Multistage Autonomous Vehicle Motion Planning

    公开(公告)号:US20240166237A1

    公开(公告)日:2024-05-23

    申请号:US18465132

    申请日:2023-09-11

    CPC classification number: B60W60/0011 B60W40/04

    Abstract: Example methods for multistage autonomous vehicle motion planning include obtaining sensor data descriptive of an environment of the autonomous vehicle; identifying one or more objects in the environment based on the sensor data; generating a plurality of candidate strategies, wherein each candidate strategy of the plurality of candidate strategies comprises a set of discrete decisions respecting the one or more objects, wherein generating the plurality of candidate strategies includes: determining that at least two strategies satisfy an equivalence criterion, such that the plurality of candidate strategies include at least one candidate strategy corresponding to an equivalence class representative of a plurality of different strategies that are based on different discrete decisions; determining candidate trajectories respectively for the plurality of candidate strategies; and initiating control of the autonomous vehicle based on a selected candidate trajectory.

    FAULT DETECTION IN CONTROL SYSTEM FOR AUTONOMOUS VEHICLE

    公开(公告)号:US20240101156A1

    公开(公告)日:2024-03-28

    申请号:US18527929

    申请日:2023-12-04

    CPC classification number: B60W60/0021 B60W60/001 B60W60/0011 B60W50/023

    Abstract: A control system for an autonomous vehicle includes a time sensitive network switch and a control system interface. The control system interface includes a primary processing unit, a secondary processing unit, and a fault detection module. The control system receives a trajectory of an autonomous vehicle. The fault detection module detects a fault condition with the primary processing unit and prevents the primary processing unit from transmitting a primary control signal in response to the fault condition. The primary control signal is for autonomous control of the autonomous vehicle.

    Sensor console
    38.
    外观设计

    公开(公告)号:USD1017430S1

    公开(公告)日:2024-03-12

    申请号:US29835124

    申请日:2022-04-15

    Abstract: FIG. 1 is a front, top, and left side perspective view of the sensor console showing the new design according to a first implementation.
    FIG. 2 is a rear, bottom, and right side perspective view of the sensor console showing the new design according to the first implementation.
    FIG. 3 is a top view of the sensor console showing the new design according to the first implementation.
    FIG. 4 is a bottom view of the sensor console showing the new design according to the first implementation.
    FIG. 5 is a left side view of the sensor console showing the new design according to the first implementation.
    FIG. 6 is a right side view of the sensor console showing the new design according to the first implementation.
    FIG. 7 is a front view of the sensor console showing the new design according to the first implementation.
    FIG. 8 is a rear view of the sensor console showing the new design according to the first implementation.
    FIG. 9 is a front, top, and left side perspective view of the sensor console showing the new design according to a second implementation.
    FIG. 10 is a rear, bottom, and right side perspective view of the sensor console showing the new design according to the second implementation.
    FIG. 11 is a top view of the sensor console showing the new design according to the second implementation.
    FIG. 12 is a bottom view of the sensor console showing the new design according to the second implementation.
    FIG. 13 is a left side view of the sensor console showing the new design according to the second implementation.
    FIG. 14 is a right side view of the sensor console showing the new design according to the second implementation.
    FIG. 15 is a front view of the sensor console showing the new design according to the second implementation; and,
    FIG. 16 is a rear view of the sensor console showing the new design according to the second implementation.
    Within the drawings, the straight-line surface shading and stippling show the character and contour of the surfaces in the claimed design of the sensor console. The broken lines show unclaimed portions of the sensor platform, and thus form no part of the claimed design.

    Optical coupler for LIDAR sensor
    39.
    发明授权

    公开(公告)号:US11906667B2

    公开(公告)日:2024-02-20

    申请号:US17890243

    申请日:2022-08-17

    CPC classification number: G01S7/4818 G01S17/34 G01S17/931 G02B6/021

    Abstract: A LIDAR device for a vehicle includes an integrated chip. The integrated chip includes a substrate layer, a cladding layer, a waveguide, a scattering array, and a reflector layer. The cladding layer is disposed on the substrate layer to form an interface with the substrate layer. The waveguide is disposed within the cladding layer and configured to route an infrared optical field. The scattering array is disposed within the cladding layer between the waveguide and the interface and perturbs the infrared optical field and scatters the infrared optical field into a first beam propagating toward a surface of the cladding layer and into a second beam propagating towards the interface. The reflector layer is disposed within the cladding layer between the waveguide and the surface of the cladding layer to reflect the first beam towards the interface.

    Silicon photonics device for LIDAR sensor and method for fabrication

    公开(公告)号:US11906661B2

    公开(公告)日:2024-02-20

    申请号:US17853674

    申请日:2022-06-29

    CPC classification number: G01S7/4813 G01S17/931

    Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

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