Abstract:
A projection system, a spatial light modulator, and a method for forming a micromirror array such as for a projection display are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light absorbing layer can form a pattern, such as a frame around an array of micro-mirrors.
Abstract:
A micro-mirror that comprises a substrate, a hinge structure formed on the substrate and a mirror plate attached to the hinge structure is provided for use in display systems. The mirror plate is capable of rotating from a non-deflected resting state to a state that is at least 14°, and preferably from 15° to 27° from the non-deflected resting state. In operation, the micro-mirror switches between an “ON”-state and “OFF”-state, which are defined in accordance with a rotational position of the mirror plate. The OFF state can be a non-deflected position of the micro-mirror (generally parallel to the substrate), the same angle (though opposite direction) as the ON state, or an angle less than the ON state (though in the opposite direction). Reflected light from the “ON” and “OFF” states are thus separated and the contrast ratio is improved.
Abstract:
A micromirror device is disclosed, along with a method of making such a micromirror device that comprises a mirror plate, a hinge and an extension plate. The extension plate is formed on the mirror plate and between the mirror plate and the electrode associated with the mirror plate for rotating the mirror plate. The extension plate can be metallic or dielectric. Also disclosed is a method of making such a micromirror device. In particular, the extension plate is formed after the formation of the mirror plate. Moreover, also disclosed is a projection system that comprises a spatial light modulator having an array of such micromirrors, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.
Abstract:
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
Abstract:
A projection system, a spatial light modulator, and a method for forming micromirrors are disclosed. A substrate comprises circuitry and electrodes for electrostatically deflecting micromirror elements that are disposed within an array of such elements forming the spatial light modulator. In one embodiment, the substrate is a silicon substrate having circuitry and electrodes thereon for electrostatically actuating adjacent micromirror elements, and the substrate is fully or selectively covered with a light absorbing material.
Abstract:
A method and an improved multilayer hinge structure for use in a micromirror device for a spatial light modulator are provided herein. The micromirror device presents a conductive, composite torsion hinge with improved mechanical reliability, achieved by optimizing the geometry of the hinge, which minimizes the amount of residual twist, fixed torsional stiffness and fixed rate of plastic deformation in the mechanically undesirable hinge element. A method and its alternatives are disclosed herein by the present invention for manufacturing such multilayer hinge structure.
Abstract:
The present invention discloses a method for processing a deformable element of a microstructure for reducing the plastic deformation by oxidizing the deformable element. The method of the present invention can be performed at a variety of stages of the fabrication and packaging processes.
Abstract:
A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. The micromirror device comprises a hinge support formed on a substrate and a hinge that is held by the hinge support. A mirror plate is connected to the hinge via a contact, and the distance between the mirror plate and the hinge is determined according to desired maximum rotation angle of the mirror plate, the optimum gap and pitch between the adjacent micromirrors. In a method of fabricating such spatial light modulator, one sacrificial layer is deposited on a substrate followed by forming the mirror plates, and another sacrificial layer is deposited on the mirror plates followed by forming the hinge supports. The two sacrificial layers are removed via the small gap between adjacent mirror devices with spontaneous vapor phase chemical etchant.
Abstract:
A projection system, a spatial light modulator, and a method for forming a micromirror array such as for a projection display are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light absorbing layer can form a pattern, such as a frame around an array of micro-mirrors.
Abstract:
Processes for the removal of a layer or region from a workpiece material by contact with a process gas in the manufacture of a microstructure are enhanced by the ability to accurately determine the endpoint of the removal step. A vapor phase etchant is used to remove a material that has been deposited on a substrate, with or without other deposited structure thereon. By creating an impedance at the exit of an etching chamber (or downstream thereof), as the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the endpoint of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber.