摘要:
The synchronization circuit of the preferred embodiment is a T flip flop which has a first output which changes state on the leading edge of the clock signal, and a second output which changes state on the trailing edge of the clock signal. The T flip flop has an exclusive OR gate input in which the T input is combined with the first output. The output of the exclusive OR is coupled to an internal node when the clock signal is at a first logic state, and isolated from the internal node when the clock signal is at a second logic state. The internal node is coupled to the first output when the clock signal is at the second logic sate and isolated from the internal node when the clock signal is at the first logic state. The first output signal is coupled to the second output signal when the clock signal is at the first logic state, and isolated from the second output terminal when the clock signal is at the second logic state.
摘要:
An integrated circuit includes an output pad, an alarm output pad, and a test mode output pad. A first multi-bit register is programmable to store programmable data such as data that identifies a customer for whom the integrated circuit has been manufactured. A second multi-bit register is programmable to store customer specified threshold data. A first circuit selectively couples the first and second multi-bit registers to the output pad. The first circuit is operable responsive to the integrated circuit being placed into a test mode to perform parallel-to-serial conversion of either the customer identification data stored in the first multi-bit register or the customer specified threshold data stored in the second multi-bit register and drive the converted data for output through the output pad. The integrated circuit further includes a tamper detection circuit operable responsive to the customer specified threshold data to generate a tamper alarm signal. A second circuit selectively couples the tamper alarm signal to the alarm output pad and test mode output pad depending on whether the integrated circuit is in a test mode. More specifically, the second circuit operates to drive the alarm output pad with the tamper alarm signal when the integrated circuit is not in test mode and drive the test mode output pad with the tamper alarm signal when the integrated circuit is in test mode (with the alarm output pad driven to a known state).
摘要:
A digital-to-analog converter, in response to a digital signal, selectively taps a resistor string to generate an analog output and selectively shunts around resistors in the string to voltage shift the analog output. If two supply voltage sets are present, two strings are provided. A mutually exclusively selection of outputs is made to select a source of the analog output. An integrated circuit temperature sensor uses the converter and includes a sensing circuit that determines exposure to one of a relatively low or high temperature. A measured voltage across the base-emitter of a bipolar transistor is selected in low temperature exposure and compared against a first reference for a too cold temperature condition. Alternatively, a measured delta voltage across the base-emitter is selected in high temperature exposure and compared against a second reference voltage for a too hot temperature condition. Through the comparisons, a temperature exposure detection is made.
摘要:
A memory circuit has a high voltage and low voltage supply nodes. One of a first and second sets of voltages is selectively applied to the supply nodes of the memory circuit in dependence upon memory operational mode. If in active read/write mode, then the first set of voltages is selectively applied. Conversely, if in standby no-read/no-write mode, then the second set of voltages is selectively applied. A low voltage in the second set of voltages is greater than a low voltage in the first set of voltages by a selected one of a plurality of low offset voltages, and a high voltage in the second set of voltages is less than a high voltage in the first set of voltages by a selected one of a plurality of high offset voltages. The offset voltages are provided by diode-based circuits that are selectively active. Selective activation is provided by either selectably blowable fuse elements or selectively activated switching elements.
摘要:
A sensing circuit determines whether an integrated circuit is currently exposed to one of a relatively low or a relatively high temperature. A selection circuit selects a measured voltage across the base-emitter of a bipolar transistor if the sensing circuit indicates that the circuit is exposed to the relatively low temperature or, alternatively, selects a measured delta voltage across the base-emitter of the bipolar transistor if the sensing circuit indicates that the circuit is exposed to the relatively high temperature. A comparator compares the selected measured voltage against a first reference voltage indicative of a too cold temperature condition or compares the selected measured delta voltage against a second reference voltage indicative of a too hot temperature condition. As a result of the comparison, detection may be made as to whether the integrated circuit is currently exposed to a too cold or too hot temperature.
摘要:
A test circuit and method are disclosed for testing memory cells of a ferroelectric memory device having an array of ferroelectric memory cells. The test circuitry is coupled to the bit lines, for selectively determining the voltage levels appearing on the bit lines based on a measured current level and providing externally to the ferroelectric memory device an electrical signal representative of the sensed voltage levels. In this way, ferroelectric memory cells exhibiting degraded performance may be identified.
摘要:
A memory device having a first and a second memory section, the first and the second memory sections being coupled to bit lines. The second memory section may include at least one fuse. The first memory section includes a volatile memory and the second memory section includes a non-volatile memory. The volatile memory may be static or dynamic random access memory. The memory device may further include a control circuit connected to the at least one fuse to provide for prelaser testing.
摘要:
A memory-row selector includes an address input terminal, a mode terminal, and even-row-select and odd-row-select terminals. While a test signal level occupies the mode terminal (ie., during a test mode), the selector places either an active level or an inactive level on both of the even-row-select and odd-row-select terminals. An active level on both of the select terminals enables both even-row and odd-row word lines, and allows writing to or reading from memory cells in both odd and even rows. An inactive level on both of the select terminals disables both even-row and odd-row word lines, including the word line coupled to the addressed memory cell.
摘要:
A circuit and method for determining the exact time at which data begins to be written to a memory cell. A write sensing circuit is connected to a data input line. When data is presented on the data input line for writing to the memory cell, the write sensing circuit outputs a write start signal indicating that data is being presented to memory cells for writing. The actual start time of a write to a memory cell is therefore accurately timed based on the start of the write to the memory cell itself. This provides the advantage that the change in state of the data is directly sensed as the factor for measuring the start time of a write to a memory cell. The data can be sensed either directly from the bit lines or, alternatively, from a write data bus.
摘要:
An integrated circuit is formed on a die that is formed as a detachable part of a semiconductor wafer. The wafer includes both a wafer test-mode path that is operable to carry a wafer test-mode signal and a wafer power-supply path that is operable to carry a wafer power-supply signal. The integrated circuit includes functional circuitry that supports normal and wafer-test modes of operation and that is coupled to the wafer test-mode path before the die is detached from the wafer. The functional circuitry is operable to function in the wafer test mode of operation when the wafer test-mode signal has a first state. The integrated circuit also includes a wafer test-mode power circuit that is coupled to the functional circuitry, and that is coupled to the wafer power-supply path and the wafer test-mode path before the die is detached from the wafer. The power circuit is operable to couple the wafer power-supply path to the functional circuitry when the wafer test-mode signal has the first state. When the wafer test-mode signal has a second state, the wafer test-mode power circuit is operable to uncouple the wafer power-supply path from the functional circuitry, and the functional circuitry is operable to function in the normal mode of operation.