公开(公告)号：US20210121911A1

公开(公告)日：2021-04-29

申请号：US17247860

申请日：2020-12-28

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Ziv Gilan

IPC: B05D1/26 ,  B05D1/40 ,  B05D7/00 ,  B05C11/02 ,  B05C11/10 ,  B05C5/02 ,  B05C1/08

Abstract: Systems and methods for dispensing liquid materials as may be used in applications for coating flexible films and the like. Such a film may be coated by dispensing a rheological material onto its surface while drawing the film through a gap between a pair of rollers. The gap defines the thickness of a layer of the material applied to the film and is maintained at a desired width by microwires positioned through the gap. Another film across the gap from that to which the rheological material is applied aids in the coating of the layer and a contact area of the second film may be adjusted relative to the gap, e.g., when changing materials or when the coating film becomes abraded or deformed.

公开(公告)号：US10562231B2

公开(公告)日：2020-02-18

申请号：US16126565

申请日：2018-09-10

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Ziv Gilan

IPC: B22F3/00 ,  B23K26/402 ,  B29C35/08 ,  B29C64/106 ,  B29C64/393 ,  B29C64/40 ,  B29C64/118 ,  B29C64/112 ,  B29C64/165 ,  G05B19/4099 ,  B29C64/379 ,  B29C64/209 ,  B29C64/277 ,  B29C64/268 ,  B33Y10/00 ,  B33Y30/00

Abstract: A system of solid free form fabrication (SFF) is disclosed. The system comprises: receiving SFF data collectively pertaining to a three-dimensional shape of the object and comprising a plurality of slice data each defining a layer of the object. The system also comprises, for each of at least a few of the layers, dispensing a building material on a receiving medium, straightening the building material, and selectively ablating the building material according to respective slice data.

公开(公告)号：US20190322036A1

公开(公告)日：2019-10-24

申请号：US16383891

申请日：2019-04-15

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Ziv Gilan

IPC: B29C64/112 ,  B29C64/205 ,  B29C64/268 ,  B33Y10/00 ,  B41M5/00

Abstract: Laser jetting of droplets of a viscous material, such as an ink, is performed by coating a layer of ink on a mesh-like transport screen, with the ink being retained within spaces of the mesh-like transport screen. The ink-coated mesh-like transport screen is conveyed to a working area and a laser beam is used to heat the ink within the spaces of the mesh-like transport screen, thereby causing ink droplets to be jetted from the spaces of the mesh-like transport screen. Structures are formed on a receiving substrate arranged near the working area by jetting the ink droplets, either in an aggregation or sequentially, across a gap from the mesh-like transport screen to the receiving substrate and displacing the mesh-like transport screen and the laser beam relative to one another at times between the jetting of the droplets, or by directly printing ink droplets onto the receiving substrate.

公开(公告)号：US12089328B2

公开(公告)日：2024-09-10

申请号：US18499009

申请日：2023-10-31

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Guy Nesher

IPC: H05K1/11 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

公开(公告)号：US12064899B2

公开(公告)日：2024-08-20

申请号：US18306415

申请日：2023-04-25

Applicant: Ivoclar Vivadent AG ,  IO Tech Group Ltd

Inventor： Lorenz Josef Bonderer ,  Jürgen Rudolf Laubersheimer ,  Wolfgang Josef Wachter ,  Michael Zenou

IPC: B28B1/00 ,  B28B11/24 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  C08K5/3465 ,  C08L71/02 ,  C08L91/06 ,  B29K509/02

CPC classification number: B28B1/001 ,  B28B11/243 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  C08K5/3465 ,  C08L71/02 ,  C08L91/06 ,  B29K2509/02

Abstract: A material for use as support material for energy-pulse-induced transfer printing, which contains (a) at least one energy transformation component, (b) at least one volume expansion component and (c) at least one binder and which has a viscosity at 25° C. of from 0.2 Pas to 1000 Pas and a surface tension at 25° C. of from 20 to 150 mN/m. The invention furthermore relates to a process for producing three-dimensional objects using the support material.

公开(公告)号：US12010800B2

公开(公告)日：2024-06-11

申请号：US17305108

申请日：2021-06-30

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

IPC: H05K13/04 ,  B65G47/91 ,  H05K3/30 ,  H05K13/08

CPC classification number: H05K13/0409 ,  B65G47/91 ,  H05K3/301 ,  H05K13/0812 ,  Y10T29/53174

Abstract: In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.

公开(公告)号：US20240064897A1

公开(公告)日：2024-02-22

申请号：US18499009

申请日：2023-10-31

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Guy Nesher

IPC: H05K1/11 ,  H05K13/04 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K13/046 ,  H05K3/341 ,  H05K2201/10666

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

公开(公告)号：US11785722B2

公开(公告)日：2023-10-10

申请号：US17931331

申请日：2022-09-12

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou

IPC: H05K3/28 ,  H05K3/00 ,  C23C14/34 ,  H05K3/12 ,  B05C5/00 ,  B05C5/02

CPC classification number: H05K3/282 ,  H05K3/0091 ,  B05C5/001 ,  B05C5/02 ,  C23C14/34 ,  C23C14/3435 ,  H05K3/0026 ,  H05K3/1283 ,  H05K2203/107 ,  H05K2203/1366

Abstract: Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

公开(公告)号：US20230256652A1

公开(公告)日：2023-08-17

申请号：US18306430

申请日：2023-04-25

Applicant: Ivoclar Vivadent AG ,  IO Tech Group Ltd.

Inventor： Lorenz Josef Bonderer ,  Jürgen Rudolf Laubersheimer ,  Wolfgang Josef Wachter ,  Michael Zenou

IPC: B28B1/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  B29C64/165 ,  B28B11/24 ,  C08K5/3465 ,  C08L71/02 ,  C08L91/06

CPC classification number: B28B1/001 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  B29C64/165 ,  B28B11/243 ,  C08K5/3465 ,  C08L71/02 ,  C08L91/06 ,  B29K2509/02

Abstract: A material for use as support material for energy-pulse-induced transfer printing, which contains (a) at least one energy transformation component, (b) at least one volume expansion component and (c) at least one binder and which has a viscosity at 25° C. of from 0.2 Pas to 1000 Pas and a surface tension at 25° C. of from 20 to 150 mN/m. The invention furthermore relates to a process for producing three-dimensional objects using the support material.

公开(公告)号：US20230240022A1

公开(公告)日：2023-07-27

申请号：US17649100

申请日：2022-01-27

Applicant: IO Tech Group Ltd.

Inventor： Ralph S. Birnbaum ,  Guy Nesher ,  Alexander Slavomir Stepinski ,  Michael Zenou

IPC: H05K3/46 ,  C23C14/28 ,  B23K26/342

CPC classification number: H05K3/4664 ,  C23C14/28 ,  B23K26/342 ,  H05K3/4682 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/1492 ,  B23K2101/42

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (e.g., epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4). The jet printing unit can also be used for sintering and/or ablating materials. Printed materials are cured by heat or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.