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255 条记录 (耗时 0.027 秒)

    Method for passivation of plasma etch defects in DRAM devices
    32.
    发明申请
    Method for passivation of plasma etch defects in DRAM devices 失效
    DRAM器件中等离子体蚀刻缺陷钝化的方法

    公开(公告)号：US20080124814A1

    公开(公告)日：2008-05-29

    申请号：US11515534

    申请日：2006-09-05

    申请人： Arvind Kumar ,  Keen Wah Chow ,  Devesh Kumar Datta ,  Subramanian Krishnan

    发明人： Arvind Kumar ,  Keen Wah Chow ,  Devesh Kumar Datta ,  Subramanian Krishnan

    IPC分类号： H01L21/02

    CPC分类号： H01L21/26513 ,  H01L27/10873

    摘要： A process for fabricating an MOS device specifically a DRAM device, featuring passivation of defects in regions of a semiconductor substrate wherein defects left unpassivated can deleteriously influence data retention time, has been developed. A high density plasma dry etching procedure used to define the DRAM conductive gate electrode can create unwanted defects in a region near the surface of uncovered portions of the semiconductor substrate during the high density plasma procedure over etch cycle. Implantation of a group V element such as arsenic can be used to passivate the unwanted plasma etch defects, thus reducing the risk of defect related device leakage phenomena. However to insure the group V implanted species remain at or near the semiconductor surface for optimum defect passivation, the group V element implantation procedure is performed after all high temperature DRAM fabrication steps, such as selective oxidation for creation of oxide spacers on the sides of the conductive gate electrode, have been completed. A slow diffusing implanted arsenic ion is the optimum candidate for passivation while faster diffusing group V elements such as phosphorous are not as attractive for defect passivation.

    摘要翻译： 已经开发了制造具有DRAM器件的MOS器件的工艺，其特征在于半导体衬底的区域中的缺陷钝化，其中缺陷未被激活可以有害地影响数据保留时间。 用于限定DRAM导电栅电极的高密度等离子体干蚀刻方法可以在蚀刻周期的高密度等离子体工艺期间在半导体衬底的未覆盖部分的表面附近的区域中产生不想要的缺陷。 可以使用诸如砷的V族元素的植入来钝化不需要的等离子体蚀刻缺陷，从而降低与缺陷相关的器件泄漏现象的风险。 然而，为了确保V族植入物质保留在半导体表面处或附近，以获得最佳缺陷钝化，在所有高温DRAM制造步骤之后执行V族元素注入程序，例如用于在 导电栅电极，已经完成。 缓慢扩散的注入砷离子是钝化的最佳候选物，而较快扩散V族元素（如磷）对缺陷钝化不具有吸引力。

    Socket and method for compensating for differing coefficients of thermal expansion
    33.
    发明授权
    Socket and method for compensating for differing coefficients of thermal expansion 有权
    用于补偿不同热膨胀系数的插座和方法

    公开(公告)号：US07303443B1

    公开(公告)日：2007-12-04

    申请号：US11548789

    申请日：2006-10-12

    申请人： Brian Samuel Beaman ,  Joseph Kuczynski ,  Theron Lee Lewis ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    发明人： Brian Samuel Beaman ,  Joseph Kuczynski ,  Theron Lee Lewis ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

    IPC分类号： H01R24/00

    CPC分类号： H01R13/533 ,  H01R12/716 ,  Y10T29/49222

    摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

    摘要翻译： 说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的热膨胀系数的差异的方法。 插座包括表面安装的触点和细长的外壳。 细长壳体包括孔，其中表面安装的接触件从孔径延伸。 至少一个板连接到细长壳体，其中至少一个板具有选择的热膨胀系数以补偿插座和印刷电路板之间的热膨胀系数差。

    Dissipating heat reliably in computer systems
    36.
    发明授权
    Dissipating heat reliably in computer systems 失效
    在计算机系统中可靠地散热

    公开(公告)号：US07068510B2

    公开(公告)日：2006-06-27

    申请号：US10728299

    申请日：2003-12-04

    申请人： Martin Joseph Crippen ,  Pat Gallarelli ,  Benjamin Michael Kreuz ,  Arvind Kumar Sinha

    发明人： Martin Joseph Crippen ,  Pat Gallarelli ,  Benjamin Michael Kreuz ,  Arvind Kumar Sinha

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20727 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253 ,  H05K7/2049

    摘要： A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.

    摘要翻译： 一种刀片服务器模块，包括：壳体组件; 布置在壳体组件内的印刷电路板，并以与其自由浮动的关系安装; 安装在印刷电路板上的处理器; 散热器组件设置在壳体组件中，靠近处理器; 以及一个或多个柔性压缩元件，其设置在壳体组件内，以便被预加载以在印刷电路板上提供力以迫使热源与散热器组件热接合。 公开了用于在紧凑的包装布置中可靠地散热的方法和系统，其特别适用于包括刀片服务器的计算系统。

    Method and apparatus for secure remote system management
    37.
    发明授权
    Method and apparatus for secure remote system management 失效
    用于安全远程系统管理的方法和装置

    公开(公告)号：US07024695B1

    公开(公告)日：2006-04-04

    申请号：US09476737

    申请日：1999-12-30

    申请人： Mohan J. Kumar ,  Arvind Kumar

    发明人： Mohan J. Kumar ,  Arvind Kumar

    IPC分类号： G06F11/00 ,  G06F11/22 ,  G06F11/30 ,  G06F11/32 ,  G06F11/34 ,  G06F11/36 ,  G06F12/14 ,  G06F12/16 ,  G06F15/18 ,  G08B23/00

    CPC分类号： G06F21/31 ,  G06F11/0748 ,  G06F11/0793 ,  G06F21/305 ,  G06F2221/2103 ,  H04L41/00 ,  H04L41/22 ,  H04L63/083

    摘要： To prevent unauthorized access to hardware management information in an out-of-band mode, i.e., when the operating system of the hardware is not executing, a method and apparatus employ an authentication protocol. Upon receiving a request for hardware component information in a service processor that is disposed in a hardware component, which request is received as an open session request and which request passes external to an operating system controlling the hardware component, the service processor transmits a challenge string to the requesting client application. In response to a challenge response received from the requesting client application, the service processor compares the challenge response to an expected response to the challenge. The expected challenge response is calculated by the service processor. Based on the result of the comparison, the service processor transmits an authentication response to the requesting client application indicating success or failure of the authentication process. On the client side, in response to a challenge string from the service processor, the requesting client application transmits to the service processor a challenge response, which includes an sequence number that increments with every new message from the requesting client application. The challenge response also includes a hash number calculated by the requesting client application, which hash number is a function of the challenge string, session identification number, sequence number and/or a password. Each new packet including data and/or commands from the client application includes a similarly calculated hash number.

    摘要翻译： 为了防止在带外模式（即，硬件的操作系统未执行）下的硬件管理信息的未经授权的访问，方法和装置采用认证协议。 在接收到在硬件组件中设置的服务处理器中的硬件组件信息的请求时，该请求作为开放会话请求被接收，并且哪个请求在控制硬件组件的操作系统外部通过，服务处理器发送挑战串 到请求的客户端应用程序。 响应于从请求客户端应用程序接收到的挑战响应，服务处理器将挑战响应与对挑战的期望响应进行比较。 预期的挑战响应由服务处理器计算。 基于比较的结果，服务处理器向请求客户端应用发送认证响应，指示认证过程的成败。 在客户端，响应于来自服务处理器的挑战串，请求客户端应用程序向服务处理器发送挑战响应，该响应响应包括随请求的客户端应用程序的每个新消息递增的序列号。 挑战响应还包括由请求客户端应用计算的哈希号，该哈希号是挑战串，会话识别号，序列号和/或密码的函数。 包括来自客户端应用程序的数据和/或命令的每个新分组包括类似地计算的散列数。