公开(公告)号：US20040043220A1

公开(公告)日：2004-03-04

申请号：US10462663

申请日：2003-06-17

Applicant: Toyo Tanso Co., Ltd.

Inventor： Yoshiaki Hirose ,  Hideki Inomoto

IPC: B32B009/00 ,  B32B031/00

CPC classification number: C04B35/536 ,  B32B2315/02 ,  C04B2235/604 ,  C04B2235/65 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/94 ,  C04B2237/363 ,  C30B35/00 ,  Y10T428/30

Abstract: The invention provides a flexible, highly pure expanded graphite sheet characterized by having an impurity content of 10 ppm or less and such a degree of flexibility that a sample thereof, 10null100 mm in size can withstand at least 10 times of bending in flexibility test comprising repeatedly bending the sample, with a 50-g weight suspended from one end thereof, by means of bending bodies with a diameter of 6 mm.

Abstract translation: 本发明提供一种挠性高纯度的膨胀石墨片，其特征在于杂质含量为10ppm或更低，并且具有这样的柔性程度，使其尺寸为10×100mm的样品在挠性试验中可承受至少10次弯曲，包括重复 用一个直径为6毫米的弯曲体从一端悬挂50克重的样品。

公开(公告)号：US20030038252A1

公开(公告)日：2003-02-27

申请号：US10177970

申请日：2002-06-21

Applicant: Toyo Tanso Co., Ltd.

Inventor： Cornel Danciu ,  Thomas Abels ,  Brian Good

IPC: G21K005/10 ,  H01J037/08 ,  G21F001/00 ,  H01L021/425

CPC classification number: H01J37/09 ,  C23C14/48 ,  C23C14/564 ,  H01J2237/05 ,  H01J2237/31701

Abstract: A shielding assembly for use in a semiconductor manufacturing apparatus, such as an ion implantation apparatus, includes one or more removable shielding members configured to cover inner surfaces of a mass analyzing chamber. The shielding assembly reduces process by-products from accumulating on the inner surfaces. In one embodiment, a shielding assembly includes first and second shielding members, each having a unitary construction and configured to cover a magnetic area in the mass analyzing chamber. The shielding members desirably are made entirely of graphite or impregnated graphite to minimize contamination of the semiconductor device being processed caused by metal particles eroded from the inner surfaces of the mass analyzing chamber.

Abstract translation: 用于半导体制造装置（例如离子注入装置）中的屏蔽组件包括构造成覆盖质量分析室的内表面的一个或多个可移除屏蔽构件。 屏蔽组件减少了积累在内表面上的过程副产物。 在一个实施例中，屏蔽组件包括第一和第二屏蔽构件，每个屏蔽构件具有整体构造并且构造成覆盖质量分析室中的磁性区域。 屏蔽构件理想地由石墨或浸渍石墨制成，以最小化由被质量分析室的内表面侵蚀的金属颗粒引起的被处理半导体器件的污染。

公开(公告)号：US20240210114A1

公开(公告)日：2024-06-27

申请号：US18288469

申请日：2022-04-26

Applicant: OHWADA CARBON INDUSTRIAL CO., LTD. ,  TOYO TANSO CO., LTD.

Inventor： Hiromichi OKASHITA ,  Takayuki TADA ,  Hiroshi MACHINO ,  Toshiharu HIRAOKA ,  Yasunori MURAKI ,  Masaru KAJI

IPC: F27D1/00 ,  C04B35/83

CPC classification number: F27D1/0043 ,  C04B35/83 ,  C04B2235/9607 ,  F27D2001/0063

Abstract: A heat resistant structure includes: a core formed of a plurality of C/C composite members; and a shell material covering at least a portion of a surface of the core and made of metal.

公开(公告)号：US20220328846A1

公开(公告)日：2022-10-13

申请号：US17615830

申请日：2020-06-03

Applicant: TOYO TANSO CO., LTD.

Inventor： Yoshio SHODAI ,  Mizuho ANZAI

IPC: H01M4/92 ,  H01M4/88 ,  H01M4/86

Abstract: A supported platinum catalyst having a high ratio of a diffraction peak intensity of a Pt (220) plane and having excellent oxidation resistance, obtained by a simple production method without using a polymer. The supported platinum catalyst includes a carbon support and platinum fine particles supported on the carbon support, the platinum fine particles being such that a ratio of a diffraction peak intensity of a (220) plane with respect to a total of diffraction peak intensities of a (111) plane, a (200) plane, and the (220) plane by X-ray diffraction is not less than 0.128.

公开(公告)号：US20210375663A1

公开(公告)日：2021-12-02

申请号：US17282095

申请日：2019-09-30

Applicant: TOYO TANSO CO., LTD.

Inventor： Takahiro Ikejiri

IPC: H01L21/687 ,  H01L21/67

Abstract: Provided is a susceptor which enables improvement in yield of semiconductor chips produced from wafers, has a long life, and hardly causes chipping. The susceptor includes pockets (2) in which wafers (10) are to be placed, wherein at least one of the pockets (2) includes a plurality of supporting portions (3) for supporting the wafer (10), a plurality of contact portions (4) to make contact with a lateral surface (10a) of the wafer (10), and a plurality of non-contact portions (5) spaced from the lateral surface (10a) of the wafer (10). The contact portions (4) and the non-contact portions (5) are alternately provided in the inner peripheral wall of the pocket (2), and at least two of the supporting portions (3) are provided on lines extending from a center (O) of the pocket (2) to the non-contact portions (5) when the susceptor is viewed from above.

公开(公告)号：US20210246033A1

公开(公告)日：2021-08-12

申请号：US17255768

申请日：2019-07-01

Applicant: TOYO TANSO CO., LTD.

Inventor： Mizuho ANZAI ,  Takahiro MORISHITA ,  Yoshio SHODAI

IPC: C01B32/318 ,  C01B32/354 ,  B01J20/20 ,  B01J35/10 ,  H01M4/583

Abstract: A method of producing a porous carbon is provided that can change type of functional groups, amount of functional groups, or ratio of functional groups while inhibiting its pore structure from changing. A method of producing a porous carbon includes: a first step of carbonizing a material containing a carbon source and a template source, to prepare a carbonized product; and a second step of immersing the carbonized product into a template removing solution, to remove a template from the carbonized product, and the method is characterized by changing at least two or more of the following conditions: type of the material, ratio of the carbon source and the template source, size of the template, and type of the template removal solution, to thereby control type, amount, or ratio of functional groups that are present in the porous carbon.

公开(公告)号：US20210171373A1

公开(公告)日：2021-06-10

申请号：US16772050

申请日：2018-12-13

Applicant: TOYO TANSO CO., LTD.

Inventor： Masashi ZENKI ,  Tetsuro TOJO ,  Masatoshi TAKESHITA ,  Tomoya NAKAZONO ,  Ai ISHIKAWA

IPC: C02F3/10 ,  C12N11/02 ,  C12N1/20

Abstract: [Problem] A microorganism immobilized carrier is provided that is easy for microorganisms to adhere to, and is able to reduce the manufacturing cost of the microorganism immobilized carrier and the running cost of an apparatus that uses the microorganism immobilized carrier.
[Solution] A microorganism immobilized carrier is characterized by including a carbon component and a resin, having a zeta potential of from −25 mV to 0 mV, and containing microorganisms adhered to a surface thereof and/or an interior thereof. The microorganisms are preferably nitrifying bacteria. The carbon component preferably has a particle size of from 1 μm to 1000 μm.

公开(公告)号：US10718569B2

公开(公告)日：2020-07-21

申请号：US14896027

申请日：2014-06-04

Applicant: TOYO TANSO CO., LTD.

Inventor： Syuhei Tomita ,  Hiroshi Machino ,  Toshiharu Hiraoka ,  Shingo Bito

IPC: F27D5/00 ,  D03D15/12 ,  F27D3/02 ,  D03D1/00 ,  D03D13/00 ,  D03D19/00 ,  C21D9/00 ,  F27D3/12 ,  F27D3/00

Abstract: The present invention improves the strength of the bottom (net) of the jig and makes it more difficult and unlikely for deviation of the mesh to occur.A workpiece is loaded on the net (2) of the heat treat furnace jig (hereinafter, heat treatment furnace jig). In the net (2), a first strand (10), a second strand (20) and a third strand (30) are in contact at a contact point (X1). Near the contact point (X1), the second strand (20) overlaps the first strand (10) from above and the third strand (30) overlaps the first strand (10) from below. As a result, the first strand (10) is held between the second strand (20) and the third strand (30) in the up/down directions.

公开(公告)号：US10522386B2

公开(公告)日：2019-12-31

申请号：US15321421

申请日：2015-06-01

Applicant: TOYO TANSO CO., LTD.

Inventor： Masato Shinohara ,  Yoshihisa Abe ,  Satoru Nogami

IPC: B23Q3/00 ,  H01L21/687 ,  C23C16/04 ,  C23C16/458 ,  C23C16/56 ,  H01L21/205 ,  C23C8/20 ,  C23C16/06 ,  C23C16/32 ,  C30B25/12

Abstract: Provided are a susceptor that, in forming a thin film on a wafer, can reduce impurities or the like adhering to the wafer and a method for manufacturing the same. A susceptor includes a base material (10) with a recess (11), a tantalum carbide layer (22) formed directly on a bottom surface (11a) and a side surface (11b) of the recess (11), and a silicon carbide layer (20) formed on a surface of the base material (10) except for the recess (11).

公开(公告)号：US10357838B2

公开(公告)日：2019-07-23

申请号：US15304101

申请日：2015-04-01

Applicant: TOYO TANSO CO., LTD.

Inventor： Masao Kanda ,  Naoto Ohta ,  Kiyoshi Saito ,  Masaki Okada ,  Motoki Onishi ,  Takeyuki Namiki

IPC: B23H1/06 ,  C04B41/88 ,  C04B41/00 ,  C04B41/51 ,  B23H9/00 ,  C04B41/53 ,  C04B35/52 ,  C04B111/00 ,  C04B111/94

Abstract: An object is to provide a graphite-copper composite electrode material that is capable of reducing electrode wear to a practically usable level and to provide an electrical discharge machining electrode using the material. A graphite-copper composite electrode material includes a substrate comprising a graphite material and having pores, and copper impregnated in the pores of the substrate, the electrode material having an electrical resistivity of 2.5 μΩm or less, preferably 1.5 μΩm or less, more preferably 1.0 μΩm or less. It is desirable that the substrate comprising the graphite material have an anisotropy ratio of 1.2 or less. It is desirable that an impregnation rate φ of the copper in the electrode material is 13% or greater. It is desirable that the substrate comprising the graphite material have a bulk density of from 1.40 Mg/m3 to 1.85 Mg/m3.