Periphery Body Biasing for Memory Applications

    公开(公告)号:US20190304962A1

    公开(公告)日:2019-10-03

    申请号:US15942132

    申请日:2018-03-30

    Applicant: Arm Limited

    Abstract: Various implementations described herein are directed to an integrated circuit having a core array region with an array of memory devices. The integrated circuit may include a periphery region having periphery logic devices that interface with the array of memory devices. The integrated circuit may include a boundary region having one or more buffer devices coupled to body terminals of the periphery logic devices to drive the body terminals of the periphery logic devices using a body biasing signal provided by the one or more buffer devices.

    Redundancy schemes for memory cell repair

    公开(公告)号:US09911510B1

    公开(公告)日:2018-03-06

    申请号:US15288832

    申请日:2016-10-07

    Applicant: ARM Limited

    CPC classification number: G11C29/76 G11C8/04 G11C11/413 G11C11/418

    Abstract: Various implementations described herein are directed to an integrated circuit having a memory cell array with multiple rows of memory cells including at least one redundant row of memory cells. The memory cell array may be partitioned into multiple regions of memory cells including a first region of memory cells corresponding to a first part of the redundant row of memory cells and a second region of memory cells corresponding to a second part of the redundant row of memory cells. The integrated circuit may include wordline driver circuitry coupled to the first and second regions of memory cells and their corresponding first and second parts of the redundant row of memory cells. In some instances, the integrated circuit may include row shift circuitry coupled to the first and second regions of memory cells and their corresponding first and second parts of the redundant row of memory cells.

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