摘要:
A belt sander (2) comprising a housing (4) and having a lower sanding surface (40) and an upper sanding surface (42) opposite the first sanding is disclosed. The sander has a larger rear roller (32) driven by a motor (22), a front roller (34) of smaller diameter than the rear roller, and an endless sanding belt (38). A guard (48) is pivotable between a lowered position preventing access to the upper sanding surface and a raised position allowing access to the upper sanding surface. A handle (12) on the housing is pivotable between a first handle position adjacent the upper sanding surface and at least one second handle position further from the upper sanding surface than the first handle position.
摘要:
A dressing blade for finishing and reconditioning new and used abrasive grinding and cutting tools has a slab-shaped shank with an extension protruding longitudinally from the shank. Superabrasive grains are disposed on the surface of the extension and held in place by a brazed metal composition. This composition is formed by brazing a powdered mixture of brazing metal components and active metal components. Specific extension configurations are provided which allow aligning the superabrasive grains in single layer arrangement for precise dressing and simple fabrication of the tool. The novel dressing tool exhibits excellent wear characteristics.
摘要:
A retaining ring for chemical mechanical polishing (CMP) apparatus comprising a body of the retaining ring, and a single trigger cavity, or a plurality of trigger cavities. Each trigger cavity formed inside the body of the retaining ring is filed with gas or fluid, and is configured to indicate that thickness of the retaining ring is less than or equal to a predetermined thickness threshold.
摘要:
A chemical mechanical planarization (CMP) conditioning apparatus is provided. The CMP conditioning apparatus is designed to connect to a positioning arm which is capable of applying the conditioning apparatus to a processing surface. Embodiments of the CMP conditioning apparatus include a housing configured to connect to the positioning arm, and one side of the housing having a concave gimbal surface. A puck holder that a convex gimbal surface configured to mate with the concave gimbal surface of the housing is further provided. Thee puck holder receives a conditioning puck that has an attach surface and an active surface. The concave gimbal surface and the convex gimbal surface define a projected gimbal point at about a plane defined at about the active surface of the conditioning puck.
摘要:
A multiple-conditioning member device for chemical mechanical planarization conditioning is described. The multiple conditioning members may be used in a chemical mechanical planarization apparatus which further includes a movably mounted polishing member, a wafer holder, and a slurry dispenser. The multiple conditioning members may be independently movable with respect to one another and configured to contact the polishing member. Specifically, a conditioning member may be independently movable with respect to another conditioning member based on x-axis control, y-axis control, z-axis control, alignment, speed of rotation, direction of rotation, amount of pressure of conditioning member on polishing member.
摘要:
A shaping pulley assembly (6) for a belt notching machine, including on a frame (1) a pair of driving and shaping pulleys (3, 4) for a grinding belt (5), includes a shaping pulley holder element (9) like a fork supported by the frame (1), having a C-shaped body with end brackets (90, 91), a stationary center and a removable counter-center, both being live centers which are housed in respective housings of the end brackets (90, 91), a shaping pulley (4) in the form of a cylindrical roller provided with center holes (42, 43) opposite to each other for fixed centre and removable counter-center, respectively on the bases (40, 41) of the shaping pulley.
摘要:
A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.
摘要:
A wheel dressing device includes a supporting base axially defining a first passage therein and including a first end portion and a second end portion, a sliding tube slidably mounted in the first passage and including a first end portion and a second end portion extending outward of the second end portion of the supporting base, and a feed base fixedly mounted on the second end portion of the sliding tube to move therewith. The feed base axially defines a second passage along a direction perpendicular to that of the first passage and includes a first end portion and a second end portion. A feed tube is slidably mounted in the second passage and includes a first end portion and a second end portion. A wheel dressing head is fixedly mounted on the second end portion of the feed tube to move therewith.
摘要:
A method and apparatus for conditioning the surface of a polishing pad used to polish a substrate, such as a semiconductor wafer. A conditioning apparatus uses two or more end effectors to abrade and/or remove the polishing byproducts from the surface of the pad. Different types of conditioning performance can be achieved when the end effectors are employed individually, sequentially or simultaneously during a polishing process.
摘要:
The invention relates to an apparatus for polishing wafers in the fabrication of semiconductor integrated circuits. The apparatus has a turntable on which a polishing pad of polyurethane foam is placed. The pad has a multiplicity of cavities in the polishing surface. In periodically dressing the pad, abrasive grains of diamond fall off the dressing tool, and some of the fallen abrasive grains remain in the cavities in the pad surface even though the pad surface is washed by water. According to the invention the polishing apparatus includes a cleaning device to drive abrasive grains out of the cavities. The cleaning device has a cylindrical body which rotates above the polishing pad. In an embodiment the cleaning device is a rotary brush having a multiplicity of needle-like parts of a synthetic resin on the cylindrical outer surface. The needle-like parts intrude into the cavities in the pad surface and flip abrasive grains out of the cavities. In another embodiment the cleaning device has an elastic covering on the cylindrical body. The elastic covering is squeezed into the cavities to temporarily close the opening of the cavities and reduce the air pressure in the cavities. When the elastic covering leaves the cavities a rush of the air into the cavities drives diamond grains out of the cavities.