Abstract:
An optical fiber switch in accordance with an embodiment of the present invention includes a first plurality of ports, a second plurality of ports, a first plurality of mirrors disposed on a first surface, and a second plurality of mirrors disposed on a second surface. Each one of the first plurality of mirrors is individually controllable to direct light output from a corresponding one of the first plurality of ports to any one of the second plurality of mirrors. Each one of the second plurality of mirrors is individually controllable to direct to a corresponding one of the second plurality of ports light incident on it from any one of the first plurality of mirrors. Advantageously, optical fiber switches in accordance with embodiments of the present invention may couple more than a thousand input ports to more than a thousand output ports with an insertion loss of less than about 3 decibels.
Abstract:
In the beam path of an Optical Cross Connect between the front face of a fiber block and a moveable mirror array are placed a telecentric lens and multi-surface optical element. The lens is placed adjacent the front face with a front focal plane coinciding with the front face. The substantially parallel beam path axes between the front face and the telecentric lens are converted by the lens into dispersing directions towards the optical element. Discrete optical surfaces of the optical element redirect the dispersing beam paths in a fashion such that the beam paths coincide in the following with corresponding moveable mirrors of a mirror array. Pitches of arrayed fiber ends and of the optical surfaces as well as the moveable mirrors are independently selectable. The telecentric lens simultaneously focuses the signal beams with improved beam separation and reduced signal loss.
Abstract:
A method of forming a bond pad structure reinforced with insulator spacers located on the sides of the bond pad structure has been developed. The method features formation of an aluminum based bond pad structure located overlying and contacting a top portion of a metal interconnect structure exposed in an opening in an intermetal dielectric layer. After deposition of an insulator layer such as silicon nitride or silicon oxide, an anisotropic dry etch procedure is employed to define the insulator spacers on the sides of the bond pad structure. The presence of insulator spacers on the sides of the bond pad structure reduces the risk of bond pad damage which can occur during subsequent pre-wire bonding dicing and transportation procedures.
Abstract:
An adjustable, head mountable stereoscopic viewer having a head band to mount the viewer to the user. A tilt bracket is pivotally joined on one end to the head band and at a pivot point on an opposite end to an optical assembly for adjustment of the assembly position to obtain maximum field of view. The optical assembly includes first (left) and second (right) mirror assemblies that receive and direct left and right stereo images from an image source, such as a poster, a TV image, etc., to the corresponding left and right eyes of the user. The left and right stereo images are displayed horizontally at the source, the right image preferably displayed above the left image. Each mirror assembly has two mirrors and an aperture, and functions in a similar manner to a periscope. Adjustment for a range of image sizes and distances is accomplished with a mirror adjustment, provided to vary the tilt of the mirror of one of the assemblies to adjust the overlap of the images. The optical assembly is adjustable about the pivot point to eliminate the unwanted upper (right) image from the left eye. An adjustable shutter plate is provided to restrict the optical opening to the right assembly for eliminating the unwanted lower (left) image from the right eye.
Abstract:
A method for continuously monitoring and controlling the etch rates within integrated circuits of silicon nitride insulator layers and silicon nitride insulator structures in aqueous ortho-phosphoric acid (H3PO4) solutions. To practice the method of the present invention, there is first provided an etch bath chamber containing therein an aqueous ortho-phosphoric acid (H3PO4) solution. There is provided continuously from the etch bath chamber to a hydrometer cell a sample stream of the aqueous ortho-phosphoric acid (H3PO4) solution. The sample stream of the aqueous ortho-phosphoric acid (H3PO4) solution is analyzed continuously within the hydrometer cell to provide a continuous specific gravity analysis of the sample stream of the aqueous ortho-phosphoric acid (H3PO4) solution. Finally, the continuous specific gravity analysis of the sample stream of the aqueous ortho-phosphoric acid (H3PO4) solution is employed to add intermittently to the aqueous ortho-phosphoric acid (H3PO4) solution a quantity of water sufficient to maintain a first water content of the aqueous ortho-phosphoric acid (H3PO4) solution within the etch bath chamber at a value greater than about 5 weight percent. Optionally, the continuous specific gravity analysis of the sample stream of the aqueous ortho-phosphoric acid (H3PO4) solution may also be simultaneously employed to add intermittently to the aqueous ortho-phosphoric acid (H3PO4) solution a quantity of heat sufficient to maintain a second water content of the aqueous ortho-phosphoric acid (H3PO4) solution within the etch bath at a value less than about 20 weight percent. The present invention also discloses the hydrometer cell and an automated etch bath chamber which are employed in practicing the method of the present invention.