Sanding apparatus
    21.
    发明申请

    公开(公告)号:US20050272356A1

    公开(公告)日:2005-12-08

    申请号:US10925319

    申请日:2004-08-24

    CPC分类号: B24B55/057 B24B23/06

    摘要: A belt sander (2) comprising a housing (4) and having a lower sanding surface (40) and an upper sanding surface (42) opposite the first sanding is disclosed. The sander has a larger rear roller (32) driven by a motor (22), a front roller (34) of smaller diameter than the rear roller, and an endless sanding belt (38). A guard (48) is pivotable between a lowered position preventing access to the upper sanding surface and a raised position allowing access to the upper sanding surface. A handle (12) on the housing is pivotable between a first handle position adjacent the upper sanding surface and at least one second handle position further from the upper sanding surface than the first handle position.

    Brazed diamond dressing tool
    22.
    发明申请
    Brazed diamond dressing tool 审中-公开
    钎焊金刚石修整工具

    公开(公告)号:US20050260939A1

    公开(公告)日:2005-11-24

    申请号:US10847939

    申请日:2004-05-18

    CPC分类号: B24D3/06 B24D18/00

    摘要: A dressing blade for finishing and reconditioning new and used abrasive grinding and cutting tools has a slab-shaped shank with an extension protruding longitudinally from the shank. Superabrasive grains are disposed on the surface of the extension and held in place by a brazed metal composition. This composition is formed by brazing a powdered mixture of brazing metal components and active metal components. Specific extension configurations are provided which allow aligning the superabrasive grains in single layer arrangement for precise dressing and simple fabrication of the tool. The novel dressing tool exhibits excellent wear characteristics.

    摘要翻译: 用于整理和修复新的和使用过的磨料研磨和切割工具的修整刀片具有板状柄,其具有从柄部纵向突出的延伸部。 超级磨粒设置在延伸部的表面上,并通过钎焊金属组合物保持在适当位置。 该组合物通过钎焊钎焊金属组分和活性金属组分的粉末混合物形成。 提供了特定的延伸结构,其允许在单层布置中对准超磨料颗粒以进行精确的修整和工具的简单制造。 该新型修整工具具有优异的磨损特性。

    Retaining ring with trigger for chemical mechanical polishing apparatus

    公开(公告)号:US06964597B2

    公开(公告)日:2005-11-15

    申请号:US10609064

    申请日:2003-06-27

    申请人: Peter Khuu

    发明人: Peter Khuu

    IPC分类号: B24B37/04 B24B21/18

    CPC分类号: B24B37/32 B24B37/013

    摘要: A retaining ring for chemical mechanical polishing (CMP) apparatus comprising a body of the retaining ring, and a single trigger cavity, or a plurality of trigger cavities. Each trigger cavity formed inside the body of the retaining ring is filed with gas or fluid, and is configured to indicate that thickness of the retaining ring is less than or equal to a predetermined thickness threshold.

    Gimballed conditioning apparatus
    24.
    发明授权
    Gimballed conditioning apparatus 失效
    金球调节装置

    公开(公告)号:US06949016B1

    公开(公告)日:2005-09-27

    申请号:US10112399

    申请日:2002-03-29

    CPC分类号: B24B53/017 B24B21/18

    摘要: A chemical mechanical planarization (CMP) conditioning apparatus is provided. The CMP conditioning apparatus is designed to connect to a positioning arm which is capable of applying the conditioning apparatus to a processing surface. Embodiments of the CMP conditioning apparatus include a housing configured to connect to the positioning arm, and one side of the housing having a concave gimbal surface. A puck holder that a convex gimbal surface configured to mate with the concave gimbal surface of the housing is further provided. Thee puck holder receives a conditioning puck that has an attach surface and an active surface. The concave gimbal surface and the convex gimbal surface define a projected gimbal point at about a plane defined at about the active surface of the conditioning puck.

    摘要翻译: 提供化学机械平面化(CMP)调理装置。 CMP调节装置被设计成连接到能够将调节装置应用于处理表面的定位臂。 CMP调节装置的实施例包括构造成连接到定位臂的壳体,并且壳体的一侧具有凹形万向面。 进一步提供了构造成与壳体的凹面万向节表面配合的凸面万向面的圆盘保持架。 冰球座接收一个具有附着表面和活动表面的调理盘。 凹面万向节表面和凸面万向节表面在约定义在调理盘的活动表面处的平面处限定投影的万向节点。

    Multiple-conditioning member device for chemical mechanical planarization conditioning
    25.
    发明授权
    Multiple-conditioning member device for chemical mechanical planarization conditioning 有权
    用于化学机械平面化调理的多调节构件装置

    公开(公告)号:US06935938B1

    公开(公告)日:2005-08-30

    申请号:US10816444

    申请日:2004-03-31

    CPC分类号: B24B53/017 B24B21/04

    摘要: A multiple-conditioning member device for chemical mechanical planarization conditioning is described. The multiple conditioning members may be used in a chemical mechanical planarization apparatus which further includes a movably mounted polishing member, a wafer holder, and a slurry dispenser. The multiple conditioning members may be independently movable with respect to one another and configured to contact the polishing member. Specifically, a conditioning member may be independently movable with respect to another conditioning member based on x-axis control, y-axis control, z-axis control, alignment, speed of rotation, direction of rotation, amount of pressure of conditioning member on polishing member.

    摘要翻译: 描述了用于化学机械平面化调节的多重调节构件装置。 多个调理构件可以用在化学机械平面化装置中,其还包括可移动安装的抛光构件,晶片保持器和浆料分配器。 多个调节构件可以相对于彼此独立地移动并且构造成接触抛光构件。 具体地说,调节构件可以基于x轴控制,y轴控制,z轴控制,对准,旋转速度,旋转方向,调节构件在抛光时的压力量独立地相对于另一个调节构件移动 会员。

    Shaping pulley assembly for belt notching machine
    26.
    发明申请
    Shaping pulley assembly for belt notching machine 失效
    皮带开槽机成型皮带轮总成

    公开(公告)号:US20050059326A1

    公开(公告)日:2005-03-17

    申请号:US10969180

    申请日:2004-10-21

    CPC分类号: B24B9/007 B24B21/16 B24B21/18

    摘要: A shaping pulley assembly (6) for a belt notching machine, including on a frame (1) a pair of driving and shaping pulleys (3, 4) for a grinding belt (5), includes a shaping pulley holder element (9) like a fork supported by the frame (1), having a C-shaped body with end brackets (90, 91), a stationary center and a removable counter-center, both being live centers which are housed in respective housings of the end brackets (90, 91), a shaping pulley (4) in the form of a cylindrical roller provided with center holes (42, 43) opposite to each other for fixed centre and removable counter-center, respectively on the bases (40, 41) of the shaping pulley.

    摘要翻译: 一种用于皮带切口机的成型皮带轮组件(6),包括一个用于研磨皮带(5)的一对驱动和成形滑轮(3,4)的框架(1)上,包括一个成形皮带轮保持元件(9) 由框架(1)支撑的叉子,具有带端部托架(90,91)的C形本体,固定中心和可拆卸的对中心,两者都是活动中心,它们容纳在端托架的相应壳体中 90°,91°),一个圆柱形滚轮形式的成形皮带轮(4),它们分别设置在彼此相对的中心孔(42,43)上,用于固定中心和可拆卸的对中心,基座(40,41) 成型滑轮。

    Wafer polishing device with movable window
    27.
    发明授权
    Wafer polishing device with movable window 失效
    带移动窗的晶圆抛光装置

    公开(公告)号:US6068539A

    公开(公告)日:2000-05-30

    申请号:US38171

    申请日:1998-03-10

    摘要: A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.

    摘要翻译: 具有可移动窗口的晶片抛光装置可用于在CMP处理期间的晶片的原位监测。 在大多数CMP操作期间,窗口保持在抛光装置的抛光表面下方,以保护窗口免受抛光过程的有害影响。 当窗口移动到晶片和测量传感器之间的位置时,窗口移动到靠近抛光表面。 在这个位置上,除去收集在窗口上方的凹部中的至少一些抛光剂,并且可以减少来自抛光剂的干扰而进行原位测量。 窗户远离晶片和测量传感器放置后,窗户将远离晶片和抛光表面。 利用这种可移动窗口,克服了当前抛光装置的局限性。

    Trimming device for a grinding wheel of a grinding machine
    28.
    发明授权
    Trimming device for a grinding wheel of a grinding machine 失效
    研磨机砂轮修边装置

    公开(公告)号:US5951387A

    公开(公告)日:1999-09-14

    申请号:US984523

    申请日:1997-12-03

    申请人: Ru-Luen Wen

    发明人: Ru-Luen Wen

    IPC分类号: B24B53/04 B24B53/08 B24B21/18

    CPC分类号: B24B53/04 B24B53/08

    摘要: A wheel dressing device includes a supporting base axially defining a first passage therein and including a first end portion and a second end portion, a sliding tube slidably mounted in the first passage and including a first end portion and a second end portion extending outward of the second end portion of the supporting base, and a feed base fixedly mounted on the second end portion of the sliding tube to move therewith. The feed base axially defines a second passage along a direction perpendicular to that of the first passage and includes a first end portion and a second end portion. A feed tube is slidably mounted in the second passage and includes a first end portion and a second end portion. A wheel dressing head is fixedly mounted on the second end portion of the feed tube to move therewith.

    摘要翻译: 砂轮修整装置包括支撑基部,其在其中轴向地限定第一通道,并且包括第一端部和第二端部,滑动管可滑动地安装在第一通道中,并且包括第一端部和第二端部, 支撑基座的第二端部和固定地安装在滑动管的第二端部上的进给基座与其一起移动。 馈送基部沿着垂直于第一通道的方向轴向地限定第二通道,并且包括第一端部部分和第二端部部分。 进料管可滑动地安装在第二通道中,并包括第一端部和第二端部。 砂轮修整头固定地安装在进料管的第二端部上以与其一起移动。

    Method and apparatus for improved conditioning of polishing pads
    29.
    发明授权
    Method and apparatus for improved conditioning of polishing pads 失效
    用于改善抛光垫调理的方法和装置

    公开(公告)号:US5941762A

    公开(公告)日:1999-08-24

    申请号:US3904

    申请日:1998-01-07

    摘要: A method and apparatus for conditioning the surface of a polishing pad used to polish a substrate, such as a semiconductor wafer. A conditioning apparatus uses two or more end effectors to abrade and/or remove the polishing byproducts from the surface of the pad. Different types of conditioning performance can be achieved when the end effectors are employed individually, sequentially or simultaneously during a polishing process.

    摘要翻译: 用于调理用于抛光衬底(例如半导体晶片)的抛光垫的表面的方法和装置。 调节装置使用两个或更多个端部执行器从衬垫的表面磨蚀和/或去除抛光副产物。 当在抛光过程中单独地,顺序地或同时地使用末端执行器时,可以实现不同类型的调节性能。

    Wafer polishing apparatus having physical cleaning means to remove
particles from polishing pad
    30.
    发明授权
    Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad 失效
    具有用于从抛光垫去除颗粒的物理清洁装置的晶片抛光装置

    公开(公告)号:US5690544A

    公开(公告)日:1997-11-25

    申请号:US623936

    申请日:1996-03-28

    申请人: Michio Sakurai

    发明人: Michio Sakurai

    CPC分类号: B24B53/017

    摘要: The invention relates to an apparatus for polishing wafers in the fabrication of semiconductor integrated circuits. The apparatus has a turntable on which a polishing pad of polyurethane foam is placed. The pad has a multiplicity of cavities in the polishing surface. In periodically dressing the pad, abrasive grains of diamond fall off the dressing tool, and some of the fallen abrasive grains remain in the cavities in the pad surface even though the pad surface is washed by water. According to the invention the polishing apparatus includes a cleaning device to drive abrasive grains out of the cavities. The cleaning device has a cylindrical body which rotates above the polishing pad. In an embodiment the cleaning device is a rotary brush having a multiplicity of needle-like parts of a synthetic resin on the cylindrical outer surface. The needle-like parts intrude into the cavities in the pad surface and flip abrasive grains out of the cavities. In another embodiment the cleaning device has an elastic covering on the cylindrical body. The elastic covering is squeezed into the cavities to temporarily close the opening of the cavities and reduce the air pressure in the cavities. When the elastic covering leaves the cavities a rush of the air into the cavities drives diamond grains out of the cavities.

    摘要翻译: 本发明涉及一种在制造半导体集成电路中抛光晶片的装置。 该装置具有放置聚氨酯泡沫的抛光垫的转台。 该抛光垫在抛光表面中具有多个空腔。 在定期修整垫片时,金刚石的磨粒从修整工具脱落,并且一些掉落的磨料颗粒保留在垫表面的空腔中,即使垫表面被水洗涤。 根据本发明,抛光装置包括将磨料颗粒驱出空腔的清洁装置。 清洁装置具有在抛光垫上方旋转的圆柱体。 在一个实施例中,清洁装置是在圆筒形外表面上具有合成树脂的多个针状部分的旋转刷。 针状部件侵入垫表面中的空腔并将磨料颗粒从空腔中翻出。 在另一个实施例中,清洁装置在圆柱体上具有弹性覆盖物。 弹性覆盖物被挤压到空腔中以临时闭合空腔的开口并且减小空腔中的空气压力。 当弹性覆盖物离开空腔时,空气涌入空腔将金刚石颗粒驱出空腔。