Abstract:
A circuit board coupled with jacks and conformed to Category 6 standard has conductors to connect IDC contacts and jack pins to reduce cross-talk and improve return-loss. The improvements are targeted on the pair 1 and 3 conductors of circuit conductors, and include forming capacitors by main conductors connecting to the IDC and jack on two sides of the circuit board, extending pair 1 and 3 conductor ends in the vicinity of IDC junctures to form a TR (or TT,RR) conductor layout, and extending pair 1 and 3 conductor ends in the vicinity of jack junctures to form a TT or RR conductor layout (or TT for IDC end, or RR for jack end) to generate induction effect, thereby to form the circuit board coupled with jacks that has circuit conductors laid on two sides thereof and conforms to Category 6 communication standard.
Abstract:
A distributed ground pad-based isolation arrangement for a multilayer stripline architecture is configured to effectively inhibit the mutual coupling of signals between overlapping regions of adjacent stripline networks of dielectrically separated transmission networks, without substantially increasing either the mass of the laminate structure or the lossiness of the stripline. At regions of mutual overlap, the stripline layers are spatially oriented at right angles to one another, and a limited area ground pad is interleaved between the stripline layers. To maintain the desired characteristic line impedance of a stripline layer as it passes over a ground pad, the width of the stripline layer is reduced in the overlap region. Each ground pad is connected to an external ground reference by plated vias, that extend through the dielectric layers and intersect outer grounded shielding layers of the laminate.
Abstract:
An interconnect structure includes in a first layer a clock line and a ground line running substantially parallel to the clock line, and a plurality of conductive regions lying in a second layer parallel to the first layer. The ground line is coupled to a source of ground potential. The conductive regions are aligned with the clock line and are disposed around a signal line routed in the second layer across the clock line. The conductive regions are electrically connected to the ground line, thereby forming a shield for the clock line that helps prevent clock signals propagated on the clock line from electromagnetically coupling with other signal lines. In one embodiment, a clock distribution network includes conductive regions (501, 503, 505 . . . ) in the metal layer below the clock line layer and two parallel ground lines (201, 203) in the same metal layer as the clock line (101). The conductive regions (501, 503, 505 . . . ) are electrically connected to the ground lines (201, 203) with vias (603A, 603B, 605A, 605B . . . ). In the same metal layer as the conductive regions, conductive signal lines (509, 511) are routed between the regions (501, 503, 505, 507 . . . ) to cross below the clock line. The conductive regions (501, 503, 505, 507 . . . ) form a shield between the clock line (101) and any signal lines (105) routed in the next metal layer adjacent to the metal layer containing the conductive regions.
Abstract:
An interconnect structure includes in a first layer a clock line and a ground line running substantially parallel to the clock line, and a plurality of conductive regions lying in a second layer parallel to the first layer. The ground line is coupled to a source of ground potential. The conductive regions are aligned with the clock line and are disposed around a signal line routed in the second layer across the clock line. The conductive regions are electrically connected to the ground line, thereby forming a shield for the clock line that helps prevent clock signals propagated on the clock line from electromagnetically coupling with other signal lines. In one embodiment, a clock distribution network includes conductive regions (501, 503, 505. . . ) in the metal layer below the clock line layer and two parallel ground lines (201, 203) in the same metal layer as the clock line (101). The conductive regions (501, 503, 505 . . .) are electrically connected to the ground lines (201, 203) with vias (603A, 603B, 605A, 605B . . . ). In the same metal layer as the conductive regions, conductive signal lines (509, 511) are routed between the regions (501, 503, 505, 507. . . ) to cross below the clock line. The conductive regions (501, 503, 505, 507. . . ) form a shield between the clock line (101) and any signal lines (105) routed in the next metal layer adjacent to the metal layer containing the conductive regions.
Abstract:
Connectors, such as 110-type patch plugs, are designed to reduce near-end crosstalk that is generated when the connector is mated to a corresponding receptacle, such as a 110-type connecting block. Connectors of the present invention employ a two-stage crosstalk compensation scheme in which a first stage induces a compensating crosstalk signal, having opposite polarity as the original crosstalk signal, while the second stage induces a counter-balancing crosstalk signal, having same polarity as the original crosstalk signal. The two-stage, counter-balanced crosstalk compensation scheme of the present invention takes into account both the magnitude of the original crosstalk signal as well as the phase differences between the original crosstalk signal and the compensating and counter-balancing crosstalk signals that result from the different locations along the signal path at which the crosstalk signals are induced. The contacts of the connector are designed such that the magnitudes and locations of the compensating and counter-balancing crosstalk signals provide effective crosstalk compensation over a particular range of frequencies, e.g., 1 MHz to 200 MHz.
Abstract:
A connector for communications systems has four input terminals and four output terminals, each arranged in an ordered array. A circuit electrically couples each input terminal to the respective output terminal and cancels crosstalk induced across the adjacent connector terminals. The circuit includes four conductive paths between the respective pairs of terminals. Each conductive path includes a plurality of conductive strips arranged in a zig-zag pattern with alternating strips mounted on opposite sides of the substrate and connected end-to-end by conductive devices passing through the substrate. The first and third paths are in relatively close proximity with conductive strips of the first path crossing conductive strips of the third path on opposite sides of the substrate to simulate a twisted wiring pair. The second and fourth paths are in relatively close proximity with conductive strips of the second path crossing conductive strips of the fourth path on opposite sides of the substrate to simulate a twist wiring pair.
Abstract:
There is provided an apparatus for reducing pair to pair cross talk which arises in electrical connectors due to closely spaced elongated parallel contacts. The cross talk which occurs within the connector is reduced by modifying certain circuit paths either inside or outside of the connector so that each conductor of a first pair which is parallel to and cross talking with an adjacent conductor of a second pair in the connector is relocated adjacent and parallel to the other conductor of the second pair over a predetermined distance. It is preferred that the relocation of the circuit paths occur on a circuit board which is attached to the connector.
Abstract:
A patch panel includes a printed circuit board, an RJ-45 jack and a connector block. The circuit paths from the RJ-45 jack to the connector block are selected to cross in a predetermined crossing pattern with the circuit paths having a predetermined length selected for the patch panel to carry high speed transmissions.
Abstract:
Disclosed is a circuit arrangement having an amplifier with first and second input terminals which are adapted to be coupled to a playback head, wherein the first input terminal of the amplifier is coupled through a first circuit section of a conductive pattern to a first terminal of the playback head and the second input terminal of the amplifier is coupled through a second circuit section of the conductive pattern to a second terminal of the playback head. The first and second circuit sections (3, 4) are arranged to insulatively cross each other at an intersection (6) to form a figure eight pattern having two loop sections of substantially equal areas to equalize the amounts of currents which are oppositely respectively induced in the first and second loop sections by an externally generated magnetic flux.