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公开(公告)号：US11276674B2
公开(公告)日：2022-03-15
申请号：US16862934
申请日：2020-04-30
Inventor： Ke Meng , Chao Liu , Qiangwei Cui , Chuhang Wang , Lili Wang , Linhui Gong , Yutian Chu , Fan Yang
IPC: H01L27/118 , H01L25/075 , H01L27/12 , H01L33/62
Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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公开(公告)号：US12230665B2
公开(公告)日：2025-02-18
申请号：US17264036
申请日：2020-06-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke Meng , Qiangwei Cui , Chao Liu , Lili Wang , Chuhang Wang , Yutian Chu , Linhui Gong
Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region; a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, in the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
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公开(公告)号：US20240339575A1
公开(公告)日：2024-10-10
申请号：US18293834
申请日：2022-11-30
Inventor： Yuanda Lu , Junjie Ma , Yuanhao Sun , Jiawei Zhao , Zhijun Xiong , Xueqiao Li , Shanwei Yang , Yutian Chu , Linxia Qi
CPC classification number: H01L33/62 , H01L27/156 , H01L33/005 , H01L33/10 , H01L33/387
Abstract: A light emitting diode chip, including at least two light emitting structures spaced apart and sequentially connected in series on a base substrate. At least one of the light emitting structures includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first insulation layer, a current spreading layer and a first electrode stacked in sequence. The at least one light emitting structure includes a first via hole in the first insulation layer, the first electrode is electrically connected to the current spreading layer, and the current spreading layer is electrically connected to the second semiconductor layer through the first via hole. An orthographic projection of the first via hole on the base substrate falls within that of the current spreading layer, and the orthographic projection of the current spreading layer on the base substrate falls within that of the second semiconductor layer.
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公开(公告)号：US20240282737A1
公开(公告)日：2024-08-22
申请号：US18570074
申请日：2021-06-22
Inventor： Liang Sun , Yutian Chu
IPC: H01L23/00 , B23K35/36 , B23K35/362 , H01L25/075 , H01L33/62
CPC classification number: H01L24/13 , B23K35/3613 , B23K35/362 , H01L24/16 , H01L24/81 , H01L24/95 , H01L25/0753 , H01L33/62 , H01L2224/1132 , H01L2224/1145 , H01L2224/1329 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13347 , H01L2224/16238 , H01L2224/81005 , H01L2224/81192 , H01L2224/81815 , H01L2224/95001 , H01L2924/0132 , H01L2924/0133 , H01L2933/0066
Abstract: The present disclosure provides a flux, a substrate, a manufacturing method thereof, and a device. The flux includes a bulk material and a powdery conductive material mixed in the bulk material, and a volume ratio of the conductive material to the flux is 5% to 10%.
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