the profile scan enables accurate critical dimension measurements of the semiconductor structure.
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公开(公告)号：US11749582B2
公开(公告)日：2023-09-05
申请号：US17874293
申请日：2022-07-27
发明人： Yu-Chia Lai , Chen-Hua Yu , Chung-Shi Liu , Hsiao-Chung Liang , Hao-Yi Tsai , Chien-Ling Hwang , Kuo-Lung Pan , Pei-Hsuan Lee , Tin-Hao Kuo , Chih-Hsuan Tai
CPC分类号： H01L23/4006 , H01L23/58 , H01L24/16 , H01L25/18 , H01L2023/405 , H01L2023/4068 , H01L2023/4087 , H01L2224/023 , H01L2224/16145
摘要： A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread.
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公开(公告)号：US11502013B2
公开(公告)日：2022-11-15
申请号：US17315735
申请日：2021-05-10
发明人： Shu-Rong Chun , Kuo Lung Pan , Tin-Hao Kuo , Hao-Yi Tsai , Pei-Hsuan Lee , Chien Ling Hwang , Yu-Chia Lai , Po-Yuan Teng , Chen-Hua Yu
IPC分类号： H01L23/32 , H01L23/538 , H01L23/31 , H01L23/00 , H01L25/065 , H01L21/56
摘要： In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
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公开(公告)号：US20220359343A1
公开(公告)日：2022-11-10
申请号：US17874293
申请日：2022-07-27
发明人： Yu-Chia Lai , Chen-Hua Yu , Chung-Shi Liu , Hsiao-Chung Liang , Hao-Yi Tsai , Chien-Ling Hwang , Kuo-Lung Pan , Pei-Hsuan Lee , Tin-Hao Kuo , Chih-Hsuan Tai
摘要： A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread.
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公开(公告)号：US20210351491A1
公开(公告)日：2021-11-11
申请号：US17383403
申请日：2021-07-22
摘要： A method of manufacturing an electronic device includes providing a core dielectric layer with two conductive layers formed on two opposite surfaces of the core dielectric layer, and removing at least a portion of each of the two conductive layers to respectively form an antenna pattern and a circuit pattern of a chip package at the two opposite surfaces of the core dielectric layer.
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公开(公告)号：US20240361381A1
公开(公告)日：2024-10-31
申请号：US18766856
申请日：2024-07-09
发明人： Yu-Hsuan Huang , Chien-Liang Chen , Pei-Hsuan Lee
IPC分类号： G01R31/307 , H01L21/66
CPC分类号： G01R31/307 , H01L22/34
摘要： In a semiconductor manufacturing method includes providing a plurality of patterns on a semiconductor substrate. The patterns include an NMOS structure arranged next to an N+/N well structure, and/or a PMOS structure arranged next to a P+/P well structure. The method further includes: receiving a plurality of images by applying an electron beam to the patterns; and transferring the semiconductor substrate to a next process step if there is no image conversion according to a predetermined image contrast property of the patterns.
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公开(公告)号：US12040247B2
公开(公告)日：2024-07-16
申请号：US17320198
申请日：2021-05-13
发明人： Pei-Hsuan Lee , Ching-Hua Hsieh , Chien-Ling Hwang
摘要： A package system and a manufacturing method thereof are provided. The package system includes a semiconductor package and a thermal-dissipating structure. The semiconductor package includes a first surface and a second surface opposing to each other, and a planarity of the second surface is greater than that of the first surface. The thermal-dissipating structure includes a first plate secured to the semiconductor package, a gasket interposed between the first plate and the semiconductor package, a second plate secured to the semiconductor package opposite to the first plate, and a first thermal interface material layer interposed between the second plate and the second surface of the semiconductor package. The gasket includes a plurality of hollow regions corresponding to portions of the first surface of the semiconductor package.
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公开(公告)号：US11990381B2
公开(公告)日：2024-05-21
申请号：US17986498
申请日：2022-11-14
发明人： Shu-Rong Chun , Kuo Lung Pan , Tin-Hao Kuo , Hao-Yi Tsai , Pei-Hsuan Lee , Chien Ling Hwang , Yu-Chia Lai , Po-Yuan Teng , Chen-Hua Yu
IPC分类号： H01L23/32 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/538 , H01L25/065
CPC分类号： H01L23/31 , H01L21/56 , H01L23/32 , H01L23/5386 , H01L23/562 , H01L25/0655
摘要： In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
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公开(公告)号：US20220359344A1
公开(公告)日：2022-11-10
申请号：US17874651
申请日：2022-07-27
发明人： Shu-Rong Chun , Kuo-Lung Pan , Pei-Hsuan Lee , Chien Ling Hwang , Yu-Chia Lai , Tin-Hao Kuo , Hao-Yi Tsai , Chen-Hua Yu
摘要： In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.
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