公开(公告)号：US20140084326A1

公开(公告)日：2014-03-27

申请号：US13948197

申请日：2013-07-23

申请人： ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

发明人： LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode includes a ceramic substrate, an electrode group setting on the substrate and co-fired with the ceramic substrate, an LED chip setting on the substrate and electrically connecting the electrode group. The electrode includes a first electrode and a second electrode spacing from the first electrode. The first electrode and the second electrode extend from a top surface of the substrate to a bottom surface of the substrate via side surfaces of the substrate. The light-emitting diode can be connected to a power source by the electrode group on the bottom surface of the substrate or by the electrode group on the side surfaces of the substrate.

摘要翻译： 发光二极管包括陶瓷基板，设置在基板上并与陶瓷基板共烧的电极组，设置在基板上并将电极组电连接的LED芯片。 电极包括第一电极和与第一电极间隔的第二电极。 第一电极和第二电极通过衬底的侧表面从衬底的顶表面延伸到衬底的底表面。 发光二极管可以通过基板的底表面上的电极组或基板的侧表面上的电极组连接到电源。

公开(公告)号：US20140061698A1

公开(公告)日：2014-03-06

申请号：US13927777

申请日：2013-06-26

申请人： ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

发明人： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC分类号： H01L33/60 ,  H01L33/54

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided.

摘要翻译： LED封装包括第一电极，与第一电极相邻的第二电极，围绕并封装第一和第二电极的成型体以及安装在第二电极上的LED管芯。 成型体包括位于第一和第二电极之上的反射杯，反射杯限定顶面中的接收腔以接收LED管芯。 第一延伸电极从第一电极向侧面突出，第二延伸电极从第二电极向侧面突出。 第一和第二延伸电极从成形体的外周露出。 还提供了用于制造LED封装的方法。

公开(公告)号：US20140061697A1

公开(公告)日：2014-03-06

申请号：US13912211

申请日：2013-06-07

申请人： Advanced Optoelectronic Technology, Inc.

发明人： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC分类号： H01L33/60 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00

摘要： An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided.

摘要翻译： LED封装包括相邻的第一和第二电极，从第一和第二电极向侧面突出的第一和第二延伸电极，围绕第一和第二电极的模制体和LED管芯。 成型体形成位于第一和第二电极上方的反射杯，每个反射杯在其顶面限定一个接收腔，以容纳LED管芯。 第一和第二延伸电极从成形体的外周露出。 第一电极具有第一底面。 第二电极具有第二底面。 第一和第二电极的第一和第二底面从成形体的底面露出。 还提供了用于制造LED封装的方法。