公开(公告)号：US10566181B1

公开(公告)日：2020-02-18

申请号：US16053740

申请日：2018-08-02

Applicant: ASM IP Holding B.V.

Inventor： Yukihiro Mori

IPC: H01J37/32 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B7/00 ,  C23C16/50 ,  C23C16/458 ,  H01L21/311 ,  G02F1/13

Abstract: Examples of a substrate processing apparatus include a stage, a driving unit for rotating the stage, an electrode facing only a part of an outer edge of the stage, a high-frequency power supply unit for supplying high-frequency power to the electrode, and a gas supply device for supplying gas to a gap between the electrode and the stage.

公开(公告)号：US20200043719A1

公开(公告)日：2020-02-06

申请号：US16053740

申请日：2018-08-02

Applicant: ASM IP Holding B.V.

Inventor： Yukihiro Mori

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  H01J37/32 ,  B08B7/00 ,  C23C16/50 ,  C23C16/458 ,  H01L21/311

Abstract: Examples of a substrate processing apparatus include a stage, a driving unit for rotating the stage, an electrode facing only a part of an outer edge of the stage, a high-frequency power supply unit for supplying high-frequency power to the electrode, and a gas supply device for supplying gas to a gap between the electrode and the stage.

公开(公告)号：US20150332949A1

公开(公告)日：2015-11-19

申请号：US14281477

申请日：2014-05-19

Applicant: ASM IP Holding B.V.

Inventor： Yukihiro Mori

IPC: H01L21/677 ,  C23C16/50 ,  C23C16/458 ,  B25J11/00 ,  C23C16/04 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67742 ,  B25J11/0095 ,  C23C16/04 ,  C23C16/345 ,  C23C16/4401 ,  C23C16/4585 ,  C23C16/50 ,  C23C16/505 ,  H01J37/32091 ,  H01J37/32385 ,  H01J37/32532 ,  H01J37/32541 ,  H01L21/67011 ,  H01L21/68707 ,  H01L23/3171 ,  H01L23/3185 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for transporting a substrate using an end effector which mechanically clamps a periphery of the substrate includes: before transporting the substrate, depositing a compressive film only on, at, or in a bevel portion of the substrate; and transporting the substrate whose bevel portion is covered by the compressive film as the outermost film, using an end effector while mechanically clamping the periphery of the substrate.

Abstract translation: 使用机械夹持基板的周边的端部执行器来输送基板的方法包括：在传送基板之前，仅在基板的斜面部分上沉积压缩膜; 并且使用末端执行器将其斜面部分被压缩膜覆盖的基板作为最外面的膜传送，同时机械地夹持基板的周边。