公开(公告)号：US20060051948A1

公开(公告)日：2006-03-09

申请号：US11177771

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01L21/44

CPC classification number: G01R1/0483 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T156/10 ,  H01L2924/00

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

公开(公告)号：US20050221644A1

公开(公告)日：2005-10-06

申请号：US11029217

申请日：2005-01-03

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

IPC: G01R31/02 ,  H01R12/00 ,  H01R13/187 ,  H01R24/58

CPC classification number: G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 可能会发生探针针尖图案化以各种不同的方式，包括，例如，通过在图案化的孔成型已各向同性或各向异性蚀刻的硅，通过模制在形成于上曝光的光刻胶的空隙，通过成型在空隙中的牺牲材料，其 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US20050016465A1

公开(公告)日：2005-01-27

申请号：US10626156

申请日：2003-07-23

Applicant: Kartik Ramaswamy ,  Jon McChesney ,  Ananda Kumar ,  Hamid Noorbakhsh

Inventor： Kartik Ramaswamy ,  Jon McChesney ,  Ananda Kumar ,  Hamid Noorbakhsh

IPC: H01L21/68 ,  H01L21/683 ,  H02N13/00 ,  C23C16/00

CPC classification number: H01L21/6833 ,  H02N13/00

Abstract: An electrostatic chuck provides reduced electric field effects about its peripheral edge. In one version, the chuck comprises a dielectric covering an electrode having a perimeter and a wire loop extending about the perimeter, the wire loop having a radially outwardly facing surface that is substantially rounded. Alternatively, the electrode may have a central planar portion comprising a top surface and a bottom surface, and a peripheral arcuate portion having a tip with a curvature length of at least about π/8 radians between a normal to the top surface of the central planar portion and a normal to the upper surface of the tip. The electrostatic chuck is used to hold a substrate in a process chamber of a substrate processing apparatus.

Abstract translation: 静电吸盘可以减少围绕其外围边缘的电场效应。 在一个版本中，卡盘包括覆盖具有周边的电极的电介质和围绕周边延伸的导线环，所述导线环具有基本上圆形的径向向外的表面。 或者，电极可以具有包括顶表面和底表面的中心平面部分，以及周边弓形部分，其具有尖端，该尖端具有在中心平面的顶表面之间的法线之间的至少约π/ 8弧度的曲率长度 并且与尖端的上表面垂直。 静电卡盘用于将基板保持在基板处理装置的处理室中。