Integrated interoperable tools system and method for test delivery
    32.
    发明授权
    Integrated interoperable tools system and method for test delivery 有权
    集成的可互操作的工具系统和测试方法

    公开(公告)号:US08303309B2

    公开(公告)日:2012-11-06

    申请号:US12172027

    申请日:2008-07-11

    IPC分类号: G09B21/00

    CPC分类号: G09B7/06 G09B19/00 G09B21/00

    摘要: In an exemplary embodiment, a computer-implemented method for implementing a test delivery system is provided. The method includes implementing a plurality of interoperable accommodation and accessibility tools, and providing an interface to the test with the plurality of interoperable accommodation and accessibility tools provided on the interface. The method also includes receiving one or more tool settings for a test-taker specifying one or more permitted tools in the plurality of interoperable accommodation and accessibility tools, and customizing the interface based on the one or more tool settings to allow the test-taker access to the one or more permitted tools during the test. The method further includes allowing the test-taker to activate or deactivate each of the one or more permitted tools.

    摘要翻译: 在示例性实施例中,提供了一种用于实现测试传递系统的计算机实现的方法。 该方法包括实现多个可互操作的住宿和可访问性工具,并且提供与在界面上提供的多个可互操作的住宿和可访问性工具的测试接口。 该方法还包括接收用于指定多个可互操作的住宿和可访问性工具中的一个或多个允许的工具的测试者的一个或多个工具设置,以及基于一个或多个工具设置定制接口以允许测试者访问 在测试期间一个或多个允许的工具。 该方法还包括允许测试者激活或去激活一个或多个允许的工具中的每一个。

    Method for producing deep trench structures
    34.
    发明授权
    Method for producing deep trench structures 失效
    深沟槽结构的生产方法

    公开(公告)号:US07851326B2

    公开(公告)日:2010-12-14

    申请号:US11812386

    申请日:2007-06-18

    IPC分类号: H01L21/76

    CPC分类号: H01L21/76224

    摘要: A method for producing deep trench structures in an STI structure of a semiconductor substrate is provided, with the following successive process steps: subsequent to a full-area filling of STI recesses introduced into a semiconductor substrate with a first filler material, a first surface of a semiconductor structure is subjected to a CMP process to level the applied filler material and produce the STI structure; the leveled STI structure thus produced is structured; using the structured, leveled STI structure as a hard mask, at least one deep trench is etched in the area of this STI structure to create the deep trench structures.

    摘要翻译: 提供一种用于在半导体衬底的STI结构中制造深沟槽结构的方法,具有以下连续的工艺步骤:在用第一填充材料引入到半导体衬底中的STI凹部的全面填充之后, 对半导体结构进行CMP处理以对施加的填充材料进行平整并产生STI结构; 这样生产的水平STI结构是结构化的; 使用结构化的水平STI结构作为硬掩模,在该STI结构的区域中蚀刻至少一个深沟槽以产生深沟槽结构。

    METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT, USE OF A TRENCH STRUCTURE, AND SEMICONDUCTOR ARRANGEMENT
    35.
    发明申请
    METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT, USE OF A TRENCH STRUCTURE, AND SEMICONDUCTOR ARRANGEMENT 审中-公开
    制造半导体布置的方法,使用拉伸结构和半导体布置

    公开(公告)号:US20090057911A1

    公开(公告)日:2009-03-05

    申请号:US12203124

    申请日:2008-09-02

    IPC分类号: H01L21/768 H01L23/522

    摘要: A method for manufacturing a semiconductor arrangement, use of a trench structure, and a semiconductor arrangement is provided that includes a single-crystal semiconductor layer, a conductive substrate region and a buried insulator layer, which isolates the single-crystal semiconductor layer from the conductive substrate region, whereby the conductive substrate region is contacted. A trench structure is formed to separate the single-crystal semiconductor layer into a first semiconductor region outside the trench structure and a second semiconductor region within the trench structure, an opening is formed in the single-crystal semiconductor layer within the second semiconductor region, the buried insulator layer is removed within the opening, and a conductor, which contacts the conductive substrate region and adjoins the second semiconductor region, is introduced into the opening.

    摘要翻译: 提供一种制造半导体装置的方法,使用沟槽结构和半导体装置,其包括单晶半导体层,导电衬底区域和掩埋绝缘体层,其将单晶半导体层与导电 衬底区域,由此使导电衬底区域接触。 形成沟槽结构以将单晶半导体层分离成沟槽结构之外的第一半导体区域和沟槽结构内的第二半导体区域,在第二半导体区域内的单晶半导体层中形成开口, 在开口内去除埋入的绝缘体层,并且将与导电衬底区域接触并与第二半导体区域相邻接的导体引入到开口中。

    Device, Probe, and Method for the Galvanically Decoupled Transmission of a Measuring Signal
    36.
    发明申请
    Device, Probe, and Method for the Galvanically Decoupled Transmission of a Measuring Signal 有权
    测量信号的电流去耦传输的装置,探头和方法

    公开(公告)号:US20080290856A1

    公开(公告)日:2008-11-27

    申请号:US12158785

    申请日:2006-12-13

    IPC分类号: G08C17/00

    摘要: The invention relates to a device, a probe, and a method for the galvanically decoupling transmission of a measuring signal. A microwave signal is supplied by a transceiver (1) to a sensor (3) by means of a galvanically decoupled waveguide (2). The signal is partially reflected in the sensor (3), the amplitude, phase and/or polarization of the reflected microwave signal containing the information relating to the measuring value. The reflected microwave signal runs through the same waveguide (2) back to the transceiver (1) and is evaluated therein. The invention provides a more simple and economical structure than conventional devices of prior art, as a voltage supply is not required especially on the sensor side as a result of the reflection. In this way, the sensor (3) can also be produced in a very compact manner, minimizing the influence of the measuring signal through the sensor (3).

    摘要翻译: 本发明涉及一种用于测量信号的电流去耦传输的装置,探针和方法。 微波信号由收发器(1)通过电流去耦波导(2)提供给传感器(3)。 信号部分地反映在传感器(3)中,反射的微波信号的振幅,相位和/或极化包含与测量值有关的信息。 反射的微波信号通过相同的波导(2)返回到收发器(1)并在其中进行评估。 本发明提供比现有技术的传统装置更简单和经济的结构,因为作为反射的结果,特别是传感器侧不需要电压源。 以这种方式,也可以以非常紧凑的方式制造传感器(3),从而最小化通过传感器(3)的测量信号的影响。

    Method for Fabricating a Semiconductor Element, and Semiconductor Element
    37.
    发明申请
    Method for Fabricating a Semiconductor Element, and Semiconductor Element 有权
    半导体元件的制造方法以及半导体元件

    公开(公告)号:US20080290425A1

    公开(公告)日:2008-11-27

    申请号:US12119972

    申请日:2008-05-13

    摘要: In a method for fabricating a semiconductor element in a substrate, first implantation ions are implanted into the substrate, whereby micro-cavities are produced in a first partial region of the substrate. Furthermore, pre-amorphization ions are implanted into the substrate, whereby a second partial region of the substrate is at least partly amorphized, and whereby crystal defects are produced in the substrate. Furthermore, second implantation ions are implanted into the second partial region of the substrate. Furthermore, the substrate is heated, such that at least some of the crystal defects are eliminated using the second implantation ions. Furthermore, dopant atoms are implanted into the second partial region of the substrate, wherein the semiconductor element is formed using the dopant atoms.

    摘要翻译: 在衬底中制造半导体元件的方法中,将第一注入离子注入到衬底中,从而在衬底的第一部分区域中产生微腔。 此外,将非晶化离子注入到基板中,由此基板的第二部分区域至少部分非晶化,并且由此在基板中产生晶体缺陷。 此外,第二注入离子注入基片的第二部分区域。 此外,加热衬底,使得使用第二注入离子去除至少一些晶体缺陷。 此外,掺杂剂原子被注入到衬底的第二部分区域中,其中使用掺杂剂原子形成半导体元件。

    SYSTEM AND METHOD FOR INITIATING RETURNS OVER A NETWORK
    38.
    发明申请
    SYSTEM AND METHOD FOR INITIATING RETURNS OVER A NETWORK 有权
    用于在网络上启动退货的系统和方法

    公开(公告)号:US20070282705A1

    公开(公告)日:2007-12-06

    申请号:US11828864

    申请日:2007-07-26

    IPC分类号: G06Q30/00

    摘要: The present invention provides systems and methods for processing return transactions over a network. An embodiment of the invention discloses an online return application that generates an electronic return shipping label that can be delivered to a browser of a customer that wishes to make a return. Also, disclosed is the creation and transmission of label delivery links, which provide for dynamic generation and delivery of shipping labels.

    摘要翻译: 本发明提供了通过网络处理返回事务的系统和方法。 本发明的实施例公开了一种在线返回应用程序,其生成可以被递送到希望返回的客户的浏览器的电子退货运输标签。 此外,披露的是标签传送链接的创建和传输,其提供运输标签的动态生成和传递。