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公开(公告)号：US20200326594A1
公开(公告)日：2020-10-15
申请号：US16680784
申请日：2019-11-12
发明人： CHAO-HSIUNG CHANG , LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN , HSIN-CHIANG LIN , HOU-TE LIN
IPC分类号： G02F1/1335
摘要： A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.
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公开(公告)号：US20150162498A1
公开(公告)日：2015-06-11
申请号：US14524387
申请日：2014-10-27
CPC分类号： H01L33/62 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0066 , H01L2924/00014
摘要： A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.
摘要翻译： 发光二极管封装（LED）包括彼此间隔开的两个电极，夹在两个电极之间的绝缘层，布置在两个电极上并与之电连接的LED管芯以及覆盖LED管芯的封装层。 每个电极包括导电片和连接到导电片的多个连接销。 连接销的厚度小于导电片的厚度。 连接销的顶表面与导电片的顶表面共面。 LED封装还包括涂覆连接销的涂层，涂层销的一部分夹在连接销的顶表面和封装层之间。
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公开(公告)号：US20140145216A1
公开(公告)日：2014-05-29
申请号：US13859739
申请日：2013-04-10
发明人： LUNG-HSIN CHEN , PIN-CHUAN CHEN , WEN-LIANG TSENG
CPC分类号： H01L33/62 , H01L24/06 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/05553 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2924/12035 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： An LED includes a base, a first chip and a second chip mounted on the base, a wire support formed on the base, and wires electrically connecting the first chip and the second chip with the base. The base includes a first lead, a second lead and an insulative band connecting the first lead and the second lead. A first wire connects an electrode of the first chip to the wire support, and a second wire connects an electrode of the second chip to the wire support. The first wire and the second wire are electrically connected to each other via a conductive layer formed on the wire support. The wire support in one embodiment is a Zener diode.
摘要翻译： LED包括基座，安装在基座上的第一芯片和第二芯片，形成在基座上的线支架，以及将第一芯片和第二芯片与基座电连接的电线。 基座包括第一引线，第二引线和连接第一引线和第二引线的绝缘带。 第一线将第一芯片的电极连接到线支撑件，并且第二线将第二芯片的电极连接到线支撑件。 第一线和第二线通过形成在线支撑上的导电层彼此电连接。 一个实施例中的线支撑件是齐纳二极管。
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公开(公告)号：US20140084315A1
公开(公告)日：2014-03-27
申请号：US13955276
申请日：2013-07-31
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
摘要： An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.
摘要翻译： 示例性的发光二极管（LED）封装包括电绝缘基板，嵌入绝缘基板中的电极结构以及分别与电极结构的电极电连接的多个LED芯片。 电极结构包括位于第一和第二电极之间的第一电极，第二电极和第三电极。 第一，第二和第三电极的顶表面露出绝缘衬底的顶表面以支撑LED芯片。 第一和第二电极的底表面露出基板的底表面以与印刷电路板的焊盘连接。 第三电极的底面容纳在基板中。
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公开(公告)号：US20140084312A1
公开(公告)日：2014-03-27
申请号：US13965185
申请日：2013-08-12
IPC分类号： H01L27/15
CPC分类号： H01L27/15 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.
摘要翻译： 发光二极管（LED）封装包括衬底，嵌入衬底中的电极结构以及与电极结构电连接的多个LED芯片。 基板包括从主要部分的底表面延伸的主要部分和突出部分。 主要部分位于突出部分的上方。 电极结构包括彼此间隔开的第一，第二和第三电极。 第三电极位于第一和第二电极之间。 第一，第二和第三电极的顶表面暴露在主要部分的顶表面之外。 第一和第二电极的底表面暴露在主体部分的底表面之外。 第三电极的底表面被突出部分覆盖。 本公开还涉及一种用于制造LED封装的方法。
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公开(公告)号：US20140051193A1
公开(公告)日：2014-02-20
申请号：US13973941
申请日：2013-08-22
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
IPC分类号： H01L33/58
CPC分类号： H01L33/58 , H01L33/54 , H01L2933/005 , H01L2933/0083
摘要： A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.
摘要翻译： 一种发光元件封装的制造方法，所述方法包括：提供高精度晶片级模具模块，所述高精度晶片级模具模块包括上模具和底模具; 在上模和底模之间安装具有多个发光元件的基板; 将包装材料填充到高精度晶片级模具模块中，以获得安装在发光元件上的封装构件; 并移除高精度晶圆级模具模块。
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公开(公告)号：US20170162477A1
公开(公告)日：2017-06-08
申请号：US15434173
申请日：2017-02-16
发明人： YAU-TZU JANG , YU-LIANG HUANG , WEN-LIANG TSENG , PIN-CHUAN CHEN , LUNG-HSIN CHEN , HSING-FEN LO , CHAO-HSIUNG CHANG , CHE-HSANG HUANG , YU-LUN HSIEH
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L29/866 , H01L33/502 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137
摘要： A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.
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公开(公告)号：US20160356451A1
公开(公告)日：2016-12-08
申请号：US15096277
申请日：2016-04-12
发明人： HSIN-CHIANG LIN , LUNG-HSIN CHEN , WEN-LIANG TSENG
CPC分类号： F21V5/04 , F21Y2115/10 , G02B19/0014 , G02B19/0061
摘要： A light emitting device includes a light source and a lens. The lens includes a light emitting surface, a top surface, four edge surfaces, and a bottom surface. The light emitting surface includes a central recess and two convex regions connecting the central recess at opposite sides. The light emitting surface is symmetrical about the central recess. The lens further defines a receiving space in the bottom surface and four positioning pins on the bottom surface. The receiving space includes a light incident surface. The two convex regions of the light emitting surface and the light incident surface are non-spherical surfaces. A maximum distance, dn, between the light source and the light incident surface is larger than a maximum distance, Dm, between the light incident surface and the light emitting surface. The light emitting device provides a wide-angle light distribution.
摘要翻译： 发光器件包括光源和透镜。 透镜包括发光表面，顶表面，四个边缘表面和底表面。 发光表面包括中心凹部和连接相对侧的中心凹部的两个凸起区域。 发光表面关于中心凹槽对称。 透镜进一步限定底面中的接收空间和底面上的四个定位销。 接收空间包括光入射表面。 发光面和光入射面的两个凸区域是非球面。 光源与光入射面之间的最大距离dn大于光入射面与发光面之间的最大距离Dm。 发光装置提供广角光分布。
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公开(公告)号：US20160111400A1
公开(公告)日：2016-04-21
申请号：US14832725
申请日：2015-08-21
IPC分类号： H01L25/075 , H01L33/38 , H01L33/50 , H01L33/62 , H01L33/54
CPC分类号： H01L25/0753 , H01L24/96 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2924/0002
摘要： A flip chip light emitting diode includes a plurality of light emitting diodes and an encapsulation covering the plurality of light emitting diodes. Each of light emitting diode has a P electrode and an N electrode which are exposed out of the encapsulation.
摘要翻译： 倒装芯片发光二极管包括多个发光二极管和覆盖多个发光二极管的封装。 发光二极管中的每一个具有从封装露出的P电极和N电极。
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公开(公告)号：US20140167078A1
公开(公告)日：2014-06-19
申请号：US14059463
申请日：2013-10-22
发明人： YAU-TZU JANG , YU-LIANG HUANG , WEN-LIANG TSENG , PIN-CHUAN CHEN , LUNG-HSIN CHEN , HSING-FEN LO , CHAO-HSIUNG CHANG , CHE-HSANG HUANG , YU-LUN HSIEH
IPC分类号： H01L33/62
CPC分类号： H01L33/647 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L29/866 , H01L33/502 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137
摘要： An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.
摘要翻译： 示例性引线框架包括衬底和接合电极，第一连接电极和嵌入在衬底中的第二连接电极。 接合电极的顶表面包括与第一接合表面间隔开的第一接合表面和第二接合表面。 第一连接电极的顶表面包括与第一连接表面间隔开的第一连接表面和第二连接表面。 接合电极的顶表面，第一连接电极和第二连接电极从基板露出，以支撑并与发光芯片电连接。 发光芯片可以安装在引线框架上并联或串联电连接; 因此，发光芯片可以通过各种方式连接。
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