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    Housing for Portable Electronic Device with Reduced Border Region
    31.
    发明申请
    Housing for Portable Electronic Device with Reduced Border Region 有权
    带边缘区域便携式电子设备的住房

    公开(公告)号：US20120281381A1

    公开(公告)日：2012-11-08

    申请号：US13246707

    申请日：2011-09-27

    Applicant: Emery A. Sanford ,  Fletcher R. Rothkopf ,  Stephen B. Lynch

    Inventor： Emery A. Sanford ,  Fletcher R. Rothkopf ,  Stephen B. Lynch

    IPC: H05K7/00 ,  H05K13/00

    CPC classification number: G06F1/1626 ,  G06F1/1601 ,  G06F1/1637 ,  G06F3/041 ,  H04B3/54 ,  H04L25/4902 ,  H04M1/0266 ,  Y10T29/49002

    Abstract: An electronic device having a housing structure that is configured to receive at least one glass cover is disclosed. The glass cover serves to cover a display assembly provided within the electronic device. The glass cover can be secured to the housing structure so as to facilitate providing a narrow border between an active display area and an outer edge of the housing structure. The enclosure for the electronic device can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

    Abstract translation: 公开了一种具有被配置为容纳至少一个玻璃盖的壳体结构的电子设备。 玻璃盖用于覆盖设置在电子设备内的显示组件。 玻璃盖可以固定到壳体结构，以便于在主动显示区域和壳体结构的外边缘之间提供窄边界。 用于电子设备的外壳可以是薄的，但是足够坚固以适合于在诸如便携式电子设备的电子设备中使用。

    Packaging with Multiple Functions After Opening
    32.
    发明申请
    Packaging with Multiple Functions After Opening 审中-公开
    包装多功能打开后

    公开(公告)号：US20120279877A1

    公开(公告)日：2012-11-08

    申请号：US13099013

    申请日：2011-05-02

    Applicant: Andrew J. JANIS ,  Fletcher R. Rothkopf

    Inventor： Andrew J. JANIS ,  Fletcher R. Rothkopf

    IPC: B65D81/36

    CPC classification number: B65D81/36 ,  B65D5/52 ,  B65D2585/6837

    Abstract: Packaging including a base and a removable lid for the base. The lid is configured for multiple configurations including a first configuration for storing an item and a second configuration for supporting the lid in a substantially upright orientation for displaying the item. Attachment supports can be included in the base for securing the stand in the upright orientation. Lid supports can be included in the attachment support to support the lid. Alternatively or additionally, an insert having a living hinge can be used to support the lid. The base may be substantially rigid or may be configured to be collapsible or to otherwise allow for multiple configurations.

    Abstract translation: 包装包括底座和底座可拆卸的盖子。 所述盖被构造成包括用于存储物品的第一配置和用于以基本上直立的方向支撑所述盖的第二配置的多种配置以显示所述物品。 安装支架可以包括在基座上，用于将支架固定在直立方向。 盖子支架可以包括在附件支架中以支撑盖子。 或者或另外，具有活动铰链的插入件可以用于支撑盖子。 基座可以是基本刚性的，或者可以被配置为可折叠的或以其他方式允许多种构造。

    ELECTRONIC DEVICES WITH FLEXIBLE DISPLAYS
    34.
    发明申请
    ELECTRONIC DEVICES WITH FLEXIBLE DISPLAYS 有权
    具有柔性显示器的电子设备

    公开(公告)号：US20120242592A1

    公开(公告)日：2012-09-27

    申请号：US13171295

    申请日：2011-06-28

    Applicant: Fletcher R. Rothkopf ,  Scott A. Myers ,  Stephen Brian Lynch

    Inventor： Fletcher R. Rothkopf ,  Scott A. Myers ,  Stephen Brian Lynch

    IPC: G06F3/041 ,  G09G5/00

    CPC classification number: G06F3/0412 ,  G06F1/1652 ,  G06F3/016 ,  G06F3/041 ,  G06F3/0414 ,  G06F2203/04102

    Abstract: Electronic devices may be provided that contain flexible displays and internal components. An internal component may be positioned under the flexible display. The internal component may be an output device such as a speaker that transmits sound through the flexible display or an actuator that deforms the display in a way that is sensed by a user. The internal component may also be a microphone or pressure sensor that receives sound or pressure information through the flexible display. Structural components may be used to permanently or temporarily deform the flexible display to provide tactile feedback to a user of the device.

    Abstract translation: 可以提供包含柔性显示器和内部组件的电子设备。 内部组件可以位于柔性显示器下方。 内部组件可以是诸如扬声器的输出设备，该扬声器通过柔性显示器发送声音，或者以使用户感测的方式使显示器变形的致动器。 内部组件也可以是通过柔性显示器接收声音或压力信息的麦克风或压力传感器。 结构部件可以用于永久地或暂时地变形柔性显示器，以向设备的用户提供触觉反馈。

    ANTENNAS MOUNTED UNDER DIELECTRIC PLATES
    37.
    发明申请
    ANTENNAS MOUNTED UNDER DIELECTRIC PLATES 有权
    天线安装在电介质板下

    公开(公告)号：US20120050114A1

    公开(公告)日：2012-03-01

    申请号：US12870766

    申请日：2010-08-27

    Applicant: Qingxiang Li ,  Robert W. Schlub ,  Fletcher R. Rothkopf ,  Adam D. Mittleman ,  Yi Jiang ,  Emily McMilin ,  Lijun Zhang

    Inventor： Qingxiang Li ,  Robert W. Schlub ,  Fletcher R. Rothkopf ,  Adam D. Mittleman ,  Yi Jiang ,  Emily McMilin ,  Lijun Zhang

    IPC: H01Q1/24

    CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10

    Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.

    Abstract translation: 提供包含无线通信电路的电子设备。 无线通信电路可以包括射频收发器电路和天线结构。 天线结构可以包括天线，例如包含天线谐振元件和天线接地元件的倒F天线。 天线谐振元件可以由诸如柔性电路基板的基板上的图案化导电迹线形成。 天线接地元件可以由诸如金属外壳壁的导电器件结构形成。 诸如电介质支撑构件和泡沫层的支撑和偏置结构可用于支撑和偏置天线谐振元件抵抗平面装置结构。 天线谐振元件被偏压的平面器件结构可以是诸如显示器盖玻璃或其它平面结构的透明层的平面电介质构件。 粘合剂可以介于平面结构和天线谐振元件之间。

    FORMED PCB
    38.
    发明申请
    FORMED PCB 有权
    形成PCB

    公开(公告)号：US20120044637A1

    公开(公告)日：2012-02-23

    申请号：US12859712

    申请日：2010-08-19

    Applicant: Fletcher R. Rothkopf ,  Phillip M. Hobson ,  Adam Mittleman ,  Anna-Katrina Shedletsky

    Inventor： Fletcher R. Rothkopf ,  Phillip M. Hobson ,  Adam Mittleman ,  Anna-Katrina Shedletsky

    IPC: G06F1/16 ,  H05K7/00 ,  H05K3/10

    CPC classification number: H05K7/1427 ,  G06F1/1626 ,  G06F1/1658 ,  G06F1/181 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/056 ,  Y10T29/49155

    Abstract: Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.

    Abstract translation: 描述了可用于便携式计算设备中的用于形成PCB的方法。 PCB可以以弯曲的配置安装在便携式计算设备中。 在特定实施例中，连续形成的PCB可以被成形为具有连接薄连接器部分的两个大区域。 薄连接器部分可以连接两个大区域中的每一个的组件，并且可以用来代替柔性连接器。 在一个实施例中，PCB可以由包括迹线和衬底层的多个层形成。 可以调整迹线和基底层以影响各个区域中PCB的刚度，例如在施加弯矩之后允许PCB保持弯曲构型。

    Thinned-Portion Substrates
    40.
    发明申请
    Thinned-Portion Substrates 审中-公开
    薄化部分基板

    公开(公告)号：US20110128237A1

    公开(公告)日：2011-06-02

    申请号：US12629826

    申请日：2009-12-02

    Applicant: Fletcher R. ROTHKOPF ,  Stephen ZADESKY ,  Stephen Brian LYNCH ,  Chris D. PREST ,  Tang Yew TAN ,  Kyle Harris YEATES ,  Shin John CHOI ,  Richard Hung Minh DINH

    Inventor： Fletcher R. ROTHKOPF ,  Stephen ZADESKY ,  Stephen Brian LYNCH ,  Chris D. PREST ,  Tang Yew TAN ,  Kyle Harris YEATES ,  Shin John CHOI ,  Richard Hung Minh DINH

    IPC: H01J9/00 ,  G06F3/041

    CPC classification number: G06F3/041

    Abstract: Thinned-portion substrates and processing of thinned-portion substrates is provided. A portion of a substrate, such as a mother glass used in touch screen manufacturing, can be thinned by forming a cavity in a surface of the substrate. Surface structures, such as touch sensing circuitry and/or display circuitry, can then be formed on the thinned portion of the substrate. For example, touch screen components can be formed as surface structures including touch sensing circuitry and display circuitry on one or more thinned substrate portions through processes including depositing, masking, etching, doping, etc. The thinned substrate portion, including the surface structures formed thereon, can then be detached from the surrounding thicker part of the substrate. In this way, for example, the surrounding thicker part of the substrate can provide structural integrity during various other manufacturing processes, while allowing surface structures to be formed directly on a thinner substrate.

    Abstract translation: 提供了薄壁部分基板和薄壁部分基板的加工。 基板的一部分，例如用于触摸屏制造的母玻璃，可以通过在基板的表面中形成空腔来减薄。 然后可以在衬底的薄化部分上形成诸如触摸感测电路和/或显示电路的表面结构。 例如，触摸屏部件可以通过包括沉积，掩模，蚀刻，掺杂等的工艺在一个或多个薄化的衬底部分上形成为包括触摸感测电路和显示电路的表面结构。包括其上形成的表面结构的薄化衬底部分 ，然后可以从基底的周围较厚的部分分离。 以这种方式，例如，衬底的周围较厚的部分可以在各种其它制造工艺期间提供结构完整性，同时允许在更薄的衬底上直接形成表面结构。

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