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公开(公告)号：US12278220B2
公开(公告)日：2025-04-15
申请号：US17769825
申请日：2021-06-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xinhong Lu , Xiaoyan Zhu , Chao Liu , Shuilang Dong , Jiushi Wang , Liuqing Li
IPC: H01L25/075 , H01L25/16 , H01L33/62
Abstract: A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.
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公开(公告)号：US12230665B2
公开(公告)日：2025-02-18
申请号：US17264036
申请日：2020-06-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke Meng , Qiangwei Cui , Chao Liu , Lili Wang , Chuhang Wang , Yutian Chu , Linhui Gong
Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region; a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, in the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
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公开(公告)号：US12095011B2
公开(公告)日：2024-09-17
申请号：US17434712
申请日：2021-01-04
Inventor： Enkai Dong , Haiwei Sun , Pei Li , Ming Zhai , Jian Sang , Lu Yu , Chao Liu
CPC classification number: H01L33/46 , H01L25/0753 , H01L33/56 , H01L33/58 , H01L33/62
Abstract: A display substrate includes a base substrate, a plurality of light-emitting units, a protecting layer and a connecting line. The base substrate is a transparent substrate, and the plurality of light-emitting units, the protecting layer and the connecting line are laminated in sequence along a direction distal from the base substrate. A via is arranged in the protecting layer, one end of the connecting line is connected to the plurality of light-emitting units through the via, and the other end of the connecting line is configured to connect to a driving circuit of a display apparatus.
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公开(公告)号：US12033882B2
公开(公告)日：2024-07-09
申请号：US17295036
申请日：2020-05-09
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Lili Wang , Chuhang Wang , Chao Liu , Qiangwei Cui , Ke Meng , Linhui Gong
IPC: H01L21/683 , H01L25/075 , H01L33/62
CPC classification number: H01L21/6835 , H01L25/0753 , H01L33/62 , H01L2221/68354 , H01L2221/68368 , H01L2933/0066
Abstract: A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.
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公开(公告)号：US20230229196A1
公开(公告)日：2023-07-20
申请号：US17924526
申请日：2021-05-12
Inventor： Ming Li , Lin Xiong , Yuliang Wang , Jun Wang , Xu Zhao , Shenghua Bai , Jie Li , Xing Zou , Fanyou Li , Mu Zeng , Chao Liu , Miao Wang , Jie Tu , Zhoujun Chen , Guifang He , Chunrong Lai
IPC: G06F1/16
CPC classification number: G06F1/1656 , G06F1/1616
Abstract: The display module (100) includes: a supporting member (2) and a display panel (2), supporting member (1) includes an interlayer part (11) and a supporting part (12), the surface of the side of the supporting part (12) that is away from the interlayer part (11) is a supporting curved face (121), the supporting curved face (121) protrudes in the direction away from the interlayer part (11), the display panel (2) includes a non-bending part (21), a bending part (22) and a connecting part (23), the non-bending part (21) and the connecting part (23) are located on the two sides of the interlayer part (11) in the thickness direction of the interlayer part (11), the bending part (22) supports the side of the supporting part (12) that is away from the interlayer part (11), and the inner surface of the bending part (22) adheres to the supporting curved face (121).
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Patent Agency Ranking
公开(公告)号：US20220314598A1
公开(公告)日：2022-10-06
申请号：US17310292
申请日：2021-01-12
Inventor： Linhui Gong , Chao Liu , Qiangwei Cui , Ke Meng , Haiwei Sun
IPC: B41F16/00
Abstract: Disclosed are a pattern transfer apparatus and a pattern transfer method. The pattern transfer method includes: transferring a pattern to a flexible printing substrate; and transferring the pattern on the printing substrate to a bending surface of a rigid carrier through an elastic rubber head.
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公开(公告)号：US20210398955A1
公开(公告)日：2021-12-23
申请号：US17281872
申请日：2020-02-21
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chao Liu , Zhongbao Wu , Gongtao Zhang , Haiwei Sun , Xue Dong
IPC: H01L25/075 , H01L33/60 , H01L33/62
Abstract: An array substrate is provided. In the array substrate, an organic material layer includes a first planar portion, a bending portion and a second planar portion which are connected in sequence. The first planar portion and the second planar portion are disposed on both sides of a base substrate. A lead structure includes a first lead portion, a bent lead portion and a second lead portion which are connected in sequence, wherein the first lead portion is disposed outside the first plane portion, the bent lead portion is disposed outside the bending portion, and the second lead portion is disposed outside the second plane portion. An LED layer and a control circuit are respectively disposed on the both sides of the base substrates.
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公开(公告)号：US20210088828A1
公开(公告)日：2021-03-25
申请号：US16893472
申请日：2020-06-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Qiangwei Cui , Lili Wang , Ke Meng , Chao Liu , Chuhang Wang , Linhui Gong , Zhaohui Li , Donghui Wang
IPC: G02F1/1333 , H01L23/00 , H01L51/00 , H01L27/32 , G02F1/1335 , G02F1/1362
Abstract: The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
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39.发明申请公开(公告)号：US20170122992A1
公开(公告)日：2017-05-04
申请号：US15105594
申请日：2015-09-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yujun Zhang , Chao Liu
IPC: G01R27/26
CPC classification number: G01R27/2617 , G01D5/24 , G01D5/2405 , G01R27/2605 , G02F1/1309
Abstract: A film structure includes a first metal layer, a second metal layer, and an insulation layer located between the first metal layer and the second metal layer. In at least a portion of an edge region of the film structure, the first metal layer extends outwards relative to an edge of the insulation layer by a first predetermined length, and the insulation layer extends outwards relative to an edge of the second metal layer by a second predetermined length. In this way, when the film structure is measured, a fall value between the surface, adjacent to the second metal layer, of the insulation layer and the surface, adjacent to the insulation layer, of the first metal layer is measured by means of a motion trajectory of the measuring probe at the time of ascending or descending, thereby obtaining a more accurate thickness value of the insulation layer.
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40.发明授权公开(公告)号：US09256105B2
公开(公告)日：2016-02-09
申请号：US13877504
申请日：2012-10-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Dejiang Zhao , Yujun Zhang , Chao Liu , Zhongyuan Sun
IPC: G02F1/1333 , G02F1/1339 , G02F1/1341 , B23B27/00 , B32B17/06 , H01J9/24 , H01J9/26 , H01J9/32
CPC classification number: G02F1/1339 , B23B27/00 , B32B17/06 , B32B27/00 , G02F1/133305 , G02F1/1341
Abstract: Embodiments of the present invention disclose a bended liquid crystal display and a manufacturing method and apparatus therefore. The method comprises: preparing an array substrate and a color filter substrate with flat glass sheets having different thermal expansion coefficients; applying adhesive sealant at edges of surfaces of the array substrate and/or the color filter substrate; heating the array substrate and the color filter substrate, and binding the expanded array substrate and color filter substrate together, to form an assembled substrate; and cooling the assembled substrate and forming a bended assembled substrate having a degree of curvature. The bended liquid crystal display has a better stability, and has no variation in its degree of curvature over service time.
Abstract translation: 本发明的实施例公开了一种弯曲液晶显示器及其制造方法和装置。 该方法包括：准备具有不同热膨胀系数的平板玻璃板的阵列基板和滤色器基板; 在阵列基板和/或滤色器基板的表面的边缘处施加粘合剂密封剂; 加热阵列基板和滤色器基板，并将扩展的阵列基板和滤色器基板结合在一起，以形成组装的基板; 并冷却组装的基板并形成具有曲率程度的弯曲组装的基板。 弯曲的液晶显示器具有更好的稳定性，并且在使用时间上的曲率程度没有变化。
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