VERTICAL TRANSISTOR HAVING AN ASYMMETRIC GATE
    31.
    发明申请
    VERTICAL TRANSISTOR HAVING AN ASYMMETRIC GATE 有权
    具有不对称门的垂直晶体管

    公开(公告)号:US20130093000A1

    公开(公告)日:2013-04-18

    申请号:US13271812

    申请日:2011-10-12

    Abstract: A transistor structure is formed to include a substrate and, overlying the substrate, a source; a drain; and a channel disposed vertically between the source and the drain. The channel is coupled to a gate conductor that surrounds the channel via a layer of gate dielectric material that surrounds the channel. The gate conductor is composed of a first electrically conductive material having a first work function that surrounds a first portion of a length of the channel and a second electrically conductive material having a second work function that surrounds a second portion of the length of the channel. A method to fabricate the transistor structure is also disclosed. The transistor structure can be characterized as being a vertical field effect transistor having an asymmetric gate.

    Abstract translation: 晶体管结构被形成为包括衬底和覆盖衬底的源极; 排水 以及垂直设置在源极和漏极之间的通道。 通道耦合到栅极导体,该栅极导体通过围绕该沟道的栅极电介质材料层围绕该沟道。 栅极导体由具有围绕通道长度的第一部分的第一功函数的第一导电材料和具有围绕通道长度的第二部分的第二功函数的第二导电材料组成。 还公开了制造晶体管结构的方法。 晶体管结构可以表征为具有非对称栅极的垂直场效应晶体管。

    MULTI-GATE TRANSISTOR HAVING SIDEWALL CONTACTS
    35.
    发明申请
    MULTI-GATE TRANSISTOR HAVING SIDEWALL CONTACTS 有权
    具有端子接触器的多栅极晶体管

    公开(公告)号:US20120326236A1

    公开(公告)日:2012-12-27

    申请号:US13604340

    申请日:2012-09-05

    CPC classification number: H01L29/785 H01L29/66795 H01L2029/7858

    Abstract: A multi-gate transistor having a plurality of sidewall contacts and a fabrication method that includes forming a semiconductor fin on a semiconductor substrate and etching a trench within the semiconductor fin, depositing an oxide material within the etched trench, and etching the oxide material to form a dummy oxide layer along exposed walls within the etched trench; and forming a spacer dielectric layer along vertical sidewalls of the dummy oxide layer. The method further includes removing exposed dummy oxide layer in a channel region in the semiconductor fin and beneath the spacer dielectric layer, forming a high-k material liner along sidewalls of the channel region in the semiconductor fin, forming a metal gate stack within the etched trench, and forming a plurality of sidewall contacts within the semiconductor fin along adjacent sidewalls of the dummy oxide layer.

    Abstract translation: 一种具有多个侧壁触点的多栅极晶体管及其制造方法,包括在半导体衬底上形成半导体鳍片并蚀刻半导体鳍片内的沟槽,在蚀刻沟槽内沉积氧化物材料,并蚀刻氧化物材料以形成 沿着蚀刻沟槽内的暴露壁的虚拟氧化物层; 以及沿所述虚拟氧化物层的垂直侧壁形成间隔电介质层。 该方法还包括去除半导体鳍片中的沟道区域中的暴露的虚拟氧化物层并且在间隔物电介质层下方形成沿着半导体鳍片中的沟道区域的侧壁形成高k材料衬垫,在蚀刻 沟槽,并且在半导体鳍片内沿虚拟氧化物层的相邻侧壁形成多个侧壁接触。

    GRAPHENE BASED THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE
    37.
    发明申请
    GRAPHENE BASED THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE 有权
    基于GRAPHENE的三维集成电路设备

    公开(公告)号:US20120295423A1

    公开(公告)日:2012-11-22

    申请号:US13557501

    申请日:2012-07-25

    CPC classification number: H01L27/0688 H01L29/1606 Y10S977/755

    Abstract: A three-dimensional (3D) integrated circuit (IC) structure includes a first layer of graphene formed over a substrate; a first level of one or more active devices formed using the first layer of graphene; an insulating layer formed over the first level of one or more active devices; a second layer of graphene formed over the insulating layer; and a second level of one or more active devices formed using the second layer of graphene, the second level of one or more active devices electrically interconnected with the first level of one or more active devices.

    Abstract translation: 三维(3D)集成电路(IC)结构包括在衬底上形成的第一层石墨烯; 使用第一层石墨烯形成的一个或多个有源器件的第一级; 绝缘层,形成在一个或多个有源器件的第一级上; 在所述绝缘层上形成的第二层石墨烯; 以及使用第二层石墨烯形成的一个或多个有源器件的第二电平,一个或多个有源器件的第二电平与一个或多个有源器件的第一电平电互连。

    Field Effect Transistor Device and Fabrication
    39.
    发明申请
    Field Effect Transistor Device and Fabrication 有权
    场效应晶体管器件和制造

    公开(公告)号:US20120286366A1

    公开(公告)日:2012-11-15

    申请号:US13554294

    申请日:2012-07-20

    Abstract: In one aspect of the present invention, a field effect transistor (FET) device includes a first FET including a dielectric layer disposed on a substrate, a first portion of a first metal layer disposed on the dielectric layer, and a second metal layer disposed on the first metal layer, a second FET including a second portion of the first metal layer disposed on the dielectric layer, and a boundary region separating the first FET from the second FET.

    Abstract translation: 在本发明的一个方面中,场效应晶体管(FET)器件包括:第一FET,其包括设置在基板上的电介质层,设置在电介质层上的第一金属层的第一部分和设置在电介质层上的第二金属层 第一金属层,包括设置在电介质层上的第一金属层的第二部分的第二FET以及将第一FET与第二FET分离的边界区域。

    Field Effect Transistor Device with Shaped Conduction Channel
    40.
    发明申请
    Field Effect Transistor Device with Shaped Conduction Channel 有权
    具有形状导通通道的场效应晶体管器件

    公开(公告)号:US20120280279A1

    公开(公告)日:2012-11-08

    申请号:US13551164

    申请日:2012-07-17

    Abstract: A field effect transistor device includes a substrate, a silicon germanium (SiGe) layer disposed on the substrate, gate dielectric layer lining a surface of a cavity defined by the substrate and the silicon germanium layer, a metallic gate material on the gate dielectric layer, the metallic gate material filling the cavity, a source region, and a drain region.

    Abstract translation: 场效应晶体管器件包括衬底,设置在衬底上的硅锗(SiGe)层,衬在由衬底和硅锗层限定的空腔的表面上的栅介质层,栅极介电层上的金属栅极材料, 填充空腔的金属栅极材料,源极区域和漏极区域。

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