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    Compounds, monomers, and polymers based on perfluoroalkyl and perfluoroalkyl-aryl dioxapentacene
    32.
    发明授权
    Compounds, monomers, and polymers based on perfluoroalkyl and perfluoroalkyl-aryl dioxapentacene 失效
    化合物，单体和聚合物基于全氟代甲基和全氟代苄基二氧化物

    公开(公告)号：US5189138A

    公开(公告)日：1993-02-23

    申请号：US661595

    申请日：1991-02-20

    申请人： Swiatoslaw Trofimenko ,  Brian C. Auman

    发明人： Swiatoslaw Trofimenko ,  Brian C. Auman

    IPC分类号： C07D491/22 ,  C07D493/04 ,  C07D493/22 ,  C08G73/10

    CPC分类号： C07D493/04

    摘要： Rigid fluorine-containing compounds, monomers, and polymers based on pentacyclic core systems, such as 12H,14H-5, 7-dioxapentacene with perfluoroalkyl and/or aryl groups in the 12, 14 positions, and 5H,12H-7, 14-dioxapentacene, with perfluoroalkyl and/or aryl groups in the 5,12 positions. These monomers have utility in the preparation of advanced high-performance polymers, particularly polyimides. The rigid pentacyclic core decreases the coefficient of thermal expansion of the polymers, while the fluorinated substituents improve the dielectric constant and water absorption properties. Each monomer unit contains within its pentacyclic core two-O-bridges, and two --CRR.sub.f bridges (where R is aryl, substituted aryl or perfluoroalkyl, and R.sub.f is perfluoroalkyl).

    Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
    37.
    发明申请
    Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto 有权
    用于光学类型应用的低色聚酰亚胺组合物和与其相关的方法和组合物

    公开(公告)号：US20080138537A1

    公开(公告)日：2008-06-12

    申请号：US11195902

    申请日：2005-08-03

    申请人： Christopher Dennis Simone ,  Brian C. Auman ,  Peter Francis Carcia ,  Richard A. Wessel

    发明人： Christopher Dennis Simone ,  Brian C. Auman ,  Peter Francis Carcia ,  Richard A. Wessel

    IPC分类号： C09K19/00 ,  C08G73/10 ,  C08K3/32 ,  B32B9/04 ,  C08K3/22

    CPC分类号： C08G73/1039 ,  B32B27/00 ,  C08G73/1042 ,  C08L79/08 ,  Y10T428/10 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31721

    摘要： Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BDPA) and 2,2′-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between −5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g., cellular phones, personal digital assistants, portable video games, laptops, and the like).

    摘要翻译： 公开了全氟化聚酰亚胺（和共聚酰亚胺）组合物，特别是膜，其包含至少50摩尔％的衍生自3,3'，4,4'-联苯四羧酸二酐（BDPA）和2,2'- 双（三氟甲基）联苯胺（TFMB）单体。 本发明的全氟化聚酰亚胺（和共聚酰亚胺）膜的面内热膨胀系数（CTE）为-5〜+ 20ppm /℃，平均透光率为约65.0〜99.0（ 基于75微米厚的膜）。 使用化学转化法代替通常使用的热转化步骤将本发明的膜转化为聚酰亚胺，从而产生这些所需的性质。 本发明的膜可以是光学显示装置中的优异的基板，并且可以用于替代刚性玻璃基板。 最后，本发明的聚酰亚胺膜也可以用于制造柔性显示装置（例如，蜂窝电话，个人数字助理，便携式视频游戏，笔记本电脑等）。

    Photosensitive resin composition, patterning method, and electronic components
    39.
    发明授权
    Photosensitive resin composition, patterning method, and electronic components 失效
    感光树脂组合物，图案化方法和电子部件

    公开(公告)号：US06773866B2

    公开(公告)日：2004-08-10

    申请号：US10012462

    申请日：2001-12-12

    申请人： Akihiro Sasaki ,  Noriyoshi Arai ,  Makoto Kaji ,  Toshiki Hagiwara ,  Brian C. Auman

    发明人： Akihiro Sasaki ,  Noriyoshi Arai ,  Makoto Kaji ,  Toshiki Hagiwara ,  Brian C. Auman

    IPC分类号： G03C556

    CPC分类号： C08G73/10 ,  G03F7/038 ,  G03F7/0387 ,  H05K3/4676

    摘要： A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

    摘要翻译： 一种包含芳族聚酰亚胺前体的感光性树脂组合物，其中通过在硅衬底上酰胺化闭环制得的35μm膜具有至少1％的波长365nm的光透射率和至多25MPa的残余应力。 组合物可以通过i线曝光进行图案化，然后用碱性溶液显影，并且可以被酰亚胺化成低应力聚酰亚胺图案。 具有聚酰亚胺图案的电子元件具有高可靠性。

    Photosensitive resin composition, patterning method, and electronic components
    40.
    发明授权
    Photosensitive resin composition, patterning method, and electronic components 有权
    感光树脂组合物，图案化方法和电子部件

    公开(公告)号：US06342333B1

    公开(公告)日：2002-01-29

    申请号：US09401196

    申请日：1999-09-23

    申请人： Akihiro Sasaki ,  Noriyoshi Arai ,  Makoto Kaji ,  Toshiki Hagiwara ,  Brian C. Auman

    发明人： Akihiro Sasaki ,  Noriyoshi Arai ,  Makoto Kaji ,  Toshiki Hagiwara ,  Brian C. Auman

    IPC分类号： G03C152

    CPC分类号： C08G73/10 ,  G03F7/038 ,  G03F7/0387 ,  H05K3/4676

    摘要： A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

    摘要翻译： 一种包含芳族聚酰亚胺前体的感光性树脂组合物，其中10μm厚的前体层具有至少1％的365nm波长的透光率和10μm厚的聚酰亚胺膜，该树脂组合物通过酰亚胺化闭合和沉积 在硅衬底上导致至多25MPa的残余应力。 组合物可以通过i线曝光进行图案化，然后用碱性溶液显影，并且可以被酰亚胺化成低应力聚酰亚胺图案。 具有聚酰亚胺图案的电子元件具有高可靠性。