Abstract:
A semiconductor integrated circuit includes a plurality of slave chips each including a core area including a memory cell array, a global data line configured to transfer input/output data of the corresponding core area, and a first peripheral circuit area configured to interface the corresponding core area and the corresponding global data line, a plurality of data transfer through-chip vias vertically formed through the plurality of slave chips, respectively, and coupled to the respective global data lines of the slave chips, and a master chip including a second peripheral circuit area configured to provide an input/output interface between the data transfer through-chip vias and an external controller.
Abstract:
A semiconductor integrated circuit includes a semiconductor chip including a memory cell array, a plurality of first through-chip vias configured to vertically penetrate through the semiconductor chip and operate as an interface for a signal and a supply voltage, and a semiconductor substrate. The semiconductor substrate includes a peripheral circuit region coupled to the plurality of first through-chip vias and configured to control the semiconductor chip and a conductivity pattern region configured to operate as an interface for the signal and the supply voltage between the peripheral circuit region and an external controller.
Abstract:
A semiconductor system for identifying stacked chips includes a first semiconductor chip and a plurality of second semiconductor chips. The first semiconductor chip generates a plurality of counter codes by using an internal clock or an external input clock and transmits slave address signals and the counter codes through a through-chip via. The second semiconductor chips are given corresponding identifications (IDs) by latching the counter codes for a predetermined delay time, compare the latched counter codes with the slave address signals, and communicate data with the first semiconductor chip through the through-chip via according to the comparison result.
Abstract:
An open loop type delay locked loop includes a delay amount pulse generation unit configured to generate a delay amount pulse having a pulse width corresponding to a delay amount for delay locking a clock signal, a delay amount coding unit configured to output a code value by coding the delay amount in response to the delay amount pulse, a clock control unit configured to adjust a toggling period of the clock signal in response to a control signal, and a delay line configured to delay an adjusted clock signal outputted from the clock control unit in response to the code value.
Abstract:
A semiconductor apparatus having a plurality of chips stacked therein is disclosed. At least two of the plurality of chips are configured to receive a column command and generate a column control signal based on the column command. Generation timing of the column control signal generated based on a column command in one of the at least two of the plurality of chips substantially coincide with the generation timing in the other of the at least two of the plurality of chips.
Abstract:
A local sense amplifier of a semiconductor memory apparatus includes a read amplification unit configured to amplify data of first data lines and transfer the amplified data to second data lines during a read operation; and a write amplification unit configured to amplify data of the second data lines and transfer the amplified data to the first data lines during a write operation.
Abstract:
A command control circuit of a semiconductor integrated device includes a plurality of latches sequentially connected and receiving a command signal, and a plurality of selection switches configured to pass or to interrupt the command signal inputted to each one of the plurality of latches.
Abstract:
A pumping voltage generating circuit of a semiconductor memory apparatus, the pumping voltage generating circuit includes a detecting unit configured to compare a level of a pumping voltage with a level of a reference voltage to generate a detection signal, an oscillating signal generator configured to sequentially generate a first oscillating signal and a second oscillating signal in response to the detection signal, and to elevate frequencies of the first and second oscillating signals when the second oscillating signal is generated, a first pump configured to perform a pumping operation in response to the first oscillating signal, and a second pump configured to perform a pumping operation in response to the second oscillating signal, wherein output terminals of the first pump and the second pump are commonly connected, and the pumping voltage is output at the output terminals of the first pump and the second pump.
Abstract:
A precharge circuit of a semiconductor memory apparatus includes a first precharge unit and a second precharge unit. The first precharge unit applies a first core voltage to a pair of local input/output lines, in response to a first precharge signal, to precharge the pair of local input/output lines. The second precharge unit applies a clamp voltage, which is generated using a first supply voltage, to the pair of local input/output lines, in response to the first precharge signal, to precharge the pair of local input/output lines.
Abstract:
A sense amplifier control signal generating circuit of a semiconductor memory apparatus is provided. The sense amplifier control signal generating circuit includes a timing control unit that models a transmission path of data from a memory cell to a sense amplifier through a bit line and generates a timing control signal at a sensing timing when the sense amplifier starts a sensing operation. A sense amplifier control signal generating unit receives the timing control signal and generates a sense amplifier control signal.