公开(公告)号：US20110211191A1

公开(公告)日：2011-09-01

申请号：US13107637

申请日：2011-05-13

Applicant: Yuta Urano ,  Toshiyuki Nakao ,  Yoshimasa Oshima

Inventor： Yuta Urano ,  Toshiyuki Nakao ,  Yoshimasa Oshima

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/9503

Abstract: A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.

Abstract translation: 缺陷检查装置能够以高灵敏度和高速检查诸如半导体衬底或薄膜衬底的样品的顶部和边缘表面上存在的极小缺陷。 缺陷检查装置具有照明光学系统，多个检测光学单元和信号处理器。 一个或多个检测光学单元接收从样品的边缘部分衍射的光或从夹持样品的边缘把手衍射的光。 一个或多个检测光学单元基于通过监视由检测光学单元接收的衍射光的强度而获得的信号来屏蔽由检测光学单元接收的衍射光，以便检查位于边缘部分附近的样本部分 以及位于边缘把手附近的样品部分。

公开(公告)号：US07973920B2

公开(公告)日：2011-07-05

申请号：US12950243

申请日：2010-11-19

Applicant: Hiroyuki Nakano ,  Akira Hamamatsu ,  Sachio Uto ,  Yoshimasa Oshima ,  Hidetoshi Nishiyama ,  Yuta Urano ,  Shunji Maeda

Inventor： Hiroyuki Nakano ,  Akira Hamamatsu ,  Sachio Uto ,  Yoshimasa Oshima ,  Hidetoshi Nishiyama ,  Yuta Urano ,  Shunji Maeda

IPC: G01N21/88

CPC classification number: G01N21/94 ,  G01N21/9501 ,  G01N21/95607 ,  G01N21/95623 ,  G01N2021/9513 ,  G01N2021/95638 ,  H01L22/12

Abstract: A defect inspection apparatus includes a movable stage for mounting a substrate having circuit patterns as an object of inspection, an irradiation optical system which irradiates a slit-shaped light beam from an oblique direction to the circuit patterns of the substrate, a detection optical system which includes an image sensor for receiving reflected/scattered light from the substrate by irradiation of the slit-shaped light beam and converting the received light into a signal, and an image processor which processes the signal. The irradiation optical system includes a cylindrical lens and a coherency reduction optical system, which receives the light beam and emits a plurality of slit-shaped light sub-beams which are spatially reduced in coherency in a light-converging direction of the cylindrical lens. The cylindrical lens focuses the plurality of slit-shaped light sub-beams into the slit-shaped light beam irradiated to the surface of the substrate.

Abstract translation: 缺陷检查装置包括：可移动台，用于安装具有作为检查对象的电路图案的基板;照射光学系统，其将来自倾斜方向的狭缝状光束照射到基板的电路图案;检测光学系统， 包括图像传感器，用于通过照射狭缝状光束并将接收到的光转换成信号来从基板接收反射/散射光，以及处理该信号的图像处理器。 照射光学系统包括柱面透镜和相干性降低光学系统，其接收光束并发射在柱面透镜的聚光方向上空间相减的多个狭缝状光子束。 柱面透镜将多个狭缝状光子束聚焦成照射到基板表面的狭缝状光束。

公开(公告)号：US07916288B2

公开(公告)日：2011-03-29

申请号：US12713500

申请日：2010-02-26

Applicant: Toshiyuki Nakao ,  Yoshimasa Oshima ,  Yuta Urano

Inventor： Toshiyuki Nakao ,  Yoshimasa Oshima ,  Yuta Urano

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N2021/887

Abstract: A method for inspecting a defect of a surface of a sample, includes irradiating a laser beam on the sample surface a plurality of times so that at least part of an illumination field of the laser beam on the sample surface illuminates a first area of the sample surface each of the plurality of times, detecting a plurality of scattered light rays from the first area caused by the plurality of times of irradiation, correcting errors of detection timings for the plurality of scattered light rays detected in the detection step, and determining a defect on the sample surface based on the plurality of scattered light rays in accordance with the correcting errors of detection timings.

Abstract translation: 用于检查样品表面的缺陷的方法包括将多个激光束照射在样品表面上多次，使得样品表面上的激光束的照明场的至少一部分照射样品的第一区域 在多次照射中检测来自第一区域的多个散射光，校正检测步骤中检测到的多个散射光的检测定时的误差，并且确定缺陷 根据检测定时的校正误差，基于多个散射光线在样品表面上。

公开(公告)号：US07768635B2

公开(公告)日：2010-08-03

申请号：US12328357

申请日：2008-12-04

Applicant: Hiroyuki Nakano ,  Akira Hamamatsu ,  Sachio Uto ,  Yoshimasa Oshima ,  Hidetoshi Nishiyama ,  Yuta Urano ,  Shunji Maeda

Inventor： Hiroyuki Nakano ,  Akira Hamamatsu ,  Sachio Uto ,  Yoshimasa Oshima ,  Hidetoshi Nishiyama ,  Yuta Urano ,  Shunji Maeda

IPC: G01N21/00

CPC classification number: G01N21/94 ,  G01N21/9501 ,  G01N21/95607 ,  G01N21/95623 ,  G01N2021/9513 ,  G01N2021/95638 ,  H01L22/12

Abstract: A defect inspection apparatus includes a movable stage for mounting a substrate having circuit patterns as an object of inspection, an irradiation optical system which irradiates a slit-shaped light beam from an oblique direction to the circuit patterns of the substrate, a detection optical system which includes an image sensor for receiving reflected/scattered light from the substrate by irradiation of the slit-shaped light beam and converting the received light into a signal, and an image processor which processes the signal. The irradiation optical system includes a cylindrical lens and a coherency reduction optical system, which receives the light beam and emits a plurality of slit-shaped light sub-beams which are spatially reduced in coherency in a light-converging direction of the cylindrical lens. The cylindrical lens focuses the plurality of slit-shaped light sub-beams into the slit-shaped light beam irradiated to the surface of the substrate.

Abstract translation: 缺陷检查装置包括：可移动台，用于安装具有作为检查对象的电路图案的基板;照射光学系统，其将来自倾斜方向的狭缝状光束照射到基板的电路图案;检测光学系统， 包括图像传感器，用于通过照射狭缝状光束并将接收到的光转换成信号来从基板接收反射/散射光，以及处理该信号的图像处理器。 照射光学系统包括柱面透镜和相干性降低光学系统，其接收光束并发射在柱面透镜的聚光方向上空间相减的多个狭缝状光子束。 柱面透镜将多个狭缝状光子束聚焦成照射到基板表面的狭缝状光束。

公开(公告)号：US20090257058A1

公开(公告)日：2009-10-15

申请号：US12414727

申请日：2009-03-31

Applicant: Yuta URANO ,  Toshiyuki Nakao ,  Yoshimasa Oshima

Inventor： Yuta URANO ,  Toshiyuki Nakao ,  Yoshimasa Oshima

IPC: G01J4/00 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/9503

Abstract: A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.

Abstract translation: 缺陷检查装置能够以高灵敏度和高速检查诸如半导体衬底或薄膜衬底的样品的顶部和边缘表面上存在的极小缺陷。 缺陷检查装置具有照明光学系统，多个检测光学单元和信号处理器。 一个或多个检测光学单元接收从样品的边缘部分衍射的光或从夹持样品的边缘把手衍射的光。 一个或多个检测光学单元基于通过监视由检测光学单元接收的衍射光的强度而获得的信号来屏蔽由检测光学单元接收的衍射光，以便检查位于边缘部分附近的样本部分 以及位于边缘把手附近的样品部分。

公开(公告)号：US20080151235A1

公开(公告)日：2008-06-26

申请号：US11940483

申请日：2007-11-15

Applicant: Yoshimasa Oshima ,  Toshiyuki Nakao

Inventor： Yoshimasa Oshima ,  Toshiyuki Nakao

IPC: G01N21/88

CPC classification number: G01N21/9501 ,  G01N2021/8864

Abstract: In a defect inspection for a semiconductor substrate, inspection objects include, in addition to a bear Si wafer, a wafer with various films formed on the surface thereof. For a sample formed with a metal film in particular, scattering light generated by surface roughness thereof is large, thus making it difficult to detect a minute defect and a minute foreign substance. It is desirable that a minute defect and a minute foreign substance be detected regardless of scattering light generated by the roughness of the sample surface. Insertion of an analyzer in an optical path of a detection optical system at such an angle that the scattering light generated by the roughness becomes minimum permits suppressing the scattering light generated by the roughness.

Abstract translation: 在半导体基板的缺陷检查中，除了承载硅晶片之外，检查对象还包括在其表面上形成有各种膜的晶片。 对于特别是金属膜形成的样品，由于其表面粗糙度而产生的散射光大，因此难以检测到微小的缺陷和微小的异物。 不管由样品表面的粗糙度产生的散射光如何，都希望检测到微小的缺陷和微小的异物。 以使得由粗糙度产生的散射光变得最小的角度插入检测光学系统的光路中的分析器，可以抑制由粗糙度产生的散射光。

公开(公告)号：US20070285670A1

公开(公告)日：2007-12-13

申请号：US11757458

申请日：2007-06-04

Applicant: Minoru Yoshida ,  Yoshimasa Oshima

Inventor： Minoru Yoshida ,  Yoshimasa Oshima

IPC: G01B9/02

CPC classification number: G01B9/02067 ,  G01B9/02002 ,  G01B11/2441 ,  G01B2290/70 ,  G01N21/45 ,  G01N21/95 ,  G01N21/9501 ,  G01N2021/95676

Abstract: A surface inspection apparatus is provided based on an optical interference scheme using a wide-band laser light source, such as diode laser, for an interferometer. In the apparatus, a diode laser with a large spectrum width having a short coherence length is used as an emitted light source; modulation optical elements for performing modulation with slightly different frequencies, and optical path length varying optical elements for adjusting the optical path length are located in each of two optical paths between a branching optical element and a combining optical element; and the above-mentioned optical path length varying optical elements are adjusted, while measuring an interference intensity, so as to maximize the interference intensity.

Abstract translation: 基于使用诸如二极管激光器的宽带激光光源作为干涉仪的光学干涉方案来提供表面检查装置。 在该装置中，使用具有短相干长度的具有大光谱宽度的二极管激光器作为发射光源; 用于执行具有稍微不同频率的调制的调制光学元件和用于调整光程长度的光路长度变化光学元件位于分支光学元件和组合光学元件之间的两个光路中的每一个中; 并且在测量干涉强度的同时调节上述光程长度变化光学元件，以使干涉强度最大化。

公开(公告)号：US4508453A

公开(公告)日：1985-04-02

申请号：US397900

申请日：1982-07-13

Applicant: Yasuhiko Hara ,  Nobuyuki Akiyama ,  Satoru Fushimi ,  Yoshimasa Oshima ,  Nobuhiko Aoki

Inventor： Yasuhiko Hara ,  Nobuyuki Akiyama ,  Satoru Fushimi ,  Yoshimasa Oshima ,  Nobuhiko Aoki

IPC: G01N21/956 ,  G01R31/308 ,  G03F7/20 ,  G01M11/00

CPC classification number: G03F7/70616 ,  G01N21/956 ,  G01R31/308 ,  G03F7/7065

Abstract: A pattern detection system for inspecting defects in fine or minute patterns such as photomask patterns at a fast speed is disclosed. The system comprises an illuminator, a device for moving objects with the patterns to be inspected with being illuminated by the illuminator, an optical system for imaging the objects, a scanner for scanning the objects in a direction intersected at a given angle with respect to direction of the objects moved by the moving device and arrays of photosensors arranged linearly in a direction perpendicular to that of images on the objects scanned by the scanner, on the surface of which the images are formed by the optical system and for producing respective outputs parallelly on the time basis.

Abstract translation: 公开了一种用于以高速度检查诸如光掩模图案的精细或微小图案中的缺陷的图案检测系统。 该系统包括照明器，用于利用照明器照亮要检查的图案来移动物体的装置，用于对物体进行成像的光学系统，用于沿相对于方向以给定角度相交的方向扫描物体的扫描仪 由移动装置移动的物体和由扫描仪扫描的物体上垂直于图像的方向线性布置的光敏器件的阵列，其表面上由光学系统形成图像并且平行地产生相应的输出 时间基础。

公开(公告)号：US4362389A

公开(公告)日：1982-12-07

申请号：US122484

申请日：1980-02-19

Applicant: Mituyoshi Koizumi ,  Nobuyuki Akiyama ,  Yoshimasa Oshima

Inventor： Mituyoshi Koizumi ,  Nobuyuki Akiyama ,  Yoshimasa Oshima

IPC: G03F9/00 ,  G01B11/27 ,  H05K13/00

CPC classification number: G03F9/70

Abstract: A mask alignment method of the projection type is disclosed which is based upon a fact that the exit pupil of a projection lens is actually positioned at a finite distance, and wherein a first wafer alignment pattern including a line segment and a second wafer alignment pattern including another line segment are formed on a wafer in those radial directions from the optical axis of a projection lens which intersect with each other approximately at a right angle. A first mask alignment pattern including a line segment and a second mask alignment pattern including another line segment are formed respectively at those positions on a mask which optically correspond to respective positions of the first and second wafer alignment patterns through the projection lens. The optical image of the first wafer alignment pattern superposed on the optical image of the first mask alignment pattern by the action of the projection lens falls on an image pickup device or element, the optical image of the second wafer alignment pattern superposed on the optical image of the second mask alignment pattern by the action of the projection lens falls on another image pickup device or element, the relative displacement between the wafer and the mask is determined by the video signals delivered from the image pickup devices or elements, and the wafer and the mask are aligned with each other so as to reduce the relative displacement to zero.

Abstract translation: 公开了一种突起型掩模对准方法，其基于投影透镜的出射光瞳实际上位于有限距离的事实，并且其中包括线段和第二晶片对准图案的第一晶片对准图案包括 在距离投影透镜的光轴大致直角相交的那些径向方向的晶片上形成另一线段。 分别在掩模上的这些位置分别形成包括线段和包括另一线段的第二掩模对准图案的第一掩模对准图案，光掩模对应于通过投影透镜的第一和第二晶片对准图案的各个位置。 通过投影透镜的作用叠加在第一掩模对准图案的光学图像上的第一晶片对准图案的光学图像落在图像拾取器件或元件上，第二晶片对准图案的光学图像叠加在光学图像上 通过投影透镜的作用使第二掩模对准图案落在另一图像拾取装置或元件上，晶片和掩模之间的相对位移由从图像拾取装置或元件传送的视频信号确定，并且晶片和 掩模彼此对准，以便将相对位移减小到零。

公开(公告)号：US08705026B2

公开(公告)日：2014-04-22

申请号：US13597553

申请日：2012-08-29

Applicant: Yoshimasa Oshima ,  Yuta Urano ,  Toshiyuki Nakao

Inventor： Yoshimasa Oshima ,  Yuta Urano ,  Toshiyuki Nakao

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/21 ,  G01N21/47 ,  G01N21/94 ,  G01N2021/4707 ,  G01N2021/4709 ,  G01N2021/8864

Abstract: An inspection method and apparatus for detecting defects or haze of a sample, includes illuminating light to the sample from an oblique direction relative to a surface of the sample with an illuminator, detecting first scattered light at a forward position relative to an illuminating direction from the sample with a first detector, detecting sec and scattered light at a sideward or backward position relative to the illuminating direction from the sample with a second detection, and processing a first signal of the first scattered light and a second signal of the second scattered light with different weighting for the first signal and for the second signal with a processor.

Abstract translation: 一种用于检测样品的缺陷或雾度的检查方法和装置，包括使用照明器从相对于样品表面的倾斜方向向样品照射光，从相对于照射方向的前方位置检测第一散射光， 采用第一检测器，利用第二检测从样品检测相对于照明方向的向后或向后位置处的秒和散射光，并且处理第一散射光的第一信号和第二散射光的第二信号， 对于第一信号和与处理器的第二信号的加权不同。