Abstract:
One embodiment provides a method comprising: providing a sample comprising a bulk amorphous alloy; scanning ultrasonically at least a portion of the sample to determine a parameter of the sample in the portion; and comparing the parameter to a predetermined standard to derive a property related to the sample.
Abstract:
Embodiments relates to a hook side fastener having hooks and a loop side fastener having loops. The hooks and/or loops are made of bulk solidifying amorphous metal alloy. Other embodiments relate to methods of making and using the hook side and loop side fasteners.
Abstract:
Described herein is a feedstock comprising BMG. The feedstock has a surface with an average roughness of at least 200 microns. Also described herein is a feedstock comprising BMG. The feedstock, when supported on a support during a melting process of the feedstock, has a contact area between the feedstock and the support up to 50% of a total area of the support. These feedstocks can be made by molding ingots of BMG into a mole with surface patterns, enclosing one or more cores into a sheath with a roughened surface, chemical etching, laser ablating, machining, grinding, sandblasting, or shot peening. The feedstocks can be used as starting materials in an injection molding process.
Abstract:
An electronic device such as a media player is formed from electrical components such as integrated circuits, buttons, and a battery. Electrical input-output port contacts are used to play audio and to convey digital signals. Electrical components for the device are mounted to a substrate. The components are encapsulated in an encapsulant and covered with an optional housing structure. The electrical input-output port contacts and portions of components such as buttons remain uncovered by encapsulant during the encapsulation process. Integrated circuits are entirely encapsulated with encapsulant. The integrated circuits are packaged or unpackaged integrated circuit die. The substrate is a printed circuit board or is an integrated circuit to which components are directly connected without any printed circuit boards interposed between the integrated circuit and the components.
Abstract:
Various embodiments provide apparatus and methods for melting materials and for containing the molten materials within melt zone during melting. Exemplary apparatus may include a vessel configured to receive a material for melting therein; a load induction coil positioned adjacent to the vessel to melt the material therein; and a containment induction coil positioned in line with the load induction coil. The material in the vessel can be heated by operating the load induction coil at a first RF frequency to form a molten material. The containment induction coil can be operated at a second RF frequency to contain the molten material within the load induction coil. Once the desired temperature is achieved and maintained for the molten material, operation of the containment induction coil can be stopped and the molten material can be ejected from the vessel into a mold through an ejection path.
Abstract:
Described herein is a method of melting a bulk metallic glass (BMG) feedstock, comprising: heating at least a portion of the BMG feedstock to temperatures slightly below a solidus temperature of the BMG, wherein the portion remains a solid at the temperatures slightly below the solidus temperature and wherein a temperature distribution of the portion is essentially uniform; heating the portion of the BMG feedstock to temperatures above a liquidus point.
Abstract:
Described herein is a method of melting a bulk metallic glass (BMG) feedstock, comprising: feeding the BMG feedstock into a crucible; melting a first portion of the BMG feedstock to form molten BMG, while maintaining a second portion of the BMG feedstock solid; wherein the second portion and the crucible hold the molten BMG.
Abstract:
Various embodiments provide methods and apparatus for active cooling regulation of a melting process. In one embodiment, a meltable material can be melted in a vessel that includes cooling channel(s) configured therein. A contact temperature TContact of the vessel at an interface with the melt can be measured and compared with a skull forming temperature TSkull and a wetting temperature TWetting of the melt on the vessel. A cooling rate can be regulated to regulate TContact to be TSkull
Abstract:
Disclosed are methods and apparatus for determining an unknown degree of amorphicity in a bulk-solidifying amorphous alloy. A specimen can be prepared from the alloy, irradiated with passive radiation, imaged to provide a thermal image, and the image analyzed to assess the differences in emissivities in the image. The degree of amorphicity can be determined based on the differences in thermal emissivities.
Abstract:
A composite structure includes a matrix material having an intrinsic strain-to-failure rating in tension and a reinforcing material embedded in the bulk material. The reinforcing material is pre-stressed by a tensile force acting along one direction. The embedded reinforcing material interacts with the matrix material to place the composite structure into a compressive state. The compressive state provides an increased strain-to-failure rating in tension of the composite structure along a direction that is greater than the intrinsic strain-to-failure rating in tension of the matrix material along that direction. At least one of the matrix material and the reinforcing material is a bulk amorphous alloy (BAA). The reinforcing material can be a fiber or wire. In various embodiments, the matrix material may be a bulk amorphous alloy and/or the reinforcing material may be a bulk amorphous alloy.