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公开(公告)号:US5622998A
公开(公告)日:1997-04-22
申请号:US527322
申请日:1995-09-12
申请人: Yasuyuki Tanaka , Toshiaki Sakaki , Atsuko Kawasaki , Masaharu Hayashi , Eiji Kanamaru , Kazuhiko Shibata
发明人: Yasuyuki Tanaka , Toshiaki Sakaki , Atsuko Kawasaki , Masaharu Hayashi , Eiji Kanamaru , Kazuhiko Shibata
CPC分类号: C08C19/08
摘要: A depolymerized natural rubber having a number-average molecular weight of from 2,000 to 50,000 obtained by the depolymerization of a deproteinized natural rubber. A process for the preparation of a depolymerized natural rubber comprises dissolving a deproteinized natural rubber into an organic solvent so as to give a concentration of from 1 to 30% by weight and then carrying out air oxidation of the resulting solution in the presence of a metallic catalyst. The depolymerized natural rubber can provide the same physical properties as ordinary vulcanized rubbers, exhibits no odor or color characteristic to natural rubbers and causes no immediate allergy induced by protein.
摘要翻译: 通过脱蛋白天然橡胶的解聚得到的数均分子量为2000〜50,000的解聚天然橡胶。 制备解聚天然橡胶的方法包括将脱蛋白天然橡胶溶解在有机溶剂中,使其浓度为1〜30重量%,然后在金属的存在下进行所得溶液的空气氧化 催化剂。 解聚天然橡胶可以提供与普通硫化橡胶相同的物理性能,对天然橡胶不产生气味或颜色特征,并且不会引起蛋白质引起的即时过敏。
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公开(公告)号:US5433724A
公开(公告)日:1995-07-18
申请号:US214663
申请日:1994-03-18
申请人: Atsuko Kawasaki , Takefumi Nakashita , Yoshiharu Inui , Shinichi Hori , Toshiaki Sakaki , Miyo Miki
发明人: Atsuko Kawasaki , Takefumi Nakashita , Yoshiharu Inui , Shinichi Hori , Toshiaki Sakaki , Miyo Miki
IPC分类号: A61B17/132 , A61B17/135 , A61B17/12
CPC分类号: A61B17/1325 , A61B17/135
摘要: A compressive hemostatic belt which is easily operable and thrown away after use, incorporates a strip (1) in the form of a nonstretch or low-stretch textile fabric, and a bag (5) expansible by being filled with fluid that is attached to the strip at a predetermined position by an attaching device. A pump (8) and a pressure gauge (9) are connected to the bag (5) attached at the predetermined position on the strip (1), so that the bag is expanded by operating the pump so as to fill the bag (5) with a suitable fluid while watching the pressure gauge (9). The bag thus presses down on an area (A) where bleeding is to be stopped.
摘要翻译: 一种在使用后容易操作和丢弃的压缩止血带,包括无拉伸或低伸缩纺织织物形式的条带(1)和通过填充流体的可膨胀的袋(5) 通过附接装置在预定位置处剥离。 将泵(8)和压力表(9)连接到附接在条带(1)上的预定位置处的袋(5),使得袋通过操作泵而膨胀以便将袋(5) ),同时观察压力表(9)。 因此,该袋因此压在要停止渗血的区域(A)上。
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公开(公告)号:US08228426B2
公开(公告)日:2012-07-24
申请号:US12511099
申请日:2009-07-29
IPC分类号: H04N5/225 , H01L21/00 , H01L31/062
CPC分类号: H04N5/2257 , H01L23/481 , H01L27/14618 , H01L27/14625 , H01L2224/02372 , H01L2224/0392 , H01L2224/0401 , H01L2224/05 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor package includes a solid-state imaging element, electrode pad, through-hole electrode, and light-transmitting substrate. The solid-state imaging element is formed on the first main surface of a semiconductor substrate. The electrode pad is formed on the first main surface of the semiconductor substrate. The through-hole electrode is formed to extend through the semiconductor substrate between the first main surface and a second main surface opposite to the electrode pad formed on the first main surface. The light-transmitting substrate is placed on a patterned adhesive to form a hollow on the solid-state imaging element. The thickness of the semiconductor substrate below the hollow when viewed from the light-transmitting substrate is larger than that of the semiconductor substrate below the adhesive.
摘要翻译: 半导体封装包括固态成像元件,电极焊盘,通孔电极和透光衬底。 固态成像元件形成在半导体衬底的第一主表面上。 电极焊盘形成在半导体衬底的第一主表面上。 通孔电极形成为在第一主表面和与形成在第一主表面上的电极焊盘相对的第二主表面之间延伸穿过半导体衬底。 将透光基板放置在图案化的粘合剂上以在固态成像元件上形成中空。 从透光性基板观察时,半导体衬底在中空部下方的厚度大于粘合剂下方的半导体衬底的厚度。
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公开(公告)号:US20090284631A1
公开(公告)日:2009-11-19
申请号:US12511099
申请日:2009-07-29
IPC分类号: H04N5/225 , H01L31/0232
CPC分类号: H04N5/2257 , H01L23/481 , H01L27/14618 , H01L27/14625 , H01L2224/02372 , H01L2224/0392 , H01L2224/0401 , H01L2224/05 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor package includes a solid-state imaging element, electrode pad, through-hole electrode, and light-transmitting substrate. The solid-state imaging element is formed on the first main surface of a semiconductor substrate. The electrode pad is formed on the first main surface of the semiconductor substrate. The through-hole electrode is formed to extend through the semiconductor substrate between the first main surface and a second main surface opposite to the electrode pad formed on the first main surface. The light-transmitting substrate is placed on a patterned adhesive to form a hollow on the solid-state imaging element. The thickness of the semiconductor substrate below the hollow when viewed from the light-transmitting substrate is larger than that of the semiconductor substrate below the adhesive.
摘要翻译: 半导体封装包括固态成像元件,电极焊盘,通孔电极和透光衬底。 固态成像元件形成在半导体衬底的第一主表面上。 电极焊盘形成在半导体衬底的第一主表面上。 通孔电极形成为在第一主表面和与形成在第一主表面上的电极焊盘相对的第二主表面之间延伸穿过半导体衬底。 将透光基板放置在图案化的粘合剂上以在固态成像元件上形成中空。 从透光性基板观察时,半导体衬底在中空部下方的厚度大于粘合剂下方的半导体衬底的厚度。
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35.
公开(公告)号:US07060559B2
公开(公告)日:2006-06-13
申请号:US10352083
申请日:2003-01-28
申请人: Yoshio Ozawa , Katsuhiko Hieda , Atsuko Kawasaki
发明人: Yoshio Ozawa , Katsuhiko Hieda , Atsuko Kawasaki
IPC分类号: H01L21/336 , H01L21/76
CPC分类号: H01L29/66825 , H01L21/28273 , H01L29/42324
摘要: In a method of manufacturing a semiconductor device having a nonvolatile semiconductor memory element with a two-layered gate structure in which a floating gate and control gate are stacked, a polysilicon layer serving as the floating gate is stacked on a silicon substrate via a tunnel insulating film. Then, the silicon layer, tunnel insulating film, and substrate are selectively etched to form an element isolation trench. A nitride film is formed on the sidewall surface of the silicon layer exposed into the element isolation trench. An oxide film is buried in the element isolation trench. A conductive film serving as the control gate is stacked on the oxide film and silicon layer via an electrode insulating film. The conductive film, electrode insulating film, and silicon layer are selectively etched to form the control gate and floating gate.
摘要翻译: 在制造半导体器件的方法中,该半导体器件具有堆叠浮置栅极和控制栅极的双层栅极结构的非易失性半导体存储元件,用作浮置栅极的多晶硅层通过隧道绝缘层叠在硅衬底上 电影。 然后,选择性地蚀刻硅层,隧道绝缘膜和衬底以形成元件隔离沟槽。 在露出到元件隔离沟槽中的硅层的侧壁表面上形成氮化物膜。 氧化膜被埋在元件隔离槽中。 用作控制栅极的导电膜通过电极绝缘膜堆叠在氧化膜和硅层上。 选择性地蚀刻导电膜,电极绝缘膜和硅层以形成控制栅极和浮动栅极。
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公开(公告)号:US5464420A
公开(公告)日:1995-11-07
申请号:US206255
申请日:1994-03-07
申请人: Shinichi Hori , Atsuko Kawasaki , Takefumi Nakashita , Yoshiharu Inui , Toshiaki Sakaki , Miyo Miki
发明人: Shinichi Hori , Atsuko Kawasaki , Takefumi Nakashita , Yoshiharu Inui , Toshiaki Sakaki , Miyo Miki
IPC分类号: A61B17/132 , A61B17/135 , A61B17/00
CPC分类号: A61B17/1325 , A61B17/135
摘要: The invention presents a compressive hemostatic belt which is easy to handle and is disposable. A balloon 5 inflatable by filling with fluid is mounted on a specific position of a strip 1 made of non-elastic or low-elastic fiber cloth or the like through mounting means, and a pump 8 and a pressure gauge 9 are connected to the balloon 5 through a check valve 6. The balloon 5 is filled with a fluid by manipulating the pump 8 while observing the pressure gauge 9 to inflate the balloon 5, so that only the area where bleeding is to be stopped is put under pressure. Since the balloon 5 is inflated only on the specified area, a piece of hard material 4 may be placed between the balloon 5 and the strip 1. A non-elastic reinforcing member 11 inserted on the opposite side of the balloon 5 can be varied, or the confronting portion of the strip 1 against the balloon 5 can be formed of a non-elastic reinforcing member stronger than the materials of other portions of the strip.
摘要翻译: 本发明提供一种易于处理并且是一次性的压缩止血带。 通过填充流体而充气的球囊5通过安装装置安装在由非弹性或低弹性纤维布等制成的带材1的特定位置,泵8和压力计9连接到球囊 通过操作泵8,同时观察压力计9使气囊5膨胀,从而仅使止血区域处于压力下,从而填充流体。 由于球囊5仅在指定区域上膨胀,所以可以将一块硬质材料4放置在球囊5与条带1之间。插入在球囊5的相对侧上的非弹性加强构件11可以变化, 或者条带1相对于气囊5的相对部分可以由比带材的其它部分的材料更强的非弹性加强构件形成。
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